JP4796040B2 - 基板処理装置、基板処理方法、および基板製造方法 - Google Patents

基板処理装置、基板処理方法、および基板製造方法 Download PDF

Info

Publication number
JP4796040B2
JP4796040B2 JP2007305684A JP2007305684A JP4796040B2 JP 4796040 B2 JP4796040 B2 JP 4796040B2 JP 2007305684 A JP2007305684 A JP 2007305684A JP 2007305684 A JP2007305684 A JP 2007305684A JP 4796040 B2 JP4796040 B2 JP 4796040B2
Authority
JP
Japan
Prior art keywords
substrate
processed
unit
processing
pass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007305684A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008078681A (ja
JP2008078681A5 (https=
Inventor
公男 元田
光弘 坂井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007305684A priority Critical patent/JP4796040B2/ja
Publication of JP2008078681A publication Critical patent/JP2008078681A/ja
Publication of JP2008078681A5 publication Critical patent/JP2008078681A5/ja
Application granted granted Critical
Publication of JP4796040B2 publication Critical patent/JP4796040B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2007305684A 2001-03-09 2007-11-27 基板処理装置、基板処理方法、および基板製造方法 Expired - Lifetime JP4796040B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007305684A JP4796040B2 (ja) 2001-03-09 2007-11-27 基板処理装置、基板処理方法、および基板製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001066020 2001-03-09
JP2001066020 2001-03-09
JP2007305684A JP4796040B2 (ja) 2001-03-09 2007-11-27 基板処理装置、基板処理方法、および基板製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002057303A Division JP4114737B2 (ja) 2001-03-09 2002-03-04 処理装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2008314264A Division JP4813540B2 (ja) 2001-03-09 2008-12-10 処理装置
JP2011120646A Division JP2011187987A (ja) 2001-03-09 2011-05-30 基板処理装置

Publications (3)

Publication Number Publication Date
JP2008078681A JP2008078681A (ja) 2008-04-03
JP2008078681A5 JP2008078681A5 (https=) 2008-05-22
JP4796040B2 true JP4796040B2 (ja) 2011-10-19

Family

ID=39350347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007305684A Expired - Lifetime JP4796040B2 (ja) 2001-03-09 2007-11-27 基板処理装置、基板処理方法、および基板製造方法

Country Status (1)

Country Link
JP (1) JP4796040B2 (https=)

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2877998B2 (ja) * 1991-09-03 1999-04-05 キヤノン株式会社 半導体製造装置
JP3338343B2 (ja) * 1992-12-21 2002-10-28 大日本スクリーン製造株式会社 基板処理装置
JPH07175223A (ja) * 1993-12-21 1995-07-14 Dainippon Screen Mfg Co Ltd 基板現像装置
JP3734095B2 (ja) * 1994-09-12 2006-01-11 株式会社ニコン 基板処理装置
JPH08153767A (ja) * 1994-11-29 1996-06-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3597639B2 (ja) * 1996-06-05 2004-12-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JPH1031316A (ja) * 1996-07-17 1998-02-03 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3202929B2 (ja) * 1996-09-13 2001-08-27 東京エレクトロン株式会社 処理システム
JP3450138B2 (ja) * 1996-11-26 2003-09-22 大日本スクリーン製造株式会社 基板処理装置
JP3441321B2 (ja) * 1996-12-05 2003-09-02 大日本スクリーン製造株式会社 基板処理方法及び装置
JPH1126547A (ja) * 1997-06-30 1999-01-29 Sumitomo Precision Prod Co Ltd ウエット処理装置
JPH11251399A (ja) * 1998-02-27 1999-09-17 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11260883A (ja) * 1998-03-09 1999-09-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3499145B2 (ja) * 1998-10-28 2004-02-23 東京エレクトロン株式会社 加熱処理方法、加熱処理装置及び処理システム
JP3456919B2 (ja) * 1998-07-29 2003-10-14 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP3576831B2 (ja) * 1998-09-18 2004-10-13 東京エレクトロン株式会社 処理装置
JP2000195775A (ja) * 1998-12-25 2000-07-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000294616A (ja) * 1999-04-06 2000-10-20 Ebara Corp 仮置台付位置合わせ機構及びポリッシング装置

Also Published As

Publication number Publication date
JP2008078681A (ja) 2008-04-03

Similar Documents

Publication Publication Date Title
JP4049751B2 (ja) 塗布膜形成装置
JP4040025B2 (ja) 塗布膜形成装置
JP3868223B2 (ja) 搬送装置
JP4114737B2 (ja) 処理装置
JP3933524B2 (ja) 基板処理装置
JP4924186B2 (ja) 塗布、現像装置及びその方法並びに記憶媒体
JP4665037B2 (ja) 基板処理システム
JP3649048B2 (ja) レジスト塗布・現像装置、ならびにそれに用いる基板加熱処理装置および基板搬送装置
TWI311633B (en) Decompression drier
JPH08153767A (ja) 基板処理装置
JP2003332192A5 (https=)
KR20230138389A (ko) 기판 처리 장치 및 기판 처리 방법
JP4541396B2 (ja) 塗布膜形成装置、基板搬送方法及び記憶媒体
KR100856532B1 (ko) 처리장치
JP4813540B2 (ja) 処理装置
KR20200026563A (ko) 기판 반송 로봇 및 기판 처리 설비
JP3629437B2 (ja) 処理装置
KR20110066864A (ko) 기판처리장치, 기판처리방법 및 이 기판처리방법을 실행시키기 위한 프로그램을 기록한 기록매체
JP4796040B2 (ja) 基板処理装置、基板処理方法、および基板製造方法
JP4657991B2 (ja) 加熱・冷却処理装置、基板処理装置および基板処理方法
JP3629434B2 (ja) 処理装置
JP4643630B2 (ja) 処理装置
JP2008078681A5 (https=)
JP4619562B2 (ja) 処理装置
JP5132856B2 (ja) 処理装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080402

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110329

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110530

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110726

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110728

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4796040

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140805

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term