JP4963163B2 - レーザ処理装置及び半導体装置の作製方法 - Google Patents
レーザ処理装置及び半導体装置の作製方法 Download PDFInfo
- Publication number
- JP4963163B2 JP4963163B2 JP2005173119A JP2005173119A JP4963163B2 JP 4963163 B2 JP4963163 B2 JP 4963163B2 JP 2005173119 A JP2005173119 A JP 2005173119A JP 2005173119 A JP2005173119 A JP 2005173119A JP 4963163 B2 JP4963163 B2 JP 4963163B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- laser
- film
- rotating body
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005173119A JP4963163B2 (ja) | 2004-06-16 | 2005-06-14 | レーザ処理装置及び半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004178596 | 2004-06-16 | ||
| JP2004178596 | 2004-06-16 | ||
| JP2005173119A JP4963163B2 (ja) | 2004-06-16 | 2005-06-14 | レーザ処理装置及び半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006032926A JP2006032926A (ja) | 2006-02-02 |
| JP2006032926A5 JP2006032926A5 (https=) | 2008-07-24 |
| JP4963163B2 true JP4963163B2 (ja) | 2012-06-27 |
Family
ID=35898842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005173119A Expired - Fee Related JP4963163B2 (ja) | 2004-06-16 | 2005-06-14 | レーザ処理装置及び半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4963163B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4923446B2 (ja) * | 2005-06-20 | 2012-04-25 | ソニー株式会社 | レーザ処理装置およびレーザ処理方法 |
| US8432423B2 (en) * | 2007-09-25 | 2013-04-30 | Kodak Graphics Communications Canada Company | Bidirectional imaging with varying speeds |
| US8047442B2 (en) * | 2007-12-03 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| FR2929439B1 (fr) * | 2008-03-28 | 2013-11-08 | Commissariat Energie Atomique | Procede de stockage d'images et support de stockage correspondant. |
| KR100951782B1 (ko) * | 2009-11-02 | 2010-04-08 | 주식회사 엘앤피아너스 | 패턴 형성장치 및 패턴 형성방법 |
| CN105448792B (zh) * | 2014-05-29 | 2018-02-06 | 上海和辉光电有限公司 | 柔性显示器件的制造方法 |
| KR101642130B1 (ko) * | 2014-11-14 | 2016-07-22 | 한국기계연구원 | 레이저를 이용한 증착 및 결정화 장치 및 이를 이용한 증착 및 결정화 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2524199B2 (ja) * | 1988-07-19 | 1996-08-14 | 有限会社イデアリサーチ | 自動選別装置 |
| JPH07302909A (ja) * | 1994-05-06 | 1995-11-14 | Sony Corp | ボトム・ゲート型薄膜トランジスタの製造方法 |
| JPH08236442A (ja) * | 1995-02-28 | 1996-09-13 | Mitsubishi Electric Corp | 半導体ウエハ,及びその製造方法 |
| JP3886554B2 (ja) * | 1995-08-18 | 2007-02-28 | 株式会社半導体エネルギー研究所 | レーザーアニール方法 |
| JPH0963950A (ja) * | 1995-08-25 | 1997-03-07 | Mitsubishi Electric Corp | 薄膜半導体の製造方法 |
| JP3609893B2 (ja) * | 1996-02-05 | 2005-01-12 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP2002176007A (ja) * | 2000-12-08 | 2002-06-21 | Mitsubishi Electric Corp | レーザ処理装置のレーザパワーの測定方法と測定装置 |
| JP3908124B2 (ja) * | 2001-09-07 | 2007-04-25 | 株式会社半導体エネルギー研究所 | レーザー装置及びレーザー照射方法 |
| JP2003332258A (ja) * | 2002-05-15 | 2003-11-21 | Sony Corp | レーザアニール装置、半導体デバイス、及び半導体デバイスの製造方法。 |
-
2005
- 2005-06-14 JP JP2005173119A patent/JP4963163B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006032926A (ja) | 2006-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7521368B2 (en) | Method for manufacturing semiconductor device | |
| CN100481316C (zh) | 激光处理装置、激光照射方法及半导体装置的制作方法 | |
| JP3980465B2 (ja) | 半導体装置の作製方法 | |
| TWI392177B (zh) | 雷射照射裝置,雷射照射方法,和結晶半導體膜的製造方法 | |
| KR101438379B1 (ko) | 결정성 반도체막의 제조방법 및 박막트랜지스터의 제조방법 | |
| US7358165B2 (en) | Semiconductor device and method for manufacturing semiconductor device | |
| JP2012151483A (ja) | 半導体装置の作製方法、及び半導体装置 | |
| JP5364282B2 (ja) | 半導体装置の作製方法 | |
| JP2003051446A (ja) | 半導体装置の作製方法 | |
| KR20030011724A (ko) | 레이저 조사 디바이스, 레이저 조사 방법 및 반도체디바이스 제조 방법 | |
| JP2004158720A6 (ja) | レーザー装置及びレーザー照射方法 | |
| JP5025095B2 (ja) | 半導体装置の作製方法 | |
| US7459406B2 (en) | Laser processing unit, laser processing method, and method for manufacturing semiconductor device | |
| CN100474502C (zh) | 半导体器件的制造方法 | |
| JP4963163B2 (ja) | レーザ処理装置及び半導体装置の作製方法 | |
| JP5201790B2 (ja) | 半導体装置の作製方法 | |
| JP4628032B2 (ja) | 半導体装置及びその作製方法 | |
| JP4578877B2 (ja) | 半導体装置及びその作製方法 | |
| JP4583797B2 (ja) | 半導体装置の作製方法 | |
| JP4584075B2 (ja) | 半導体装置の作製方法 | |
| JP5030405B2 (ja) | 半導体装置の作製方法 | |
| JP4907063B2 (ja) | 半導体装置の作製方法 | |
| JP4079655B2 (ja) | 半導体装置およびその作製方法 | |
| JP2003151916A (ja) | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 | |
| JP4624023B2 (ja) | 半導体装置、及びその作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080611 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080611 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100217 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111206 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120130 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120321 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120322 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150406 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150406 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |