JP4865772B2 - 金属コロイド粒子およびその分散液 - Google Patents
金属コロイド粒子およびその分散液 Download PDFInfo
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- JP4865772B2 JP4865772B2 JP2008219930A JP2008219930A JP4865772B2 JP 4865772 B2 JP4865772 B2 JP 4865772B2 JP 2008219930 A JP2008219930 A JP 2008219930A JP 2008219930 A JP2008219930 A JP 2008219930A JP 4865772 B2 JP4865772 B2 JP 4865772B2
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- 239000002184 metal Substances 0.000 title claims description 144
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- 239000000084 colloidal system Substances 0.000 claims description 109
- 229920000642 polymer Polymers 0.000 claims description 91
- 239000002082 metal nanoparticle Substances 0.000 claims description 88
- 239000002270 dispersing agent Substances 0.000 claims description 80
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 27
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- 238000004519 manufacturing process Methods 0.000 claims description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 15
- 239000003638 chemical reducing agent Substances 0.000 claims description 11
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- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 8
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- 235000011054 acetic acid Nutrition 0.000 claims description 5
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- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
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- 229910052723 transition metal Inorganic materials 0.000 description 1
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- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
- Colloid Chemistry (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
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| JP5140035B2 (ja) * | 2009-05-25 | 2013-02-06 | 田中貴金属工業株式会社 | 金属ナノ粒子を含有するコロイド溶液 |
| JP5632176B2 (ja) * | 2009-09-30 | 2014-11-26 | 三ツ星ベルト株式会社 | 積層体、この積層体を用いた導電性基材及びその製造方法 |
| US9497859B2 (en) | 2009-09-30 | 2016-11-15 | Dai Nippon Printing Co., Ltd. | Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate |
| JP5456651B2 (ja) * | 2010-01-07 | 2014-04-02 | 八千代工業株式会社 | 金属コロイド、その製造方法およびその応用 |
| EP2608217B1 (en) * | 2011-12-21 | 2014-07-16 | Agfa-Gevaert | A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a sintering additive |
| ES2496440T3 (es) * | 2011-12-21 | 2014-09-19 | Agfa-Gevaert | Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal, un dispersante polimérico y un agente térmicamente escindible |
| WO2014017443A1 (ja) * | 2012-07-24 | 2014-01-30 | Dic株式会社 | 金属ナノ粒子複合体、金属コロイド溶液及びそれらの製造方法 |
| JP6008424B2 (ja) * | 2012-08-23 | 2016-10-19 | 株式会社大阪ソーダ | 金属ナノ粒子の水分散液、及びその製造方法 |
| JP5859949B2 (ja) | 2012-09-27 | 2016-02-16 | 三ツ星ベルト株式会社 | 導電性組成物 |
| JP5827203B2 (ja) | 2012-09-27 | 2015-12-02 | 三ツ星ベルト株式会社 | 導電性組成物 |
| JP5843821B2 (ja) * | 2013-08-13 | 2016-01-13 | Jx日鉱日石金属株式会社 | 金属粉ペースト、及びその製造方法 |
| JP5664739B2 (ja) * | 2013-10-21 | 2015-02-04 | トヨタ自動車株式会社 | 金属ナノ粒子ペースト |
| EP3072931A4 (en) * | 2013-11-22 | 2017-07-26 | Toyo Seikan Group Holdings, Ltd. | Curable resin composition having antibacterial properties |
| JP5994811B2 (ja) * | 2014-04-28 | 2016-09-21 | 大日本印刷株式会社 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
| WO2016067599A1 (ja) * | 2014-10-31 | 2016-05-06 | バンドー化学株式会社 | 接合用組成物 |
| JP6526190B2 (ja) * | 2015-05-28 | 2019-06-05 | 富士フイルム株式会社 | 重合性組成物、波長変換部材、バックライトユニット、および液晶表示装置 |
| JP7157597B2 (ja) * | 2018-08-31 | 2022-10-20 | 花王株式会社 | 水系金属微粒子分散体 |
| KR102302205B1 (ko) | 2018-10-04 | 2021-09-16 | 대주전자재료 주식회사 | 은 분말 및 이의 제조 방법 |
| KR20200038742A (ko) | 2018-10-04 | 2020-04-14 | 대주전자재료 주식회사 | 은 분말 및 이의 제조 방법 |
| JP7570909B2 (ja) | 2019-12-26 | 2024-10-22 | キヤノン株式会社 | 水性インク、インクカートリッジ、及びインクジェット記録方法 |
| US12163037B2 (en) * | 2019-12-26 | 2024-12-10 | Canon Kabushiki Kaisha | Aqueous ink, ink cartridge and ink jet recording method |
| JP6952101B2 (ja) * | 2019-12-27 | 2021-10-20 | 花王株式会社 | 金属微粒子含有インク |
| WO2022145077A1 (ja) | 2020-12-28 | 2022-07-07 | 花王株式会社 | 金属微粒子含有インク |
| EP4596144A1 (en) * | 2022-09-30 | 2025-08-06 | Osaka Soda Co., Ltd. | Silver particles |
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| JP4207161B2 (ja) * | 2005-04-20 | 2009-01-14 | セイコーエプソン株式会社 | マイクロカプセル化金属粒子及びその製造方法、水性分散液、並びに、インクジェット用インク |
| US8083972B2 (en) * | 2005-07-25 | 2011-12-27 | Sumitomo Metal Mining Co., Ltd. | Copper particulate dispersions and method for producing the same |
| JP2007095526A (ja) * | 2005-09-29 | 2007-04-12 | Tokai Rubber Ind Ltd | 導電性ペースト |
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