JP4988533B2 - 工作物から多数のウェハをスライスするための方法 - Google Patents
工作物から多数のウェハをスライスするための方法 Download PDFInfo
- Publication number
- JP4988533B2 JP4988533B2 JP2007322108A JP2007322108A JP4988533B2 JP 4988533 B2 JP4988533 B2 JP 4988533B2 JP 2007322108 A JP2007322108 A JP 2007322108A JP 2007322108 A JP2007322108 A JP 2007322108A JP 4988533 B2 JP4988533 B2 JP 4988533B2
- Authority
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- Prior art keywords
- wire
- sawing
- workpiece
- speed
- effective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 50
- 235000012431 wafers Nutrition 0.000 title claims description 17
- 239000002002 slurry Substances 0.000 claims description 14
- 229910001369 Brass Inorganic materials 0.000 claims description 4
- 239000010951 brass Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000011109 contamination Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 10
- 238000009958 sewing Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 244000126211 Hericium coralloides Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
直径150mmの結晶片が、幅70mmのソーイングストリップに固定された(図4も参照)。
Claims (10)
- 長手方向軸線と断面とを有する工作物から多数のウェハをスライスするための方法において、テーブルに固定された前記工作物が、テーブルと、ワイヤソーのワイヤギャングとの、工作物の長手方向軸線に対して垂直に向けられた相対移動によって、有効速度で移動させられるソーイングワイヤによって形成されたワイヤギャングを通って可変の前送り速度で送られるようになっており、前記テーブルの位置に応じたソーイングワイヤの有効速度が、ソーイングワイヤの均一な摩耗を生ぜしめるために、前記テーブルの前送り速度と、工作物内へのソーイングワイヤの係合長さとの積の関数として調節されることを特徴とする、多数のウェハをスライスするための方法。
- ソーイングワイヤの有効速度が、前方ワイヤ移動速度及び後方ワイヤ移動速度と、係合長さとの間に比例関係が存在するように調節される、請求項1記載の方法。
- ソーイングワイヤの有効速度が、前方ワイヤ移動速度及び後方ワイヤ移動速度と、テーブル前送り速度と係合長さとの積との間に比例関係が存在するように調節される、請求項1記載の方法。
- ソーイングワイヤの有効速度が、前方ワイヤ移動速度及び後方ワイヤ移動速度と、作動力との間に比例関係が存在するように調節される、請求項1記載の方法。
- ソーイングワイヤが、ソーイングプロセスの終了後の別のソーイングプロセスのために使用される、請求項1から4までのいずれか1項記載の方法。
- ソーイングワイヤが複数回使用される、請求項5記載の方法。
- ウェハがスラリを使用しながらスライスされる、請求項5又は6記載の方法。
- ソーイングワイヤが、入口スプールを介して展開され、ワイヤギャングを形成するためにガイドロールの周囲に供給され、最後に出口スプールに巻き取られ、入口スプールと出口スプールとが、第2のソーイングプロセスの前に交換される、請求項5から7までのいずれか1項記載の方法。
- ソーイングワイヤが、第2のソーイングプロセスの間、第1のソーイングプロセスに関して他の方向に有効に移動させられる、請求項5から7までのいずれか1項記載の方法。
- ソーイングワイヤには第1の使用の前に黄銅層が設けられており、このことの効果は、スラリを保持する容器が第1のソーイングプロセスの後に銅原子で汚染されることであり、汚染されたスラリ容器がさらに、第2のソーイングプロセスのための汚染されていないスラリ容器と交換され、第2のソーイングプロセスの間、第2のスラリ容器の汚染が生じない、請求項8又は9記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006058823.1 | 2006-12-13 | ||
DE102006058823.1A DE102006058823B4 (de) | 2006-12-13 | 2006-12-13 | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008149455A JP2008149455A (ja) | 2008-07-03 |
JP4988533B2 true JP4988533B2 (ja) | 2012-08-01 |
Family
ID=39399563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007322108A Active JP4988533B2 (ja) | 2006-12-13 | 2007-12-13 | 工作物から多数のウェハをスライスするための方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7827980B2 (ja) |
JP (1) | JP4988533B2 (ja) |
KR (1) | KR100888989B1 (ja) |
CN (1) | CN101200102B (ja) |
DE (1) | DE102006058823B4 (ja) |
SG (1) | SG144022A1 (ja) |
TW (1) | TW200824822A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7504831B2 (ja) | 2021-04-02 | 2024-06-24 | 三協立山株式会社 | 窓 |
Families Citing this family (29)
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JP4998241B2 (ja) * | 2007-12-11 | 2012-08-15 | 信越半導体株式会社 | ワイヤソーによるワークの切断方法およびワイヤソー |
US20100126488A1 (en) * | 2008-11-25 | 2010-05-27 | Abhaya Kumar Bakshi | Method and apparatus for cutting wafers by wire sawing |
EP2464486A2 (en) | 2009-08-14 | 2012-06-20 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
EP2464485A2 (en) | 2009-08-14 | 2012-06-20 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
DE102009057592B3 (de) * | 2009-12-09 | 2011-05-05 | Siltronic Ag | Drahtführungsrolle für Drahtsäge |
DE102010007459B4 (de) | 2010-02-10 | 2012-01-19 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial |
DE102010010887A1 (de) | 2010-03-10 | 2011-09-15 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück |
JP5639858B2 (ja) * | 2010-11-19 | 2014-12-10 | Sumco Techxiv株式会社 | インゴットの切断方法 |
TWI466990B (zh) | 2010-12-30 | 2015-01-01 | Saint Gobain Abrasives Inc | 磨料物品及形成方法 |
SG11201400630WA (en) | 2011-09-16 | 2014-04-28 | Saint Gobain Abrasives Inc | Abrasive article and method of forming |
KR20140075717A (ko) | 2011-09-29 | 2014-06-19 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 배리어층이 있는 신장 기재 몸체 결합 연마 입자를 포함하는 연마 물품, 및 이를 형성하는 방법 |
US8960657B2 (en) | 2011-10-05 | 2015-02-24 | Sunedison, Inc. | Systems and methods for connecting an ingot to a wire saw |
CN102555089A (zh) * | 2011-12-15 | 2012-07-11 | 江西金葵能源科技有限公司 | 金刚石线双棒多线切割机 |
CN102528953A (zh) * | 2011-12-29 | 2012-07-04 | 江西金葵能源科技有限公司 | 金刚石线单棒多线切割机 |
CN102626959B (zh) * | 2012-04-23 | 2014-10-22 | 天津职业技术师范大学 | 用于多线切割机的等线损计算方法 |
DE102012209974B4 (de) * | 2012-06-14 | 2018-02-15 | Siltronic Ag | Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück |
TWI477343B (zh) | 2012-06-29 | 2015-03-21 | Saint Gobain Abrasives Inc | 研磨物品及形成方法 |
TWI474889B (zh) | 2012-06-29 | 2015-03-01 | Saint Gobain Abrasives Inc | 研磨物品及形成方法 |
TW201402274A (zh) | 2012-06-29 | 2014-01-16 | Saint Gobain Abrasives Inc | 研磨物品及形成方法 |
TWI483803B (zh) * | 2012-06-29 | 2015-05-11 | Saint Gobain Abrasives Inc | 在工件上進行切割操作之方法 |
TW201404527A (zh) | 2012-06-29 | 2014-02-01 | Saint Gobain Abrasives Inc | 研磨物品及形成方法 |
TW201441355A (zh) | 2013-04-19 | 2014-11-01 | Saint Gobain Abrasives Inc | 研磨製品及其形成方法 |
JP6015598B2 (ja) * | 2013-08-28 | 2016-10-26 | 信越半導体株式会社 | インゴットの切断方法及びワイヤソー |
TWI621505B (zh) | 2015-06-29 | 2018-04-21 | 聖高拜磨料有限公司 | 研磨物品及形成方法 |
JP6493243B2 (ja) * | 2016-02-15 | 2019-04-03 | 株式会社Sumco | ウェーハの製造方法 |
CN106079124A (zh) * | 2016-06-30 | 2016-11-09 | 苏州恒嘉晶体材料有限公司 | 一种线切割方法 |
WO2018042864A1 (ja) * | 2016-08-31 | 2018-03-08 | 住友電気工業株式会社 | 半導体基板の製造方法 |
CN107379296A (zh) * | 2017-07-26 | 2017-11-24 | 杨凌美畅新材料有限公司 | 多线切割机工作台与主轴协同控制方法 |
CN117944192A (zh) * | 2022-10-19 | 2024-04-30 | 内蒙古中环光伏材料有限公司 | 一种改善硅片线痕的加工方法 |
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-
2006
- 2006-12-13 DE DE102006058823.1A patent/DE102006058823B4/de active Active
-
2007
- 2007-10-12 SG SG200716849-5A patent/SG144022A1/en unknown
- 2007-11-09 CN CN200710170081XA patent/CN101200102B/zh active Active
- 2007-11-21 TW TW096144064A patent/TW200824822A/zh unknown
- 2007-11-23 KR KR1020070120384A patent/KR100888989B1/ko active IP Right Grant
- 2007-12-11 US US11/953,892 patent/US7827980B2/en active Active
- 2007-12-13 JP JP2007322108A patent/JP4988533B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7504831B2 (ja) | 2021-04-02 | 2024-06-24 | 三協立山株式会社 | 窓 |
Also Published As
Publication number | Publication date |
---|---|
KR100888989B1 (ko) | 2009-03-19 |
US20080141994A1 (en) | 2008-06-19 |
CN101200102B (zh) | 2011-08-31 |
TW200824822A (en) | 2008-06-16 |
DE102006058823B4 (de) | 2017-06-08 |
DE102006058823A1 (de) | 2008-06-19 |
CN101200102A (zh) | 2008-06-18 |
JP2008149455A (ja) | 2008-07-03 |
TWI336275B (ja) | 2011-01-21 |
SG144022A1 (en) | 2008-07-29 |
US7827980B2 (en) | 2010-11-09 |
KR20080055633A (ko) | 2008-06-19 |
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