TWI474375B - 光照射裝置 - Google Patents
光照射裝置 Download PDFInfo
- Publication number
- TWI474375B TWI474375B TW98107966A TW98107966A TWI474375B TW I474375 B TWI474375 B TW I474375B TW 98107966 A TW98107966 A TW 98107966A TW 98107966 A TW98107966 A TW 98107966A TW I474375 B TWI474375 B TW I474375B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- tube
- hood
- irradiation device
- adsorption tube
- Prior art date
Links
- 238000001179 sorption measurement Methods 0.000 claims description 73
- 230000002093 peripheral effect Effects 0.000 claims description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 39
- 239000003566 sealing material Substances 0.000 description 18
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 238000004891 communication Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- External Artificial Organs (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008100331A JP5112151B2 (ja) | 2008-04-08 | 2008-04-08 | 光照射装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200943385A TW200943385A (en) | 2009-10-16 |
| TWI474375B true TWI474375B (zh) | 2015-02-21 |
Family
ID=41174964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98107966A TWI474375B (zh) | 2008-04-08 | 2009-03-12 | 光照射裝置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5112151B2 (enExample) |
| CN (1) | CN101556908B (enExample) |
| TW (1) | TWI474375B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011089828A1 (ja) * | 2010-01-22 | 2011-07-28 | シャープ株式会社 | 光照射装置、光照射方法および液晶パネルの製造方法 |
| JP5472616B2 (ja) * | 2010-01-27 | 2014-04-16 | ウシオ電機株式会社 | 光照射装置 |
| JP5373168B2 (ja) * | 2012-10-09 | 2013-12-18 | 株式会社アルバック | 光照射装置 |
| JP6614795B2 (ja) * | 2015-05-11 | 2019-12-04 | Aiメカテック株式会社 | 紫外線照射装置、及び基板組立システム |
| CN108717250B (zh) * | 2018-06-05 | 2021-03-23 | 江苏永鼎股份有限公司 | 一种半导体芯片生产用接触式光刻机 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200715513A (en) * | 2005-09-23 | 2007-04-16 | Asml Netherlands Bv | Contacts to microdevices |
| TWI282029B (en) * | 2002-08-12 | 2007-06-01 | Ushio Electric Inc | Adhering device of display panel |
| TWI290267B (en) * | 2003-11-13 | 2007-11-21 | Dms Co Ltd | Mask supporting apparatus using vacuum and light exposing system, and method using the same |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3094827B2 (ja) * | 1995-02-14 | 2000-10-03 | ウシオ電機株式会社 | 液晶パネルの貼り合わせ方法および装置 |
| JPH1050584A (ja) * | 1996-08-07 | 1998-02-20 | Nikon Corp | マスク保持装置 |
| JP2001059953A (ja) * | 1999-08-23 | 2001-03-06 | Seiko Epson Corp | 基板圧着装置及び液晶装置の製造方法 |
| JP3483809B2 (ja) * | 1999-08-31 | 2004-01-06 | シャープ株式会社 | 基板の貼り合わせ方法および貼り合わせ装置並びに液晶表示装置の製造方法 |
| US7365822B2 (en) * | 2002-02-20 | 2008-04-29 | Lg.Philips Lcd Co., Ltd. | Method for fabricating LCD |
| JP2004151325A (ja) * | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | 基板貼り合せ方法 |
| JP4380316B2 (ja) * | 2003-12-17 | 2009-12-09 | ウシオ電機株式会社 | マスク取り付け治具および該マスク取り付け治具を用いたマスク取り付け方法 |
| JP4572626B2 (ja) * | 2004-08-26 | 2010-11-04 | ウシオ電機株式会社 | 光照射装置 |
| JP4150041B2 (ja) * | 2005-12-26 | 2008-09-17 | 富士通株式会社 | 貼合せ基板製造装置 |
| JP4150042B2 (ja) * | 2005-12-26 | 2008-09-17 | 富士通株式会社 | 貼合せ基板製造装置及び貼合せ基板製造方法 |
| JP4118922B2 (ja) * | 2006-03-24 | 2008-07-16 | 富士通株式会社 | 貼合せ基板製造装置及び貼合せ基板製造方法 |
-
2008
- 2008-04-08 JP JP2008100331A patent/JP5112151B2/ja not_active Expired - Fee Related
-
2009
- 2009-03-12 TW TW98107966A patent/TWI474375B/zh not_active IP Right Cessation
- 2009-03-18 CN CN2009101276785A patent/CN101556908B/zh not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI282029B (en) * | 2002-08-12 | 2007-06-01 | Ushio Electric Inc | Adhering device of display panel |
| TWI290267B (en) * | 2003-11-13 | 2007-11-21 | Dms Co Ltd | Mask supporting apparatus using vacuum and light exposing system, and method using the same |
| TW200715513A (en) * | 2005-09-23 | 2007-04-16 | Asml Netherlands Bv | Contacts to microdevices |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101556908B (zh) | 2012-05-30 |
| JP5112151B2 (ja) | 2013-01-09 |
| JP2009253079A (ja) | 2009-10-29 |
| CN101556908A (zh) | 2009-10-14 |
| TW200943385A (en) | 2009-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |