JP4978184B2 - 半導体装置及び電子機器 - Google Patents

半導体装置及び電子機器 Download PDF

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Publication number
JP4978184B2
JP4978184B2 JP2006343928A JP2006343928A JP4978184B2 JP 4978184 B2 JP4978184 B2 JP 4978184B2 JP 2006343928 A JP2006343928 A JP 2006343928A JP 2006343928 A JP2006343928 A JP 2006343928A JP 4978184 B2 JP4978184 B2 JP 4978184B2
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JP
Japan
Prior art keywords
inductor
substrate
elements
wiring
inductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006343928A
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English (en)
Japanese (ja)
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JP2008159655A (ja
JP2008159655A5 (https=
Inventor
知永 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2006343928A priority Critical patent/JP4978184B2/ja
Publication of JP2008159655A publication Critical patent/JP2008159655A/ja
Publication of JP2008159655A5 publication Critical patent/JP2008159655A5/ja
Application granted granted Critical
Publication of JP4978184B2 publication Critical patent/JP4978184B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Coils Or Transformers For Communication (AREA)
JP2006343928A 2006-12-21 2006-12-21 半導体装置及び電子機器 Expired - Fee Related JP4978184B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006343928A JP4978184B2 (ja) 2006-12-21 2006-12-21 半導体装置及び電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006343928A JP4978184B2 (ja) 2006-12-21 2006-12-21 半導体装置及び電子機器

Publications (3)

Publication Number Publication Date
JP2008159655A JP2008159655A (ja) 2008-07-10
JP2008159655A5 JP2008159655A5 (https=) 2010-02-18
JP4978184B2 true JP4978184B2 (ja) 2012-07-18

Family

ID=39660278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006343928A Expired - Fee Related JP4978184B2 (ja) 2006-12-21 2006-12-21 半導体装置及び電子機器

Country Status (1)

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JP (1) JP4978184B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8128238B2 (en) 2007-09-07 2012-03-06 Ricoh Company, Ltd. Projection optical system and image displaying apparatus
JP5286963B2 (ja) * 2007-09-07 2013-09-11 株式会社リコー 投射光学系
CN205080956U (zh) * 2013-04-16 2016-03-09 株式会社村田制作所 电感元器件、电感电桥以及高频滤波器
KR102024849B1 (ko) * 2018-11-16 2019-09-24 주식회사 에이텀 변압기용 평판형 2차 코일 소자 어셈블리
CN111095447B (zh) * 2018-03-15 2023-03-17 株式会社艾特慕 变压器用二次线圈元件及其制造方法
KR102009434B1 (ko) * 2018-05-04 2019-10-21 주식회사 에이텀 변압기용 평판형 2차 코일 소자 어셈블리

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832617U (ja) * 1981-08-25 1983-03-03 株式会社村田製作所 自立型インダクタ
JPS58141513A (ja) * 1982-02-17 1983-08-22 Olympus Optical Co Ltd 積層型プリントコイル
JPH07335443A (ja) * 1994-06-13 1995-12-22 Hitachi Maxell Ltd コイル装置およびそれを用いたｉｃメモリ装置
JPH11167612A (ja) * 1997-12-02 1999-06-22 Hitachi Ltd 無線ｉｃカード
JP3250519B2 (ja) * 1998-05-08 2002-01-28 関西日本電気株式会社 配線基板の製造方法
JP2003123047A (ja) * 2001-10-15 2003-04-25 Sharp Corp 半導体装置及びその製造方法
JP4494003B2 (ja) * 2003-12-19 2010-06-30 株式会社半導体エネルギー研究所 半導体装置
JP2005340754A (ja) * 2004-04-27 2005-12-08 Fuji Electric Device Technology Co Ltd 超小型電力変換装置

Also Published As

Publication number Publication date
JP2008159655A (ja) 2008-07-10

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