JP4422753B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4422753B2 JP4422753B2 JP2007323764A JP2007323764A JP4422753B2 JP 4422753 B2 JP4422753 B2 JP 4422753B2 JP 2007323764 A JP2007323764 A JP 2007323764A JP 2007323764 A JP2007323764 A JP 2007323764A JP 4422753 B2 JP4422753 B2 JP 4422753B2
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Description
本発明の一実施形態について図面に基づいて説明すれば、以下の通りである。
本発明の他の実施の形態について図面に基づいて説明すれば、以下の通りである。なお、本実施の形態において説明すること以外の構成は、前記実施の形態1と同じである。また、説明の便宜上、前記の実施の形態1の図面に示した部材と同一の機能を有する部材については、同一の符号を付し、その説明を省略する。
11 半導体素子
12 素子金属バンプ(素子突起電極)
13 素子パッドメタル(素子金属部)
14 素子配線
15 絶縁保護膜
16 導電部
21 インターポーザ基板
22 第1基板金属バンプ(基板突起電極)
23 第1基板パッドメタル(基板金属部)
24 基板配線
25 絶縁保護膜
26 導電部
27 第2基板金属バンプ
28 第2基板パッドメタル
31 フィルム基板(基板)
32 配線
33,43 絶縁保護膜
34 孔
35,45 アンダーフィル材
40 半導体装置
41 フィルム基板
42 配線(基板金属部、基板配線)
Claims (3)
- 基板に実装されたインターポーザ基板と、前記インターポーザ基板に実装された半導体素子とを備え、前記インターポーザ基板は、前記半導体素子が実装される位置に形成された複数個の基板金属部と、前記各基板金属部の上にそれぞれ形成された複数個の基板突起電極と、前記各基板金属部にそれぞれ接続された複数本の基板配線とを有し、前記半導体素子は、前記各基板突起電極とそれぞれ熱圧着により接合した複数個の素子突起電極と、前記各素子突起電極の下にそれぞれ形成された複数個の素子金属部と、前記各素子金属部にそれぞれ接続された複数本の素子配線とを有する半導体装置であって、
前記各基板金属部および前記各素子金属部は、各角が外側に向かって突き出る多角形状をしており、
前記各基板突起電極および前記各素子突起電極は、直方体の形状を有しており、
前記各基板配線は、それぞれ対応する基板金属部の角の頂点から間隔を空けた位置に接続されているとともに、それぞれ対応する基板突起電極における基板金属部に接する面の短辺側に配置されており、
前記各素子配線は、それぞれ対応する素子金属部の角の頂点から間隔を空けた位置に接続されているとともに、それぞれ対応する素子突起電極における素子金属部に接する面の短辺側に配置されており、
前記各基板突起電極は、それぞれ対応する基板金属部に接する面の長辺が、前記インターポーザ基板における前記各基板突起電極が形成されている面の長辺と垂直になるように配置されており、
前記各素子突起電極は、それぞれ対応する素子金属部に接する面の長辺が、前記半導体素子における前記各素子突起電極が形成されている面の長辺と垂直になるように配置されていることを特徴とする半導体装置。 - 前記各基板突起電極および前記各素子突起電極は、電気抵抗が3×10−8(Ω・m)以下の金属バンプによって構成されていることを特徴とする請求項1に記載の半導体装置。
- 前記各基板突起電極および前記各素子突起電極は、引っ張り強さが1.0×108(Pa)以上の金属バンプによって構成されていることを特徴とする請求項1に記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007323764A JP4422753B2 (ja) | 2007-12-14 | 2007-12-14 | 半導体装置 |
PCT/JP2008/071895 WO2009078275A1 (ja) | 2007-12-14 | 2008-12-02 | 半導体装置 |
TW097148257A TW201001653A (en) | 2007-12-14 | 2008-12-11 | Semiconductor device |
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JPH0429342A (ja) * | 1990-05-24 | 1992-01-31 | Matsushita Electric Ind Co Ltd | フィルムリード |
JP3243956B2 (ja) * | 1995-02-03 | 2002-01-07 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
JPH10233401A (ja) * | 1997-02-19 | 1998-09-02 | Ricoh Co Ltd | 半導体装置 |
JP2003031613A (ja) * | 2001-07-12 | 2003-01-31 | Matsushita Electric Works Ltd | フリップチップ実装体及びフリップチップ実装方法 |
JP4951276B2 (ja) * | 2006-05-29 | 2012-06-13 | ルネサスエレクトロニクス株式会社 | 半導体チップおよび半導体装置 |
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