JP4957394B2 - セラミック電子部品及びその製造方法 - Google Patents
セラミック電子部品及びその製造方法 Download PDFInfo
- Publication number
- JP4957394B2 JP4957394B2 JP2007148019A JP2007148019A JP4957394B2 JP 4957394 B2 JP4957394 B2 JP 4957394B2 JP 2007148019 A JP2007148019 A JP 2007148019A JP 2007148019 A JP2007148019 A JP 2007148019A JP 4957394 B2 JP4957394 B2 JP 4957394B2
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- JP
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- Prior art keywords
- sintered body
- ceramic sintered
- ceramic
- electronic component
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims description 172
- 238000000034 method Methods 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000007747 plating Methods 0.000 claims description 62
- 238000005498 polishing Methods 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 75
- 229910000679 solder Inorganic materials 0.000 description 31
- 239000003990 capacitor Substances 0.000 description 23
- 230000035882 stress Effects 0.000 description 23
- 238000012360 testing method Methods 0.000 description 16
- 230000008646 thermal stress Effects 0.000 description 11
- 238000010521 absorption reaction Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910020836 Sn-Ag Inorganic materials 0.000 description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000008642 heat stress Effects 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007148019A JP4957394B2 (ja) | 2007-06-04 | 2007-06-04 | セラミック電子部品及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007148019A JP4957394B2 (ja) | 2007-06-04 | 2007-06-04 | セラミック電子部品及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008300769A JP2008300769A (ja) | 2008-12-11 |
JP2008300769A5 JP2008300769A5 (enrdf_load_stackoverflow) | 2012-03-22 |
JP4957394B2 true JP4957394B2 (ja) | 2012-06-20 |
Family
ID=40173958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007148019A Active JP4957394B2 (ja) | 2007-06-04 | 2007-06-04 | セラミック電子部品及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4957394B2 (enrdf_load_stackoverflow) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4985485B2 (ja) * | 2008-03-10 | 2012-07-25 | Tdk株式会社 | 表面実装型電子部品及び電子部品の実装構造 |
JP5899609B2 (ja) * | 2010-08-06 | 2016-04-06 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその製造方法 |
JP5267583B2 (ja) * | 2011-01-21 | 2013-08-21 | 株式会社村田製作所 | 積層セラミック電子部品 |
DE102011056515B4 (de) * | 2011-12-16 | 2023-12-07 | Tdk Electronics Ag | Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements |
CN104145317B (zh) | 2012-03-05 | 2016-12-21 | 株式会社村田制作所 | 电子部件 |
KR101645625B1 (ko) * | 2012-03-05 | 2016-08-05 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자 부품, 전자 부품과 접합 대상물의 접합 구조체의 형성방법 |
JP5888289B2 (ja) * | 2013-07-03 | 2016-03-16 | 株式会社村田製作所 | 電子部品 |
JP2015111655A (ja) * | 2013-10-29 | 2015-06-18 | 株式会社村田製作所 | セラミック電子部品 |
JP6413259B2 (ja) * | 2014-02-28 | 2018-10-31 | Tdk株式会社 | 積層セラミックコンデンサ及び実装構造 |
JP6483400B2 (ja) * | 2014-10-24 | 2019-03-13 | 京セラ株式会社 | 積層型コンデンサおよび実装構造 |
JP6065135B2 (ja) * | 2015-04-02 | 2017-01-25 | 日亜化学工業株式会社 | 発光装置 |
JP6688035B2 (ja) * | 2015-10-20 | 2020-04-28 | Koa株式会社 | チップ抵抗器 |
JP7131897B2 (ja) * | 2017-09-27 | 2022-09-06 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
JP7437866B2 (ja) * | 2017-11-14 | 2024-02-26 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
JP2020009967A (ja) * | 2018-07-11 | 2020-01-16 | 三菱マテリアル株式会社 | サーミスタ及びその製造方法 |
KR102048155B1 (ko) | 2018-09-05 | 2019-11-22 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR102029597B1 (ko) * | 2018-09-05 | 2019-10-08 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
JP6904383B2 (ja) * | 2019-07-17 | 2021-07-14 | Tdk株式会社 | 積層電子部品およびその実装構造 |
KR102760394B1 (ko) | 2020-02-21 | 2025-02-03 | 삼성전기주식회사 | 적층형 전자 부품 |
JP7363585B2 (ja) * | 2020-03-04 | 2023-10-18 | Tdk株式会社 | 積層コイル部品 |
JP7415801B2 (ja) * | 2020-05-29 | 2024-01-17 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP7653799B2 (ja) * | 2021-02-25 | 2025-03-31 | 太陽誘電株式会社 | セラミック電子部品、回路基板およびセラミック電子部品の製造方法 |
JP7468492B2 (ja) | 2021-10-04 | 2024-04-16 | 株式会社村田製作所 | 電子部品およびコイル部品 |
KR20230102525A (ko) | 2021-12-30 | 2023-07-07 | 삼성전기주식회사 | 적층형 전자 부품 |
JP7619521B2 (ja) | 2022-03-10 | 2025-01-22 | 株式会社村田製作所 | 電子部品 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3064556B2 (ja) * | 1991-09-24 | 2000-07-12 | 株式会社村田製作所 | チップ型電子部品 |
JPH1050547A (ja) * | 1996-08-05 | 1998-02-20 | Matsushita Electric Ind Co Ltd | 積層セラミックコンデンサ |
JP4403825B2 (ja) * | 2004-02-23 | 2010-01-27 | 株式会社村田製作所 | チップ状セラミック電子部品およびその製造方法 |
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2007
- 2007-06-04 JP JP2007148019A patent/JP4957394B2/ja active Active
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Publication number | Publication date |
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