JP5136573B2 - ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板 - Google Patents

ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板 Download PDF

Info

Publication number
JP5136573B2
JP5136573B2 JP2010039388A JP2010039388A JP5136573B2 JP 5136573 B2 JP5136573 B2 JP 5136573B2 JP 2010039388 A JP2010039388 A JP 2010039388A JP 2010039388 A JP2010039388 A JP 2010039388A JP 5136573 B2 JP5136573 B2 JP 5136573B2
Authority
JP
Japan
Prior art keywords
resin
varnish
compound
epoxy resin
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010039388A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010235922A (ja
JP2010235922A5 (cg-RX-API-DMAC10.html
Inventor
高示 森田
曜 村井
伸 高根沢
康雄 井上
和永 坂井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2010039388A priority Critical patent/JP5136573B2/ja
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to SG2012060984A priority patent/SG183365A1/en
Priority to CN201510802437.1A priority patent/CN105254847B/zh
Priority to EP10846568.3A priority patent/EP2540754A4/en
Priority to US13/581,009 priority patent/US9265145B2/en
Priority to CN201080064778.9A priority patent/CN102770474B/zh
Priority to PCT/JP2010/063771 priority patent/WO2011104905A1/ja
Priority to KR1020187016219A priority patent/KR102017438B1/ko
Priority to CN201811330976.XA priority patent/CN109535926B/zh
Priority to KR1020127020893A priority patent/KR101868161B1/ko
Priority to TW107126912A priority patent/TWI714871B/zh
Priority to TW099127781A priority patent/TWI644939B/zh
Publication of JP2010235922A publication Critical patent/JP2010235922A/ja
Publication of JP2010235922A5 publication Critical patent/JP2010235922A5/ja
Application granted granted Critical
Publication of JP5136573B2 publication Critical patent/JP5136573B2/ja
Priority to US14/939,708 priority patent/US20160083614A1/en
Priority to US16/124,987 priority patent/US10465089B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022—Non-woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C09D161/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B32B2262/0269—Aromatic polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2861—Coated or impregnated synthetic organic fiber fabric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2926—Coated or impregnated inorganic fiber fabric
    • Y10T442/2951—Coating or impregnation contains epoxy polymer or copolymer or polyether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Textile Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
JP2010039388A 2009-02-24 2010-02-24 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板 Expired - Fee Related JP5136573B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2010039388A JP5136573B2 (ja) 2009-02-24 2010-02-24 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
KR1020127020893A KR101868161B1 (ko) 2010-02-24 2010-08-13 바니시, 프리프레그, 수지 부착 필름, 금속박장 적층판, 인쇄 배선판
EP10846568.3A EP2540754A4 (en) 2010-02-24 2010-08-13 Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
US13/581,009 US9265145B2 (en) 2009-02-24 2010-08-13 Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
CN201080064778.9A CN102770474B (zh) 2010-02-24 2010-08-13 清漆、预浸料片、含有树脂的膜、被覆金属箔的层叠板、印制电路布线板
PCT/JP2010/063771 WO2011104905A1 (ja) 2010-02-24 2010-08-13 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
KR1020187016219A KR102017438B1 (ko) 2009-02-24 2010-08-13 바니시, 프리프레그, 수지 부착 필름, 금속박장 적층판, 인쇄 배선판
CN201811330976.XA CN109535926B (zh) 2010-02-24 2010-08-13 清漆、预浸料片、含有树脂的膜、被覆金属箔的层叠板、印制电路布线板
SG2012060984A SG183365A1 (en) 2010-02-24 2010-08-13 Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
CN201510802437.1A CN105254847B (zh) 2010-02-24 2010-08-13 清漆、预浸料片、含有树脂的膜、被覆金属箔的层叠板、印制电路布线板
TW107126912A TWI714871B (zh) 2009-02-24 2010-08-19 清漆、預浸體、具樹脂薄膜、覆金屬箔層積板以及印刷電路板
TW099127781A TWI644939B (zh) 2010-02-24 2010-08-19 清漆、預浸體、具樹脂薄膜、覆金屬箔層積板以及印刷電路板
US14/939,708 US20160083614A1 (en) 2009-02-24 2015-11-12 Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
US16/124,987 US10465089B2 (en) 2009-02-24 2018-09-07 Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2009040729 2009-02-24
JP2009040729 2009-02-24
JP2009045800 2009-02-27
JP2009045800 2009-02-27
JP2009059362 2009-03-12
JP2009059362 2009-03-12
JP2010039388A JP5136573B2 (ja) 2009-02-24 2010-02-24 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012200926A Division JP5811974B2 (ja) 2009-02-24 2012-09-12 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板

Publications (3)

Publication Number Publication Date
JP2010235922A JP2010235922A (ja) 2010-10-21
JP2010235922A5 JP2010235922A5 (cg-RX-API-DMAC10.html) 2012-07-12
JP5136573B2 true JP5136573B2 (ja) 2013-02-06

Family

ID=43090544

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010039388A Expired - Fee Related JP5136573B2 (ja) 2009-02-24 2010-02-24 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
JP2012200926A Expired - Fee Related JP5811974B2 (ja) 2009-02-24 2012-09-12 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012200926A Expired - Fee Related JP5811974B2 (ja) 2009-02-24 2012-09-12 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板

Country Status (4)

Country Link
US (3) US9265145B2 (cg-RX-API-DMAC10.html)
JP (2) JP5136573B2 (cg-RX-API-DMAC10.html)
KR (1) KR102017438B1 (cg-RX-API-DMAC10.html)
TW (1) TWI714871B (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11142656B2 (en) * 2016-01-20 2021-10-12 Tyco Electronics (Shanghai) Co. Ltd. Electrophoretic coating and preparation method, electrophoretic coating process and selective plating process
CN105537090A (zh) * 2016-02-01 2016-05-04 深圳市宏宇辉科技有限公司 涂层铝片以及制造该涂层铝片的工艺流程
JPWO2019111416A1 (ja) * 2017-12-08 2020-12-10 昭和電工マテリアルズ株式会社 プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ
WO2019181402A1 (ja) * 2018-03-20 2019-09-26 東レ株式会社 プリプレグおよび繊維強化複合材料

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856276B2 (ja) * 1980-03-31 1983-12-14 日立化成工業株式会社 難燃耐熱性銅張り積層板の製造法
JPS6131244A (ja) 1984-07-23 1986-02-13 三菱瓦斯化学株式会社 エポキシ樹脂積層板の製法
JPS6198745A (ja) 1984-10-22 1986-05-17 Hitachi Chem Co Ltd 印刷配線板用プリプレグの製造方法
JP2993065B2 (ja) 1990-07-27 1999-12-20 三菱瓦斯化学株式会社 表面平滑金属箔張積層板
JPH0551436A (ja) 1991-08-26 1993-03-02 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH05239238A (ja) * 1991-08-26 1993-09-17 Matsushita Electric Works Ltd プリプレグの製造法及び該プリプレグを用いた積層板
JPH05239183A (ja) * 1992-02-28 1993-09-17 Nippon Chibagaigii Kk 熱硬化性樹脂
JP3141962B2 (ja) * 1992-06-23 2001-03-07 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
JPH07316267A (ja) * 1994-05-27 1995-12-05 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
JPH08134236A (ja) 1994-11-08 1996-05-28 Sumitomo Bakelite Co Ltd プリプレグの製造方法
JPH08134177A (ja) * 1994-11-10 1996-05-28 Hitachi Chem Co Ltd エポキシ樹脂プレポリマーの製造方法
JPH08134238A (ja) * 1994-11-10 1996-05-28 Hitachi Chem Co Ltd エポキシ樹脂プリプレグの製造方法
JPH11240940A (ja) 1998-02-24 1999-09-07 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP2000114727A (ja) 1998-10-09 2000-04-21 Ibiden Co Ltd 多層プリント配線板
JP2000243864A (ja) 1999-02-18 2000-09-08 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP2001049083A (ja) 1999-08-09 2001-02-20 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物、プリプレグ及び積層板
KR100721697B1 (ko) * 1999-12-13 2007-05-28 다우 글로벌 테크놀로지스 인크. 난연성 인 원소 함유 에폭시 수지 조성물
JP4651774B2 (ja) * 2000-04-11 2011-03-16 新日鐵化学株式会社 芳香族オリゴマー、それを配合したフェノール樹脂組成物並びにエポキシ樹脂組成物およびその硬化物
JP3964326B2 (ja) * 2000-09-20 2007-08-22 太陽インキ製造株式会社 カルボキシル基含有感光性樹脂、それを含有するアルカリ現像可能な光硬化性・熱硬化性組成物及びその硬化物
JP2002126619A (ja) * 2000-10-26 2002-05-08 Nippon Paint Co Ltd 多層塗膜形成方法及び多層塗膜
US7041399B2 (en) * 2000-12-14 2006-05-09 Hitachi Chemical Co., Ltd. Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg
JP3499836B2 (ja) 2001-03-13 2004-02-23 住友ベークライト株式会社 プリプレグ及びその製造方法
JP2002332451A (ja) * 2001-05-09 2002-11-22 Nippon Paint Co Ltd 長鎖アルキル硫酸エステル銅塩成分を含有するカチオン電着塗料組成物およびその製造方法
JP5131506B2 (ja) * 2001-06-27 2013-01-30 新日鉄住金化学株式会社 エポキシ樹脂
JP2003147051A (ja) * 2001-11-09 2003-05-21 Hitachi Chem Co Ltd 樹脂組成物及びその製造方法、並びにそれらを用いた印刷配線板用プリプレグ
JP2003147273A (ja) * 2001-11-12 2003-05-21 Sumitomo Chem Co Ltd 熱硬化性樹脂ワニスの製造方法
JP4334806B2 (ja) * 2002-03-05 2009-09-30 日本ペイント株式会社 多層塗膜形成方法および多層塗膜
JP2003277588A (ja) 2002-03-27 2003-10-02 Nec Corp 熱硬化性樹脂組成物及びこれを用いた積層板
JP2003277628A (ja) 2002-03-27 2003-10-02 Nec Corp 熱硬化性樹脂組成物および該組成物を用いてなる半導体装置
JP2003342352A (ja) * 2002-05-30 2003-12-03 Japan Epoxy Resin Kk エポキシ樹脂組成物
JP4144732B2 (ja) * 2002-05-30 2008-09-03 ジャパンエポキシレジン株式会社 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板
JP4037207B2 (ja) 2002-08-09 2008-01-23 信越化学工業株式会社 難燃性エポキシ樹脂組成物、並びにそれを使用する半導体封止材料及び樹脂封止型半導体装置
TWI306867B (en) * 2002-11-28 2009-03-01 Nippon Kayaku Kk Flame-retardant epoxy resin and its cured product
JP3946626B2 (ja) 2002-12-03 2007-07-18 住友ベークライト株式会社 樹脂組成物、プリプレグおよびそれを用いたプリント配線板
US20060205861A1 (en) 2003-07-16 2006-09-14 Glenn Gordon Coating compositions comprising epoxy resins and aminofunctional silicone resins
TW200512252A (en) 2003-08-05 2005-04-01 Kawamura Inst Chem Res Epoxy resin composition and manufacturing method of heat resisting laminated sheet
KR100866653B1 (ko) * 2004-06-29 2008-11-04 아사히 가세이 케미칼즈 가부시키가이샤 난연성 에폭시 수지 조성물
WO2006051864A1 (ja) * 2004-11-10 2006-05-18 Hitachi Chemical Co., Ltd. 接着補助剤付金属箔及びそれを用いたプリント配線板
WO2006059363A1 (ja) * 2004-11-30 2006-06-08 Matsushita Electric Works, Ltd. プリプレグ用エポキシ樹脂組成物およびプリプレグ、多層プリント配線板
JP2006266369A (ja) * 2005-03-23 2006-10-05 Tokai Rubber Ind Ltd 防振ゴムブッシュ
US20060280949A1 (en) * 2005-06-13 2006-12-14 Shinsuke Shirakawa Method for making amine-modified epoxy resin and cationic electrodeposition coating composition
JP5028756B2 (ja) 2005-06-24 2012-09-19 住友ベークライト株式会社 半導体封止用樹脂組成物および半導体装置
JP5044414B2 (ja) 2005-11-30 2012-10-10 パナソニック株式会社 ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板
TWI324168B (en) 2006-03-17 2010-05-01 Chang Chun Plastics Co Ltd Flame retarding thermoset epoxy resin composition
JP4926811B2 (ja) 2006-04-28 2012-05-09 日立化成工業株式会社 樹脂組成物、プリプレグ、積層板及び配線板
KR100804767B1 (ko) 2006-11-28 2008-02-19 마츠시다 덴코 가부시키가이샤 프리프레그용 에폭시 수지 조성물 및 프리프레그, 다층프린트 배선판
US20100096173A1 (en) 2007-02-23 2010-04-22 Kentaro Fujino Epoxy resin composition, prepreg, and laminate and printed wiring board
JP2008214427A (ja) 2007-03-01 2008-09-18 Shin Kobe Electric Mach Co Ltd 難燃性エポキシ樹脂組成物並びにプリプレグ、積層板及びプリント配線板
MY150705A (en) 2007-04-10 2014-02-28 Sumitomo Bakelite Co Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board
WO2009089145A1 (en) * 2008-01-08 2009-07-16 Dow Global Technologies Inc. High tg epoxy systems for composite application
JP5638002B2 (ja) * 2009-01-06 2014-12-10 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂及び前進プロセスのための金属安定剤
JP5712488B2 (ja) * 2009-02-27 2015-05-07 日立化成株式会社 絶縁性樹脂フィルム及びそれを用いた積層板、配線板

Also Published As

Publication number Publication date
US10465089B2 (en) 2019-11-05
US20160083614A1 (en) 2016-03-24
US20130008695A1 (en) 2013-01-10
JP5811974B2 (ja) 2015-11-11
JP2010235922A (ja) 2010-10-21
TWI714871B (zh) 2021-01-01
US9265145B2 (en) 2016-02-16
KR102017438B1 (ko) 2019-09-02
KR20180067715A (ko) 2018-06-20
JP2013036041A (ja) 2013-02-21
TW201839025A (zh) 2018-11-01
US20190002728A1 (en) 2019-01-03

Similar Documents

Publication Publication Date Title
JP5149917B2 (ja) 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板
JP5195582B2 (ja) 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
JP5407679B2 (ja) 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
JP5672788B2 (ja) ポリアゾメチンを有するビスマレイミド誘導体とその製造方法、並びに熱硬化性樹脂組成物、プリプレグ及び積層板
JP5589292B2 (ja) 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
JP6443657B2 (ja) 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
JP2006213872A (ja) 半導体装置用接着剤組成物および半導体装置用接着シート
US10465089B2 (en) Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
CN106661195B (zh) 环氧树脂组合物、树脂片、预浸料及覆金属层叠板、印刷布线基板、半导体装置
KR20140027493A (ko) 프리프레그, 적층판, 반도체 패키지 및 적층판의 제조 방법
TWI309606B (en) Resin composition, prepreg and laminate using the composition
JPH0797614B2 (ja) トリアジン接着剤を用いる複合材料
JP5540611B2 (ja) 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及びプリント配線板
JP5228404B2 (ja) エポキシ樹脂組成物、その硬化物、ビルドアップフィルム用樹脂組成物、新規エポキシ樹脂、及びその製造方法
WO2011104905A1 (ja) ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
JP5407678B2 (ja) 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
KR101868161B1 (ko) 바니시, 프리프레그, 수지 부착 필름, 금속박장 적층판, 인쇄 배선판
JP7243077B2 (ja) プリプレグ、プリプレグの硬化物、積層板、プリント配線板及び半導体パッケージ
JPH0812744A (ja) 樹脂組成物およびプリプレグ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120530

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120530

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20120530

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20120615

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120619

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120821

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120912

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121016

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121029

R151 Written notification of patent or utility model registration

Ref document number: 5136573

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151122

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151122

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees