JP5112151B2 - 光照射装置 - Google Patents
光照射装置 Download PDFInfo
- Publication number
- JP5112151B2 JP5112151B2 JP2008100331A JP2008100331A JP5112151B2 JP 5112151 B2 JP5112151 B2 JP 5112151B2 JP 2008100331 A JP2008100331 A JP 2008100331A JP 2008100331 A JP2008100331 A JP 2008100331A JP 5112151 B2 JP5112151 B2 JP 5112151B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- shielding mask
- irradiation apparatus
- light shielding
- light irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001179 sorption measurement Methods 0.000 claims description 48
- 230000002093 peripheral effect Effects 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 38
- 239000003566 sealing material Substances 0.000 description 16
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002438 flame photometric detection Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Landscapes
- Liquid Crystal (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- External Artificial Organs (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008100331A JP5112151B2 (ja) | 2008-04-08 | 2008-04-08 | 光照射装置 |
| TW98107966A TWI474375B (zh) | 2008-04-08 | 2009-03-12 | 光照射裝置 |
| CN2009101276785A CN101556908B (zh) | 2008-04-08 | 2009-03-18 | 光照射装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008100331A JP5112151B2 (ja) | 2008-04-08 | 2008-04-08 | 光照射装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012224005A Division JP5373168B2 (ja) | 2012-10-09 | 2012-10-09 | 光照射装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009253079A JP2009253079A (ja) | 2009-10-29 |
| JP2009253079A5 JP2009253079A5 (enExample) | 2011-03-03 |
| JP5112151B2 true JP5112151B2 (ja) | 2013-01-09 |
Family
ID=41174964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008100331A Expired - Fee Related JP5112151B2 (ja) | 2008-04-08 | 2008-04-08 | 光照射装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5112151B2 (enExample) |
| CN (1) | CN101556908B (enExample) |
| TW (1) | TWI474375B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011089828A1 (ja) * | 2010-01-22 | 2011-07-28 | シャープ株式会社 | 光照射装置、光照射方法および液晶パネルの製造方法 |
| JP5472616B2 (ja) * | 2010-01-27 | 2014-04-16 | ウシオ電機株式会社 | 光照射装置 |
| JP5373168B2 (ja) * | 2012-10-09 | 2013-12-18 | 株式会社アルバック | 光照射装置 |
| JP6614795B2 (ja) * | 2015-05-11 | 2019-12-04 | Aiメカテック株式会社 | 紫外線照射装置、及び基板組立システム |
| CN108717250B (zh) * | 2018-06-05 | 2021-03-23 | 江苏永鼎股份有限公司 | 一种半导体芯片生产用接触式光刻机 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3094827B2 (ja) * | 1995-02-14 | 2000-10-03 | ウシオ電機株式会社 | 液晶パネルの貼り合わせ方法および装置 |
| JPH1050584A (ja) * | 1996-08-07 | 1998-02-20 | Nikon Corp | マスク保持装置 |
| JP2001059953A (ja) * | 1999-08-23 | 2001-03-06 | Seiko Epson Corp | 基板圧着装置及び液晶装置の製造方法 |
| JP3483809B2 (ja) * | 1999-08-31 | 2004-01-06 | シャープ株式会社 | 基板の貼り合わせ方法および貼り合わせ装置並びに液晶表示装置の製造方法 |
| US7365822B2 (en) * | 2002-02-20 | 2008-04-29 | Lg.Philips Lcd Co., Ltd. | Method for fabricating LCD |
| JP4039174B2 (ja) * | 2002-08-12 | 2008-01-30 | ウシオ電機株式会社 | ディスプレイパネルの貼り合わせ装置 |
| JP2004151325A (ja) * | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | 基板貼り合せ方法 |
| KR100578262B1 (ko) * | 2003-11-13 | 2006-05-11 | 주식회사 디엠에스 | 진공을 이용한 대면적 마스크 고정장치 및 그를 이용한노광장치와 노광방법 |
| JP4380316B2 (ja) * | 2003-12-17 | 2009-12-09 | ウシオ電機株式会社 | マスク取り付け治具および該マスク取り付け治具を用いたマスク取り付け方法 |
| JP4572626B2 (ja) * | 2004-08-26 | 2010-11-04 | ウシオ電機株式会社 | 光照射装置 |
| US20070070311A1 (en) * | 2005-09-23 | 2007-03-29 | Asml Netherlands B.V. | Contacts to microdevices |
| JP4150041B2 (ja) * | 2005-12-26 | 2008-09-17 | 富士通株式会社 | 貼合せ基板製造装置 |
| JP4150042B2 (ja) * | 2005-12-26 | 2008-09-17 | 富士通株式会社 | 貼合せ基板製造装置及び貼合せ基板製造方法 |
| JP4118922B2 (ja) * | 2006-03-24 | 2008-07-16 | 富士通株式会社 | 貼合せ基板製造装置及び貼合せ基板製造方法 |
-
2008
- 2008-04-08 JP JP2008100331A patent/JP5112151B2/ja not_active Expired - Fee Related
-
2009
- 2009-03-12 TW TW98107966A patent/TWI474375B/zh not_active IP Right Cessation
- 2009-03-18 CN CN2009101276785A patent/CN101556908B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101556908B (zh) | 2012-05-30 |
| JP2009253079A (ja) | 2009-10-29 |
| CN101556908A (zh) | 2009-10-14 |
| TW200943385A (en) | 2009-10-16 |
| TWI474375B (zh) | 2015-02-21 |
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