JP4873005B2 - 複合基板及び複合基板の製造方法 - Google Patents
複合基板及び複合基板の製造方法 Download PDFInfo
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- JP4873005B2 JP4873005B2 JP2008507360A JP2008507360A JP4873005B2 JP 4873005 B2 JP4873005 B2 JP 4873005B2 JP 2008507360 A JP2008507360 A JP 2008507360A JP 2008507360 A JP2008507360 A JP 2008507360A JP 4873005 B2 JP4873005 B2 JP 4873005B2
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
Description
12 基板本体
12a 他方主面
12b 一方主面
16,18 端子
16a 外側縁
16b 内側縁
16c 中心
20 枠体
22 枠部材
23 貫通穴
30 接続部材
32 第1片
32a 先端縁
32b 内側縁
32c 中心
34 中間片
36 第2片
40,42,50 チップ状電子部品
Claims (15)
- 少なくとも一方主面に端子を有する基板本体と、
前記基板本体の前記一方主面に接合される枠体とを備えた複合基板であって、
前記枠体は、
絶縁材料からなり、中央に貫通穴を有し、前記基板本体の前記一方主面の周縁部に沿って枠状に延在する枠部材と、
金属薄板の折り曲げ加工により形成され、中間片の両端にそれぞれ第1片と第2片とが連続する複数の接続部材と、
を有し、
前記複数の接続部材は、
前記枠部材に、前記枠部材の前記貫通穴を介して対向するように配置され、
前記第1片が、前記枠部材の前記基板本体に対向する面に沿って延在し、前記枠部材の前記基板本体側に露出して、前記基板本体の前記一方主面の前記端子に接合され、
前記第2片が、前記枠部材の前記基板本体とは反対側の面に沿って延在し、前記枠部材の前記基板本体とは反対側に露出し、
前記中間片が、前記枠部材の内部を貫通し、前記枠部材に固定され、
前記中間片の前記両端は、前記第1片及び前記第2片の前記枠部材の前記貫通穴側の端部にそれぞれ連続することを特徴とする複合基板。 - チップ状電子部品が前記枠状部材の前記貫通穴内に配置され、前記基板本体の前記一方主面に搭載されていることを特徴とする、請求項1に記載の複合基板。
- 前記チップ状電子部品が樹脂で封止され、該樹脂が前記枠体の一部に接着又は当接していることを特徴とする、請求項2に記載の複合基板。
- 前記枠体の前記接続部材は、金属薄板の打ち抜き加工及び折り曲げ加工により形成され、
前記枠体の前記枠部材は、金型内に前記接続部材となる部分を挿入した状態で成形した樹脂であることを特徴とする、請求項1、2又は3に記載の複合基板。 - 前記基板本体がセラミック基板であることを特徴とする、請求項1〜4のいずれか一項に記載の複合基板。
- 前記基板本体は、1050℃以下で焼結する複数のセラミック層を積層してなるセラミック多層基板であることを特徴とする、請求項1〜5のいずれか一項に記載の複合基板。
- 前記枠体の前記接続部材の前記金属薄板は可撓性を有することを特徴とする、請求項4に記載の複合基板。
- 前記接続部材の厚みは、50μm以上、かつ300μm以下であることを特徴とする、請求項1〜7のいずれか一項に記載の複合基板。
- 前記基板本体の他方主面に、チップ状電子部品が搭載されていることを特徴とする、請求項1〜8のいずれか一項に記載の複合基板。
- 前記枠体の前記接続部材は、前記第2片の先端が、前記枠部材の外周面まで又は該外周面よりも外側まで延在していることを特徴とする、請求項1〜9のいずれか一項に記載の複合基板。
- 前記枠体の前記接続部材は、前記第2片の先端側が折り曲げられて、前記枠部材の外周面に沿って延在していることを特徴とする、請求項1〜9のいずれか一項に記載の複合基板。
- 前記枠体の前記接続部材は、前記第1片の面積が、前記第2片の面積よりも大きいことを特徴とする、請求項1〜9のいずれか一項に記載の複合基板。
- 前記枠体の前記接続部材の前記第1片の中心の位置が、前記基板本体の前記端子の中心の位置よりも、前記枠体の前記貫通穴側にずれていることを特徴とする、請求項1〜9のいずれか一項に記載の複合基板。
- 前記枠体の前記接続部材の前記第1片の前記枠体の前記貫通穴側の内側縁の位置が、前記基板本体の前記端子の前記基板本体の中心側の内側縁の位置よりも、前記枠体の前記貫通穴側にずれ、
前記枠体の前記接続部材の前記第1片の前記枠体の前記貫通穴とは反対側の先端縁の位置が、前記基板本体の前記端子の前記基板本体の中心とは反対側の外側縁の位置よりも、前記枠体の前記貫通穴側にずれていることを特徴とする、請求項1〜9のいずれか一項に記載の複合基板。 - 少なくとも一方主面に端子が設けられた基板本体と、枠体とを準備する第1の工程と、
前記基板本体の前記一方主面に、前記枠体を接合する第2の工程とを備えた、複合基板の製造方法であって、
前記第1の工程において、
前記枠体は、
絶縁材料からなり、中央に貫通穴を有し、前記基板本体の前記一方主面の周縁部に沿って枠状に延在する枠部材と、
金属薄板の折り曲げ加工により形成され、中間片の両端にそれぞれ第1片と第2片とが連続する複数の接続部材と、
を有し、
前記複数の接続部材は、
前記枠部材に、前記枠部材の前記貫通穴を介して対向するように配置され、
前記第1片が、前記枠部材の前記基板本体に対向する面に沿って延在し、前記第2片が、前記枠部材の前記基板本体とは反対側の面に沿って延在し、前記第1片及び第2片が、前記枠部材の前記貫通穴の周囲に延在する前記枠部材の前記面にそれぞれ露出し、
前記中間片が、前記枠部材の内部を貫通し、前記枠部材に固定され、
前記中間片の前記両端に、前記第1片及び前記第2片の前記枠部材の前記貫通穴側の端部がそれぞれ連続し、
前記第2の工程において、
前記枠体は、前記基板本体の一方主面の周縁部に沿って枠状に延在するように配置され、
前記枠体の前記接続部材の前記第1片が、前記基板本体の前記一方主面に設けられた前記端子に接合されることを特徴とする、複合基板の製造方法。
Priority Applications (1)
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JP2008507360A JP4873005B2 (ja) | 2006-03-29 | 2006-09-28 | 複合基板及び複合基板の製造方法 |
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JP2006091960 | 2006-03-29 | ||
PCT/JP2006/319262 WO2007110985A1 (ja) | 2006-03-29 | 2006-09-28 | 複合基板及び複合基板の製造方法 |
JP2008507360A JP4873005B2 (ja) | 2006-03-29 | 2006-09-28 | 複合基板及び複合基板の製造方法 |
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JPWO2007110985A1 JPWO2007110985A1 (ja) | 2009-08-06 |
JP4873005B2 true JP4873005B2 (ja) | 2012-02-08 |
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US (1) | US7851708B2 (ja) |
JP (1) | JP4873005B2 (ja) |
KR (1) | KR101019067B1 (ja) |
DE (1) | DE112006003809T5 (ja) |
WO (1) | WO2007110985A1 (ja) |
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JP5230997B2 (ja) | 2007-11-26 | 2013-07-10 | 新光電気工業株式会社 | 半導体装置 |
US8030752B2 (en) * | 2007-12-18 | 2011-10-04 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing semiconductor package and semiconductor plastic package using the same |
JP5240293B2 (ja) * | 2009-04-02 | 2013-07-17 | 株式会社村田製作所 | 回路基板 |
CN101692441B (zh) * | 2009-04-16 | 2012-04-11 | 旭丽电子(广州)有限公司 | 一种印刷电路板封装结构 |
JPWO2011030542A1 (ja) * | 2009-09-11 | 2013-02-04 | 株式会社村田製作所 | 電子部品モジュールおよびその製造方法 |
JP5529494B2 (ja) * | 2009-10-26 | 2014-06-25 | 株式会社三井ハイテック | リードフレーム |
DE102010026312B4 (de) * | 2010-07-06 | 2022-10-20 | Phoenix Contact Gmbh & Co. Kg | Anschlusskontakt und Verfahren zur Herstellung von Anschlusskontakten |
GB2499850B (en) * | 2012-03-02 | 2014-07-09 | Novalia Ltd | Circuit board assembly |
JP5889718B2 (ja) * | 2012-05-30 | 2016-03-22 | アルプス電気株式会社 | 電子部品の実装構造体及び入力装置、ならびに、前記実装構造体の製造方法 |
WO2014128795A1 (ja) * | 2013-02-22 | 2014-08-28 | パナソニック株式会社 | 電子部品パッケージ |
JP2014179472A (ja) | 2013-03-15 | 2014-09-25 | Murata Mfg Co Ltd | モジュールおよびその製造方法 |
JPWO2016047004A1 (ja) * | 2014-09-25 | 2017-08-31 | 日本電気株式会社 | 電気回路システム、アンテナシステムおよび回路シールドケース |
KR102029495B1 (ko) * | 2014-10-15 | 2019-10-07 | 삼성전기주식회사 | 칩 전자부품 및 그 실장 기판 |
US9190367B1 (en) | 2014-10-22 | 2015-11-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and semiconductor process |
US10109588B2 (en) * | 2015-05-15 | 2018-10-23 | Samsung Electro-Mechanics Co., Ltd. | Electronic component package and package-on-package structure including the same |
CN208597204U (zh) * | 2016-01-07 | 2019-03-12 | 株式会社村田制作所 | 多层基板以及电子设备 |
US9761535B1 (en) * | 2016-06-27 | 2017-09-12 | Nanya Technology Corporation | Interposer, semiconductor package with the same and method for preparing a semiconductor package with the same |
KR102400748B1 (ko) * | 2017-09-12 | 2022-05-24 | 삼성전자 주식회사 | 인터포저를 포함하는 전자 장치 |
KR102259995B1 (ko) * | 2017-10-30 | 2021-06-02 | 니뽄 도쿠슈 도교 가부시키가이샤 | 전극 매설 부재 |
US10910233B2 (en) * | 2018-04-11 | 2021-02-02 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
KR20230119844A (ko) * | 2022-02-08 | 2023-08-16 | 삼성전자주식회사 | 기판 조립체를 포함하는 전자 장치 |
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2006
- 2006-09-28 WO PCT/JP2006/319262 patent/WO2007110985A1/ja active Application Filing
- 2006-09-28 KR KR1020087019617A patent/KR101019067B1/ko active IP Right Grant
- 2006-09-28 DE DE112006003809T patent/DE112006003809T5/de not_active Withdrawn
- 2006-09-28 JP JP2008507360A patent/JP4873005B2/ja active Active
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- 2008-08-06 US US12/186,546 patent/US7851708B2/en active Active
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JPH09148743A (ja) * | 1995-11-20 | 1997-06-06 | Mitsubishi Gas Chem Co Inc | セラミックス/プラスチックスハイブリッド多層プリント板の製造方法 |
JP2000101348A (ja) * | 1998-09-17 | 2000-04-07 | Toyo Commun Equip Co Ltd | 電子部品用パッケージ |
WO2006027888A1 (ja) * | 2004-09-08 | 2006-03-16 | Murata Manufacturing Co., Ltd. | 複合セラミック基板 |
Also Published As
Publication number | Publication date |
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US7851708B2 (en) | 2010-12-14 |
KR101019067B1 (ko) | 2011-03-07 |
WO2007110985A1 (ja) | 2007-10-04 |
US20080289853A1 (en) | 2008-11-27 |
KR20080083359A (ko) | 2008-09-17 |
DE112006003809T5 (de) | 2009-02-12 |
JPWO2007110985A1 (ja) | 2009-08-06 |
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