TW200943385A - A light irradiation apparatus - Google Patents

A light irradiation apparatus

Info

Publication number
TW200943385A
TW200943385A TW98107966A TW98107966A TW200943385A TW 200943385 A TW200943385 A TW 200943385A TW 98107966 A TW98107966 A TW 98107966A TW 98107966 A TW98107966 A TW 98107966A TW 200943385 A TW200943385 A TW 200943385A
Authority
TW
Taiwan
Prior art keywords
light
hood
irradiation apparatus
light irradiation
transmittant
Prior art date
Application number
TW98107966A
Other languages
Chinese (zh)
Other versions
TWI474375B (en
Inventor
Tetsuji Kadowaki
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW200943385A publication Critical patent/TW200943385A/en
Application granted granted Critical
Publication of TWI474375B publication Critical patent/TWI474375B/en

Links

Landscapes

  • Liquid Crystal (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • External Artificial Organs (AREA)

Abstract

This invention is a light irradiation device. It can increase the light intensity emitted from a light resource onto an object. The light irradiation apparatus comprises a light source 40, a hood M that is placed beneath the light source 40, a supporting piece 24 that is installed above the hood M, a suction tube 30 which is supported by the supporting piece 24 and is light transmittant and utilizes vacuum suction to attach to the hood M. The light irradiation apparatus emits light from the light source 40. The light travels through the light transmittant hood M, and illuminates an object W which is placed beneath the light transmittant hood M.
TW98107966A 2008-04-08 2009-03-12 Light irradiation apparatus TWI474375B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008100331A JP5112151B2 (en) 2008-04-08 2008-04-08 Light irradiation device

Publications (2)

Publication Number Publication Date
TW200943385A true TW200943385A (en) 2009-10-16
TWI474375B TWI474375B (en) 2015-02-21

Family

ID=41174964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98107966A TWI474375B (en) 2008-04-08 2009-03-12 Light irradiation apparatus

Country Status (3)

Country Link
JP (1) JP5112151B2 (en)
CN (1) CN101556908B (en)
TW (1) TWI474375B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011089828A1 (en) * 2010-01-22 2013-05-23 シャープ株式会社 Light irradiation apparatus, light irradiation method, and liquid crystal panel manufacturing method
JP5472616B2 (en) * 2010-01-27 2014-04-16 ウシオ電機株式会社 Light irradiation device
JP5373168B2 (en) * 2012-10-09 2013-12-18 株式会社アルバック Light irradiation device
JP6614795B2 (en) * 2015-05-11 2019-12-04 Ａｉメカテック株式会社 Ultraviolet irradiation device and substrate assembly system
CN108717250B (en) * 2018-06-05 2021-03-23 江苏永鼎股份有限公司 Contact photoetching machine for semiconductor chip production

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094827B2 (en) * 1995-02-14 2000-10-03 ウシオ電機株式会社 Method and apparatus for bonding liquid crystal panels
JPH1050584A (en) * 1996-08-07 1998-02-20 Nikon Corp Mask holder
JP2001059953A (en) * 1999-08-23 2001-03-06 Seiko Epson Corp Substrate press-contacting device and manufacture of liquid crystal device
JP3483809B2 (en) * 1999-08-31 2004-01-06 シャープ株式会社 Substrate bonding method and bonding apparatus, and liquid crystal display device manufacturing method
CN100385300C (en) * 2002-02-20 2008-04-30 Lg.菲利浦Lcd株式会社 Liquid-crystal display production
JP4039174B2 (en) * 2002-08-12 2008-01-30 ウシオ電機株式会社 Display panel bonding device
JP2004151325A (en) * 2002-10-30 2004-05-27 Fujitsu Ltd Method of bonding substrates together
KR100578262B1 (en) * 2003-11-13 2006-05-11 주식회사 디엠에스 Apparatus for fixing mask by vacuum and exposure method of the same
JP4380316B2 (en) * 2003-12-17 2009-12-09 ウシオ電機株式会社 Mask mounting jig and mask mounting method using the mask mounting jig
JP4572626B2 (en) * 2004-08-26 2010-11-04 ウシオ電機株式会社 Light irradiation device
US20070070311A1 (en) * 2005-09-23 2007-03-29 Asml Netherlands B.V. Contacts to microdevices
JP4150042B2 (en) * 2005-12-26 2008-09-17 富士通株式会社 Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
JP4150041B2 (en) * 2005-12-26 2008-09-17 富士通株式会社 Bonded board manufacturing equipment
JP4118922B2 (en) * 2006-03-24 2008-07-16 富士通株式会社 Bonded substrate manufacturing apparatus and bonded substrate manufacturing method

Also Published As

Publication number Publication date
JP2009253079A (en) 2009-10-29
CN101556908A (en) 2009-10-14
TWI474375B (en) 2015-02-21
CN101556908B (en) 2012-05-30
JP5112151B2 (en) 2013-01-09

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