JP4791444B2 - 半導体パッケージ用プリント基板の製造方法 - Google Patents
半導体パッケージ用プリント基板の製造方法 Download PDFInfo
- Publication number
- JP4791444B2 JP4791444B2 JP2007337444A JP2007337444A JP4791444B2 JP 4791444 B2 JP4791444 B2 JP 4791444B2 JP 2007337444 A JP2007337444 A JP 2007337444A JP 2007337444 A JP2007337444 A JP 2007337444A JP 4791444 B2 JP4791444 B2 JP 4791444B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- electroless
- circuit board
- printed circuit
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 59
- 238000004519 manufacturing process Methods 0.000 title claims description 48
- 238000000034 method Methods 0.000 title description 28
- 238000007747 plating Methods 0.000 claims description 135
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 70
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 45
- 239000010931 gold Substances 0.000 claims description 45
- 229910052737 gold Inorganic materials 0.000 claims description 45
- 229910052759 nickel Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 19
- 230000000873 masking effect Effects 0.000 description 17
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000004381 surface treatment Methods 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000002507 cathodic stripping potentiometry Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
101、301:樹脂基板
302:ポリイミド
102、105、303、306:ワイヤーボンディング用パッド
103、104、304、305:SMD実装用パッド
307:ZIFコネクター用パッド
308:カバーレイ接着剤
106、309:ソルダレジスト層
310:鍍金レジスト
107、108、109、110、311、312、313、314:ENIG層
111、112、113、315、316、317、318:電解金鍍金層
Claims (8)
- (a)ワイヤーボンディング用パッドと表面実装部品実装用パッドを含む、一定の回路パターンが形成されたパッケージ用プリント基板を提供するステップと、
(b)前記プリント基板のワイヤーボンディング用パッド及び表面実装部品実装用パッドを除いた部分にソルダレジスト層を形成するステップと、
(c)無電解ニッケル鍍金及び無電解金鍍金によって、前記ワイヤーボンディング用パッド及び表面実装部品実装用パッドに無電解ニッケル鍍金層及び無電解金鍍金層を形成するステップと、
(d)電解金鍍金によって、前記表面実装部品実装用パッドの無電解ニッケル鍍金層及び無電解金鍍金層のうち、鍍金引入線が連結された無電解ニッケル鍍金層及び無電解金鍍金層と、前記ワイヤーボンディング用パッドの無電解ニッケル鍍金層及び無電解金鍍金層に電解金鍍金層を形成するステップと
を含むことを特徴とする、半導体パッケージ用プリント基板の製造方法。 - 前記無電解ニッケル鍍金層及び無電解金鍍金層のうち、無電解金鍍金層の厚さは0.01〜0.1μmであることを特徴とする、請求項1に記載の半導体パッケージ用プリント基板の製造方法。
- 前記無電解ニッケル鍍金層及び無電解金鍍金層のうち、無電解ニッケル鍍金層の厚さは0.3〜15μmであることを特徴とする、請求項1に記載の半導体パッケージ用プリント基板の製造方法。
- 前記電解金鍍金層の厚さは0.1〜1.0μmであることを特徴とする、請求項1に記載の半導体パッケージ用プリント基板の製造方法。
- (a)ワイヤーボンディング用パッド、表面実装部品実装用パッド及び無挿入力コネクター用パッドを含む、一定の回路パターンが形成されたパッケージ用プリント基板を提供するステップと、
(b)前記プリント基板のワイヤーボンディング用パッド、表面実装部品実装用パッド及び無挿入力コネクター用パッドを除いた部分にソルダレジスト層を形成するステップと、
(c)前記ワイヤーボンディング用パッドと表面実装部品実装用パッドを除いた部分に鍍金レジストを塗布するステップと、
(d)無電解ニッケル鍍金及び無電解金鍍金によって、前記ワイヤーボンディング用パッドと表面実装部品実装用パッドに無電解ニッケル鍍金層及び無電解金鍍金層を形成するステップと、
(e)前記鍍金レジストを除去するステップと、
(f)電解金鍍金によって、前記表面実装部品実装用パッドの無電解ニッケル鍍金層及び無電解金鍍金層のうち、鍍金引入線が連結された無電解ニッケル鍍金層及び無電解金鍍金層と、前記ワイヤーボンディング用パッドの無電解ニッケル鍍金層及び無電解金鍍金層及び無挿入力コネクター用パッドに電解金鍍金層を形成するステップと
を含むことを特徴とする、半導体パッケージ用プリント基板の製造方法。 - 前記無電解ニッケル鍍金層及び無電解金鍍金層のうち、無電解金鍍金層の厚さは0.01〜0.1μmであることを特徴とする、請求項5に記載の半導体パッケージ用プリント基板の製造方法。
- 前記無電解ニッケル鍍金層及び無電解金鍍金層のうち、無電解ニッケル鍍金層の厚さは0.3〜15μmであることを特徴とする、請求項5に記載の半導体パッケージ用プリント基板の製造方法。
- 前記電解金鍍金層の厚さは0.1〜1.0μmであることを特徴とする、請求項5に記載の半導体パッケージ用プリント基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070037892A KR100826360B1 (ko) | 2007-04-18 | 2007-04-18 | 반도체 패키지용 인쇄회로기판의 제조방법 |
KR10-2007-0037892 | 2007-04-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008270718A JP2008270718A (ja) | 2008-11-06 |
JP4791444B2 true JP4791444B2 (ja) | 2011-10-12 |
Family
ID=39649389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007337444A Expired - Fee Related JP4791444B2 (ja) | 2007-04-18 | 2007-12-27 | 半導体パッケージ用プリント基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080257742A1 (ja) |
JP (1) | JP4791444B2 (ja) |
KR (1) | KR100826360B1 (ja) |
CN (1) | CN101290888B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009295958A (ja) * | 2008-05-09 | 2009-12-17 | Panasonic Corp | 半導体装置 |
KR101032704B1 (ko) | 2009-04-14 | 2011-05-06 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR101039329B1 (ko) | 2009-06-24 | 2011-06-08 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR101114260B1 (ko) * | 2009-11-25 | 2012-02-27 | 주식회사 심텍 | 양면 금도금 공법을 이용하는 인쇄회로기판의 제조 방법 |
CN101845625B (zh) * | 2010-06-01 | 2012-03-21 | 无锡阿尔法电子科技有限公司 | 一种在电容式触摸屏表面进行化学镀金的方法 |
KR101980666B1 (ko) * | 2011-12-19 | 2019-08-29 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
KR101552196B1 (ko) | 2014-11-07 | 2015-09-11 | 제이앤디써키트주식회사 | 발광 소자가 실장가능한 인쇄 회로 기판의 제조 방법 |
KR102531762B1 (ko) | 2017-09-29 | 2023-05-12 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
US10347507B2 (en) | 2017-09-29 | 2019-07-09 | Lg Innotek Co., Ltd. | Printed circuit board |
CN114883252B (zh) * | 2022-05-26 | 2024-02-23 | 业成光电(深圳)有限公司 | 基板电镀方法、基板、显示面板、显示装置及电子设备 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4472765A (en) * | 1982-09-13 | 1984-09-18 | Hughes Electronic Devices Corporation | Circuit structure |
JPH02185094A (ja) * | 1989-01-12 | 1990-07-19 | Hitachi Chem Co Ltd | ピングリツド・アレイパツケージ用配線板の製造法 |
JP2859741B2 (ja) * | 1990-12-21 | 1999-02-24 | イビデン株式会社 | プリント配線板の製造方法 |
KR0145768B1 (ko) * | 1994-08-16 | 1998-08-01 | 김광호 | 리드 프레임과 그를 이용한 반도체 패키지 제조방법 |
JPH1079568A (ja) * | 1996-09-05 | 1998-03-24 | Toshiba Corp | プリント配線板の製造方法 |
US6360434B1 (en) * | 2000-02-23 | 2002-03-26 | Telaxis Communications Corporation | Circuit fabrication |
JP2002261186A (ja) * | 2001-03-02 | 2002-09-13 | Hitachi Chem Co Ltd | 半導体搭載用基板とその製造方法とそれを用いた半導体パッケージ並びにその製造方法 |
US20030070931A1 (en) * | 2001-10-17 | 2003-04-17 | Honeywell Advanced Circuits, Inc. | Selective plating of printed circuit boards |
US6661098B2 (en) * | 2002-01-18 | 2003-12-09 | International Business Machines Corporation | High density area array solder microjoining interconnect structure and fabrication method |
KR100499006B1 (ko) * | 2002-12-30 | 2005-07-01 | 삼성전기주식회사 | 도금 인입선이 없는 패키지 기판의 제조 방법 |
KR100584965B1 (ko) * | 2003-02-24 | 2006-05-29 | 삼성전기주식회사 | 패키지 기판 및 그 제조 방법 |
CN100405881C (zh) * | 2003-03-18 | 2008-07-23 | 日本特殊陶业株式会社 | 接线板 |
JP2004349414A (ja) | 2003-05-21 | 2004-12-09 | Nagase & Co Ltd | 回路基板とその製造方法 |
KR100548612B1 (ko) * | 2003-09-29 | 2006-01-31 | 삼성전기주식회사 | 도금 인입선이 없는 인쇄회로기판 및 그 제조 방법 |
JP2005277124A (ja) * | 2004-03-25 | 2005-10-06 | Sanyo Electric Co Ltd | 回路基板及びそれを備える表示装置 |
-
2007
- 2007-04-18 KR KR1020070037892A patent/KR100826360B1/ko not_active IP Right Cessation
- 2007-12-27 JP JP2007337444A patent/JP4791444B2/ja not_active Expired - Fee Related
- 2007-12-28 CN CN2007103060907A patent/CN101290888B/zh not_active Expired - Fee Related
-
2008
- 2008-01-08 US US12/007,243 patent/US20080257742A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR100826360B1 (ko) | 2008-05-02 |
CN101290888A (zh) | 2008-10-22 |
JP2008270718A (ja) | 2008-11-06 |
CN101290888B (zh) | 2012-05-23 |
US20080257742A1 (en) | 2008-10-23 |
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