JP4951276B2 - 半導体チップおよび半導体装置 - Google Patents

半導体チップおよび半導体装置 Download PDF

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Publication number
JP4951276B2
JP4951276B2 JP2006148399A JP2006148399A JP4951276B2 JP 4951276 B2 JP4951276 B2 JP 4951276B2 JP 2006148399 A JP2006148399 A JP 2006148399A JP 2006148399 A JP2006148399 A JP 2006148399A JP 4951276 B2 JP4951276 B2 JP 4951276B2
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Prior art keywords
pads
region
pad
semiconductor chip
main surface
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Japanese (ja)
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JP2007318014A (ja
JP2007318014A5 (enExample
Inventor
直純 森野
和孝 森
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Renesas Electronics Corp
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Renesas Electronics Corp
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Publication of JP2007318014A5 publication Critical patent/JP2007318014A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP2006148399A 2006-05-29 2006-05-29 半導体チップおよび半導体装置 Active JP4951276B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006148399A JP4951276B2 (ja) 2006-05-29 2006-05-29 半導体チップおよび半導体装置

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Application Number Priority Date Filing Date Title
JP2006148399A JP4951276B2 (ja) 2006-05-29 2006-05-29 半導体チップおよび半導体装置

Publications (3)

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JP2007318014A JP2007318014A (ja) 2007-12-06
JP2007318014A5 JP2007318014A5 (enExample) 2009-07-02
JP4951276B2 true JP4951276B2 (ja) 2012-06-13

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100719157B1 (ko) * 1999-12-21 2007-05-17 소니 가부시끼 가이샤 더빙시스템 및 더빙방법
US10020288B2 (en) 2015-10-06 2018-07-10 Samsung Electronics Co., Ltd. Semiconductor chips including redistribution interconnections and related semiconductor packages

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5027605B2 (ja) 2007-09-25 2012-09-19 パナソニック株式会社 半導体装置
JP4422753B2 (ja) * 2007-12-14 2010-02-24 シャープ株式会社 半導体装置
JP2009246218A (ja) 2008-03-31 2009-10-22 Renesas Technology Corp 半導体装置の製造方法および半導体装置
JP5160295B2 (ja) 2008-04-30 2013-03-13 ルネサスエレクトロニクス株式会社 半導体装置及び検査方法
JP5160498B2 (ja) 2009-05-20 2013-03-13 ルネサスエレクトロニクス株式会社 半導体装置
JP2012151269A (ja) * 2011-01-19 2012-08-09 Seiko Epson Corp 半導体装置、及び半導体装置の製造方法
JP6519135B2 (ja) 2014-09-26 2019-05-29 日亜化学工業株式会社 発光装置及び発光装置用基板
JP6012688B2 (ja) * 2014-10-24 2016-10-25 ルネサスエレクトロニクス株式会社 半導体装置
CN106680547A (zh) * 2015-11-10 2017-05-17 上海和辉光电有限公司 一种测试垫布局结构及电性测试方法
JP6649189B2 (ja) * 2016-06-27 2020-02-19 ルネサスエレクトロニクス株式会社 半導体装置
JP6767789B2 (ja) * 2016-06-29 2020-10-14 ローム株式会社 半導体装置
JP6901902B2 (ja) * 2017-04-27 2021-07-14 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN110729252B (zh) * 2019-10-31 2021-12-24 中国电子科技集团公司第十三研究所 0.4mm节距的陶瓷四边引线扁平外壳
CN114973970A (zh) * 2022-06-28 2022-08-30 合肥维信诺科技有限公司 显示面板
CN116313859B (zh) * 2023-05-26 2023-09-15 青岛泰睿思微电子有限公司 悬臂产品的焊线方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127852A (ja) * 1983-01-12 1984-07-23 Matsushita Electronics Corp 半導体装置
JP2001264391A (ja) * 2000-03-17 2001-09-26 Mitsubishi Materials Corp 電極端子及び該電極端子を有する回路素子
JP2002076075A (ja) * 2000-08-24 2002-03-15 Nec Corp 半導体集積回路
JP2002329742A (ja) * 2001-05-07 2002-11-15 Mitsubishi Electric Corp 半導体装置
WO2006134643A1 (ja) * 2005-06-14 2006-12-21 Renesas Technology Corp. 半導体装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100719157B1 (ko) * 1999-12-21 2007-05-17 소니 가부시끼 가이샤 더빙시스템 및 더빙방법
US10020288B2 (en) 2015-10-06 2018-07-10 Samsung Electronics Co., Ltd. Semiconductor chips including redistribution interconnections and related semiconductor packages

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