JP4848285B2 - 底板を有する正面開口基板容器 - Google Patents
底板を有する正面開口基板容器 Download PDFInfo
- Publication number
- JP4848285B2 JP4848285B2 JP2006539684A JP2006539684A JP4848285B2 JP 4848285 B2 JP4848285 B2 JP 4848285B2 JP 2006539684 A JP2006539684 A JP 2006539684A JP 2006539684 A JP2006539684 A JP 2006539684A JP 4848285 B2 JP4848285 B2 JP 4848285B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- plate
- opening
- bottom plate
- openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S206/00—Special receptacle or package
- Y10S206/832—Semiconductor wafer boat
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Resistors (AREA)
Description
Claims (7)
- 開口正面を備えた容器部と、前記開口正面を密閉的に閉鎖するドアと、複数のコネクタを介して容器部に連結する底板とを備える基板容器であって、
該容器部は、
互いに連結され、かつ開口内部を画定する一対の対向側壁、底壁、上壁、および背壁と、
該一対の側壁にあるとともに、水平に間隔をおいた配列の複数の基板を支持するために該開口内部内に延びている複数の基板支持体とを備えており、
該底壁は前記開口内部内に開口した複数の底面開口を有しており、
該底板は複数の板開口を有しており、前記底壁の底面および前記底板の上面において前記各板開口が前記複数の底面開口の一つと軸線方向に沿って整合し、
該底板は、放射状に配置されている複数のキネマティックカップリング溝を有しており、
前記複数のコネクタの各々は前記底板の板開口の一つと、整合した前記容器部の複数の底面開口の一つとに挿入され、
前記コネクタの各々は前記開口内部から前記基板容器の外部まで貫通する孔を備える基板容器。 - 前記各コネクタは前記底面開口の一つに配置された第一部材と、前記板開口の一つに配置され、かつ前記第一部材にねじ式で連結される第二部材とを備える請求項1に記載の容器。
- 前記容器部に対する前記底板の垂直方向に沿う位置は、前記第一部材および前記第二部材の一つを回転させることによって調整可能である請求項2に記載の容器。
- 前記コネクタの一つの孔に配置されたフィルタカートリッジ、ブランク、弁の少なくとも一つを更に備える請求項1に記載の容器。
- 前記コネクタの各々は複数の叉付きである請求項2に記載の容器。
- 前記コネクタの各々は1/2インチ(12.7mm)より大きく、3インチ(76.2
mm)より小さな直径を備える請求項1に記載の容器。 - 前記底板と前記容器部との間に配置された衝撃吸収材を更に備える請求項1に記載の容器。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51806403P | 2003-11-07 | 2003-11-07 | |
US60/518,064 | 2003-11-07 | ||
US10/982,400 US7201276B2 (en) | 2003-11-07 | 2004-11-05 | Front opening substrate container with bottom plate |
US10/982,400 | 2004-11-05 | ||
PCT/US2004/037017 WO2005047117A2 (en) | 2003-11-07 | 2004-11-08 | Front opening substrate container with bottom plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007511098A JP2007511098A (ja) | 2007-04-26 |
JP4848285B2 true JP4848285B2 (ja) | 2011-12-28 |
Family
ID=34594888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006539684A Active JP4848285B2 (ja) | 2003-11-07 | 2004-11-08 | 底板を有する正面開口基板容器 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7201276B2 (ja) |
EP (1) | EP1680325A2 (ja) |
JP (1) | JP4848285B2 (ja) |
KR (1) | KR100919733B1 (ja) |
WO (1) | WO2005047117A2 (ja) |
Families Citing this family (49)
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KR101212482B1 (ko) * | 2005-05-06 | 2012-12-17 | 신에츠 폴리머 가부시키가이샤 | 기판 수납용기 및 그 제조 방법 |
JP2007123673A (ja) * | 2005-10-31 | 2007-05-17 | Asyst Shinko Inc | 物品収納用容器の防振機構 |
US8365919B2 (en) * | 2005-12-29 | 2013-02-05 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
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JP4641289B2 (ja) * | 2006-07-27 | 2011-03-02 | 信越ポリマー株式会社 | 基板収納容器 |
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US8146623B2 (en) * | 2007-02-28 | 2012-04-03 | Entegris, Inc. | Purge system for a substrate container |
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TWI357474B (en) * | 2008-10-14 | 2012-02-01 | Gudeng Prec Industral Co Ltd | Gas filling socket, gas filling socket set, and ga |
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JP2011018771A (ja) * | 2009-07-09 | 2011-01-27 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
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-
2004
- 2004-11-05 US US10/982,400 patent/US7201276B2/en active Active
- 2004-11-08 JP JP2006539684A patent/JP4848285B2/ja active Active
- 2004-11-08 EP EP04800826A patent/EP1680325A2/en not_active Withdrawn
- 2004-11-08 WO PCT/US2004/037017 patent/WO2005047117A2/en active Application Filing
-
2006
- 2006-05-06 KR KR1020067008837A patent/KR100919733B1/ko active IP Right Grant
-
2007
- 2007-04-10 US US11/786,035 patent/US7866480B2/en active Active
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US4552288A (en) * | 1983-11-10 | 1985-11-12 | Justrite Manufacturing Company | Automatic venting sealing cap |
JPH11163116A (ja) * | 1997-11-28 | 1999-06-18 | Shin Etsu Polymer Co Ltd | 密封容器 |
JPH11307623A (ja) * | 1998-04-16 | 1999-11-05 | Tokyo Electron Ltd | 被処理体の収納装置及び搬出入ステージ |
JP2002514829A (ja) * | 1998-05-05 | 2002-05-21 | アシスト テクノロジーズ インコーポレイテッド | 独立して支持されたウェーハ・カセットを包含するsmifポッド |
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WO2000033376A1 (fr) * | 1998-12-02 | 2000-06-08 | Dainichi Shoji K.K. | Contenant |
JP2000306988A (ja) * | 1999-04-20 | 2000-11-02 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2002299428A (ja) * | 2001-03-29 | 2002-10-11 | Shin Etsu Polymer Co Ltd | 精密基板収納容器及びその製造方法 |
JP2002359180A (ja) * | 2001-06-01 | 2002-12-13 | Toshiba Corp | ガス循環システム |
US20030047562A1 (en) * | 2001-09-12 | 2003-03-13 | Tzong-Ming Wu | Air vent plug arrangement for clean container |
Also Published As
Publication number | Publication date |
---|---|
KR100919733B1 (ko) | 2009-09-29 |
KR20060088900A (ko) | 2006-08-07 |
WO2005047117A2 (en) | 2005-05-26 |
JP2007511098A (ja) | 2007-04-26 |
US20080017547A1 (en) | 2008-01-24 |
US7866480B2 (en) | 2011-01-11 |
US20050115866A1 (en) | 2005-06-02 |
EP1680325A2 (en) | 2006-07-19 |
US7201276B2 (en) | 2007-04-10 |
WO2005047117A3 (en) | 2005-12-22 |
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