JP2003332192A5 - - Google Patents
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- Publication number
- JP2003332192A5 JP2003332192A5 JP2002134882A JP2002134882A JP2003332192A5 JP 2003332192 A5 JP2003332192 A5 JP 2003332192A5 JP 2002134882 A JP2002134882 A JP 2002134882A JP 2002134882 A JP2002134882 A JP 2002134882A JP 2003332192 A5 JP2003332192 A5 JP 2003332192A5
- Authority
- JP
- Japan
- Prior art keywords
- processing
- processing unit
- substrate
- unit
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000012545 processing Methods 0.000 description 621
- 239000000758 substrate Substances 0.000 description 184
- 238000010438 heat treatment Methods 0.000 description 88
- 238000012546 transfer Methods 0.000 description 71
- 238000001816 cooling Methods 0.000 description 38
- 238000000034 method Methods 0.000 description 35
- 238000011161 development Methods 0.000 description 32
- 238000003672 processing method Methods 0.000 description 26
- 238000000576 coating method Methods 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 19
- 239000000112 cooling gas Substances 0.000 description 15
- 239000010408 film Substances 0.000 description 14
- 238000001035 drying Methods 0.000 description 13
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 208000005156 Dehydration Diseases 0.000 description 5
- 230000018044 dehydration Effects 0.000 description 5
- 238000006297 dehydration reaction Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 101000574352 Mus musculus Protein phosphatase 1 regulatory subunit 17 Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000004042 decolorization Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002134882A JP3856125B2 (ja) | 2002-05-10 | 2002-05-10 | 処理方法及び処理装置 |
| KR1020030028823A KR100935971B1 (ko) | 2002-05-10 | 2003-05-07 | 처리방법 및 처리장치 |
| US10/434,128 US6799910B2 (en) | 2002-05-10 | 2003-05-09 | Processing method and processing apparatus |
| CNB031309461A CN1278380C (zh) | 2002-05-10 | 2003-05-09 | 处理方法以及处理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002134882A JP3856125B2 (ja) | 2002-05-10 | 2002-05-10 | 処理方法及び処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003332192A JP2003332192A (ja) | 2003-11-21 |
| JP2003332192A5 true JP2003332192A5 (https=) | 2005-04-07 |
| JP3856125B2 JP3856125B2 (ja) | 2006-12-13 |
Family
ID=29397476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002134882A Expired - Lifetime JP3856125B2 (ja) | 2002-05-10 | 2002-05-10 | 処理方法及び処理装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6799910B2 (https=) |
| JP (1) | JP3856125B2 (https=) |
| KR (1) | KR100935971B1 (https=) |
| CN (1) | CN1278380C (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3810726B2 (ja) * | 2002-10-03 | 2006-08-16 | 三菱重工業株式会社 | 基板加熱制御システム及び基板加熱制御方法 |
| US7113253B2 (en) * | 2003-09-16 | 2006-09-26 | Asml Netherlands B.V. | Method, apparatus and computer product for substrate processing |
| JP4579029B2 (ja) * | 2005-03-30 | 2010-11-10 | 株式会社Sokudo | 基板処理装置 |
| JP4619854B2 (ja) * | 2005-04-18 | 2011-01-26 | 東京エレクトロン株式会社 | ロードロック装置及び処理方法 |
| JP4811860B2 (ja) * | 2006-05-10 | 2011-11-09 | 東京エレクトロン株式会社 | 熱処理方法、そのプログラム及び熱処理装置 |
| JP2008103384A (ja) * | 2006-10-17 | 2008-05-01 | Elpida Memory Inc | レジストパターンの形成方法およびレジスト塗布現像装置 |
| JP4687682B2 (ja) * | 2007-03-30 | 2011-05-25 | 東京エレクトロン株式会社 | 塗布、現像装置及びその方法並びに記憶媒体 |
| US20100192844A1 (en) * | 2009-01-30 | 2010-08-05 | Semes Co., Ltd. | Apparatus and method for treating substrate |
| CN101794710B (zh) | 2009-01-30 | 2012-10-03 | 细美事有限公司 | 用于处理基板的系统及方法 |
| JP5338777B2 (ja) * | 2010-09-02 | 2013-11-13 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
| JP6123740B2 (ja) | 2014-06-17 | 2017-05-10 | トヨタ自動車株式会社 | 半導体装置の製造ライン及び半導体装置の製造方法 |
| JP6918461B2 (ja) * | 2016-09-23 | 2021-08-11 | 東京エレクトロン株式会社 | 減圧乾燥システム、および減圧乾燥方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR950034648A (ko) * | 1994-05-25 | 1995-12-28 | 김광호 | 반도체장치의 제조방법 |
| US5849602A (en) * | 1995-01-13 | 1998-12-15 | Tokyo Electron Limited | Resist processing process |
| JPH1030317A (ja) * | 1996-07-16 | 1998-02-03 | Buresuto:Kk | 壁紙及び壁紙の裏打紙の剥離方法 |
| JP3393035B2 (ja) * | 1997-05-06 | 2003-04-07 | 東京エレクトロン株式会社 | 制御装置及び半導体製造装置 |
| JP3729987B2 (ja) * | 1997-07-29 | 2005-12-21 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| TW385488B (en) * | 1997-08-15 | 2000-03-21 | Tokyo Electron Ltd | substrate processing device |
| JP3719839B2 (ja) * | 1998-01-19 | 2005-11-24 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP3769426B2 (ja) | 1999-09-22 | 2006-04-26 | 東京エレクトロン株式会社 | 絶縁膜形成装置 |
| US6402400B1 (en) * | 1999-10-06 | 2002-06-11 | Tokyo Electron Limited | Substrate processing apparatus |
| JP2001358045A (ja) * | 2000-06-09 | 2001-12-26 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
-
2002
- 2002-05-10 JP JP2002134882A patent/JP3856125B2/ja not_active Expired - Lifetime
-
2003
- 2003-05-07 KR KR1020030028823A patent/KR100935971B1/ko not_active Expired - Lifetime
- 2003-05-09 US US10/434,128 patent/US6799910B2/en not_active Expired - Lifetime
- 2003-05-09 CN CNB031309461A patent/CN1278380C/zh not_active Expired - Lifetime
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