JP5046819B2 - スルーホールの形成方法およびインクジェットヘッド - Google Patents

スルーホールの形成方法およびインクジェットヘッド Download PDF

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Publication number
JP5046819B2
JP5046819B2 JP2007238387A JP2007238387A JP5046819B2 JP 5046819 B2 JP5046819 B2 JP 5046819B2 JP 2007238387 A JP2007238387 A JP 2007238387A JP 2007238387 A JP2007238387 A JP 2007238387A JP 5046819 B2 JP5046819 B2 JP 5046819B2
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JP
Japan
Prior art keywords
impurity region
hole
forming
silicon substrate
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007238387A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009066933A (ja
JP2009066933A5 (enExample
Inventor
圭一 佐々木
幸宏 早川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2007238387A priority Critical patent/JP5046819B2/ja
Priority to US12/197,499 priority patent/US8409452B2/en
Priority to CN2008101491166A priority patent/CN101386228B/zh
Publication of JP2009066933A publication Critical patent/JP2009066933A/ja
Publication of JP2009066933A5 publication Critical patent/JP2009066933A5/ja
Application granted granted Critical
Publication of JP5046819B2 publication Critical patent/JP5046819B2/ja
Priority to US13/780,453 priority patent/US8771528B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group IV materials or Group III-V materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Weting (AREA)
JP2007238387A 2007-09-13 2007-09-13 スルーホールの形成方法およびインクジェットヘッド Expired - Fee Related JP5046819B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007238387A JP5046819B2 (ja) 2007-09-13 2007-09-13 スルーホールの形成方法およびインクジェットヘッド
US12/197,499 US8409452B2 (en) 2007-09-13 2008-08-25 Through-hole forming method, inkjet head, and silicon substrate
CN2008101491166A CN101386228B (zh) 2007-09-13 2008-09-12 通孔形成方法、喷墨头和硅衬底
US13/780,453 US8771528B2 (en) 2007-09-13 2013-02-28 Through-hole forming method and inkjet head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007238387A JP5046819B2 (ja) 2007-09-13 2007-09-13 スルーホールの形成方法およびインクジェットヘッド

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012150749A Division JP5274694B2 (ja) 2012-07-04 2012-07-04 スルーホールの形成方法、インクジェットヘッド及びシリコン基板

Publications (3)

Publication Number Publication Date
JP2009066933A JP2009066933A (ja) 2009-04-02
JP2009066933A5 JP2009066933A5 (enExample) 2010-11-04
JP5046819B2 true JP5046819B2 (ja) 2012-10-10

Family

ID=40453991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007238387A Expired - Fee Related JP5046819B2 (ja) 2007-09-13 2007-09-13 スルーホールの形成方法およびインクジェットヘッド

Country Status (3)

Country Link
US (2) US8409452B2 (enExample)
JP (1) JP5046819B2 (enExample)
CN (1) CN101386228B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5046819B2 (ja) * 2007-09-13 2012-10-10 キヤノン株式会社 スルーホールの形成方法およびインクジェットヘッド
EP2355138B1 (en) * 2010-01-28 2016-08-24 Canon Kabushiki Kaisha Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrate
JP6216142B2 (ja) * 2012-05-28 2017-10-18 キヤノン株式会社 半導体装置の製造方法
CN104249559B (zh) * 2013-06-26 2016-08-31 珠海赛纳打印科技股份有限公司 液体喷射装置及其制造方法
CN109188858B (zh) * 2018-09-10 2020-05-26 复旦大学 一种高精密硅基通孔掩膜版分体图形结构
WO2020256694A1 (en) 2019-06-18 2020-12-24 Hewlett-Packard Development Company, L.P. Fluid feed hole corrosion detection
CN116995027B (zh) * 2022-04-24 2026-07-24 中芯国际集成电路制造(北京)有限公司 硅通孔结构及其形成方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3240159B2 (ja) 1991-01-08 2001-12-17 株式会社東芝 パターン形成方法および半導体素子の製造方法
US5236547A (en) * 1990-09-25 1993-08-17 Kabushiki Kaisha Toshiba Method of forming a pattern in semiconductor device manufacturing process
JPH0612963A (ja) 1992-06-26 1994-01-21 Shimadzu Corp 静電型マイクロリレーの製造方法
JP3984689B2 (ja) * 1996-11-11 2007-10-03 キヤノン株式会社 インクジェットヘッドの製造方法
JPH10260523A (ja) * 1997-03-18 1998-09-29 Nikon Corp シリコンステンシルマスクの製造方法
DE69819976T2 (de) * 1997-08-05 2004-09-02 Canon K.K. Flüssigkeitsausstosskopf, Substrat und Herstelllungsverfahren
WO2001010646A1 (en) * 1999-08-04 2001-02-15 Seiko Epson Corporation Ink jet recording head, method for manufacturing the same, and ink jet recorder
JP3494219B2 (ja) * 1999-11-15 2004-02-09 セイコーエプソン株式会社 インクジェット式記録ヘッド
DE60005111T2 (de) * 1999-11-15 2004-03-25 Seiko Epson Corp. Tintenstrahldruckkopf und Tintenstrahlaufzeichnungsvorrichtung
US6800902B2 (en) * 2001-02-16 2004-10-05 Canon Kabushiki Kaisha Semiconductor device, method of manufacturing the same and liquid jet apparatus
JP2002337347A (ja) * 2001-05-15 2002-11-27 Canon Inc 液体吐出ヘッドおよびその製造方法
JP2003017498A (ja) * 2001-07-02 2003-01-17 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2003133581A (ja) * 2001-10-24 2003-05-09 Ricoh Co Ltd 近接場光プローブ及びその製造方法
JP4217434B2 (ja) * 2002-07-04 2009-02-04 キヤノン株式会社 スルーホールの形成方法及びこれを用いたインクジェットヘッド
US7323115B2 (en) * 2003-02-13 2008-01-29 Canon Kabushiki Kaisha Substrate processing method and ink jet recording head substrate manufacturing method
JP4837902B2 (ja) * 2004-06-24 2011-12-14 富士通セミコンダクター株式会社 半導体装置
JP5046819B2 (ja) * 2007-09-13 2012-10-10 キヤノン株式会社 スルーホールの形成方法およびインクジェットヘッド

Also Published As

Publication number Publication date
JP2009066933A (ja) 2009-04-02
US20090073228A1 (en) 2009-03-19
US8409452B2 (en) 2013-04-02
US20130168828A1 (en) 2013-07-04
US8771528B2 (en) 2014-07-08
CN101386228A (zh) 2009-03-18
CN101386228B (zh) 2010-12-22

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