JP4863897B2 - 基板洗浄装置、基板洗浄方法及び基板洗浄プログラム - Google Patents

基板洗浄装置、基板洗浄方法及び基板洗浄プログラム Download PDF

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Publication number
JP4863897B2
JP4863897B2 JP2007022004A JP2007022004A JP4863897B2 JP 4863897 B2 JP4863897 B2 JP 4863897B2 JP 2007022004 A JP2007022004 A JP 2007022004A JP 2007022004 A JP2007022004 A JP 2007022004A JP 4863897 B2 JP4863897 B2 JP 4863897B2
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JP
Japan
Prior art keywords
hydrogen peroxide
peroxide solution
sulfuric acid
substrate
substrate cleaning
Prior art date
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JP2007022004A
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English (en)
Japanese (ja)
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JP2008183550A (ja
Inventor
幸吉 広城
孝之 戸島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007022004A priority Critical patent/JP4863897B2/ja
Priority to US12/010,745 priority patent/US20080178910A1/en
Priority to EP08001588A priority patent/EP1952899B1/en
Priority to DE602008000514T priority patent/DE602008000514D1/de
Priority to TW097103498A priority patent/TW200845159A/zh
Priority to KR1020080010214A priority patent/KR20080071945A/ko
Publication of JP2008183550A publication Critical patent/JP2008183550A/ja
Application granted granted Critical
Publication of JP4863897B2 publication Critical patent/JP4863897B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2007022004A 2007-01-31 2007-01-31 基板洗浄装置、基板洗浄方法及び基板洗浄プログラム Active JP4863897B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007022004A JP4863897B2 (ja) 2007-01-31 2007-01-31 基板洗浄装置、基板洗浄方法及び基板洗浄プログラム
US12/010,745 US20080178910A1 (en) 2007-01-31 2008-01-29 Substrate cleaning apparatus, substrate cleaning method, and storage medium
EP08001588A EP1952899B1 (en) 2007-01-31 2008-01-29 Substrate cleaning apparatus, substrate cleaning method, and storage medium
DE602008000514T DE602008000514D1 (de) 2007-01-31 2008-01-29 Vorrichtung und Verfahren zur Substratreinigung sowie Speichermedium
TW097103498A TW200845159A (en) 2007-01-31 2008-01-30 Substrate cleaning apparatus and method
KR1020080010214A KR20080071945A (ko) 2007-01-31 2008-01-31 기판 세정 장치, 기판 세정 방법 및 기억 매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007022004A JP4863897B2 (ja) 2007-01-31 2007-01-31 基板洗浄装置、基板洗浄方法及び基板洗浄プログラム

Publications (2)

Publication Number Publication Date
JP2008183550A JP2008183550A (ja) 2008-08-14
JP4863897B2 true JP4863897B2 (ja) 2012-01-25

Family

ID=39341364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007022004A Active JP4863897B2 (ja) 2007-01-31 2007-01-31 基板洗浄装置、基板洗浄方法及び基板洗浄プログラム

Country Status (6)

Country Link
US (1) US20080178910A1 (enExample)
EP (1) EP1952899B1 (enExample)
JP (1) JP4863897B2 (enExample)
KR (1) KR20080071945A (enExample)
DE (1) DE602008000514D1 (enExample)
TW (1) TW200845159A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210089084A (ko) * 2020-01-07 2021-07-15 도쿄엘렉트론가부시키가이샤 기판 처리 장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4762822B2 (ja) 2006-08-03 2011-08-31 東京エレクトロン株式会社 薬液混合方法および薬液混合装置
JP2011129651A (ja) * 2009-12-16 2011-06-30 Renesas Electronics Corp 半導体装置の製造方法、基板処理装置、および、プログラム
CN102834182B (zh) * 2010-04-27 2016-11-02 泰尔Fsi公司 在邻近基板表面处的受控流体混合情况下的微电子基板的湿处理
JP5474840B2 (ja) * 2011-01-25 2014-04-16 東京エレクトロン株式会社 液処理装置および液処理方法
JP6016093B2 (ja) * 2012-09-12 2016-10-26 株式会社Ｓｃｒｅｅｎホールディングス 薬液供給装置、基板処理システム、および基板処理方法
CN108431929B (zh) 2015-11-14 2023-03-31 东京毅力科创株式会社 使用稀释的tmah处理微电子基底的方法
JP6779701B2 (ja) * 2016-08-05 2020-11-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及び基板処理方法を実行させるプログラムが記録された記憶媒体
CN110520965B (zh) * 2017-04-06 2023-06-02 东京毅力科创株式会社 供液装置和供液方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210089084A (ko) * 2020-01-07 2021-07-15 도쿄엘렉트론가부시키가이샤 기판 처리 장치
KR102840892B1 (ko) * 2020-01-07 2025-08-01 도쿄엘렉트론가부시키가이샤 기판 처리 장치

Also Published As

Publication number Publication date
EP1952899B1 (en) 2010-01-13
EP1952899A1 (en) 2008-08-06
TW200845159A (en) 2008-11-16
US20080178910A1 (en) 2008-07-31
TWI373796B (enExample) 2012-10-01
KR20080071945A (ko) 2008-08-05
JP2008183550A (ja) 2008-08-14
DE602008000514D1 (de) 2010-03-04

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