JP4757815B2 - 電動機の制御装置および車両 - Google Patents
電動機の制御装置および車両 Download PDFInfo
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- B60L3/00—Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
- B60L3/0023—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train
- B60L3/003—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train relating to inverters
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- B60L3/0023—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train
- B60L3/0069—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train relating to the isolation, e.g. ground fault or leak current
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- B60L3/00—Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
- B60L3/04—Cutting off the power supply under fault conditions
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/50—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells
- B60L50/51—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells characterised by AC-motors
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P29/00—Arrangements for regulating or controlling electric motors, appropriate for both AC and DC motors
- H02P29/02—Providing protection against overload without automatic interruption of supply
- H02P29/032—Preventing damage to the motor, e.g. setting individual current limits for different drive conditions
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R31/42—AC power supplies
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- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/37147—Copper [Cu] as principal constituent
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- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/64—Electric machine technologies in electromobility
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Description
また、本発明では、前記した如く前記短絡故障時制御手段による前記インバータ回路のスイッチ素子の制御後に前記電源スイッチを遮断状態に制御する手段をさらに備えるので、直流電源に微小な脈動電流が流れるのが防止され、ひいては、直流電源の劣化などが防止される。
Claims (3)
- スイッチ素子と該スイッチ素子に並列に接続された還流ダイオードとを含むスイッチ部が各相のアームの正極側と負極側とに設けられた複数相のインバータ回路を介して直流電源から電力が供給される電動機の制御装置において、
前記電動機の運転中に前記インバータ回路のいずれかのスイッチ部が継続的に導通状態となる短絡故障状態の発生を検知する短絡故障検知手段と、
該短絡故障検知手段により短絡故障状態の発生が検知された後、前記短絡故障状態が発生したスイッチ部である短絡故障スイッチ部が正極側であるか負極側であるかを判断する短絡故障極性判断手段と、
前記インバータ回路のスイッチ部のうち、該短絡故障極性判断手段により判断された短絡故障スイッチ部の極性と同極側の全てのスイッチ部が導通状態となり、且つ、該短絡故障スイッチ部と異なる極側の全てのスイッチ部のスイッチ素子が遮断状態となるように少なくとも該短絡故障スイッチ部のスイッチ素子以外の各スイッチ素子を制御する短絡故障時制御手段とを備え、
前記短絡故障検知手段は、前記電動機の運転中に前記インバータ回路のいずれかの相に対応するアームの正極側のスイッチ部と負極側のスイッチ部とが同時に導通状態となったときに短絡故障状態が発生したことを検知する手段であり、
前記短絡故障極性判断手段は、前記直流電源とインバータ回路との間の通電経路に設けられた電源スイッチを導通状態に維持しつつ、前記インバータ回路の正極側および負極側のいずれか一方の極側の全てのスイッチ素子に対して、該スイッチ素子を導通状態にするための制御信号を付与し、且つ他方の極側の全てのスイッチ素子に対して、該スイッチ素子を遮断状態にするめたの制御信号を付与した状態で、前記短絡故障検知手段により短絡故障状態の発生が検知されるか否かに基づいて、前記短絡故障スイッチ部が正極側であるか負極側であるかを判断し、
前記短絡故障時制御手段による前記インバータ回路のスイッチ素子の制御後に前記電源スイッチを遮断状態に制御する手段をさらに備えることを特徴とする電動機の制御装置。 - スイッチ素子と該スイッチ素子に並列に接続された還流ダイオードとを含むスイッチ部が各相のアームの正極側と負極側とに設けられた複数相のインバータ回路を介して直流電源から電力が供給される電動機を車両の推進力発生要素として備えた車両において、
前記電動機の運転中に前記インバータ回路のいずれかのスイッチ部が継続的に導通状態となる短絡故障状態の発生を検知する短絡故障検知手段と、
該短絡故障検知手段により短絡故障状態の発生が検知された後、前記短絡故障状態が発生したスイッチ部である短絡故障スイッチ部が正極側であるか負極側であるかを判断する短絡故障極性判断手段と、
前記インバータ回路のスイッチ部のうち、該短絡故障極性判断手段により判断された短絡故障スイッチ部の極性と同極側の全てのスイッチ部が導通状態となり、且つ、該短絡故障スイッチ部と異なる極側の全てのスイッチ素子が遮断状態となるように少なくとも該短絡故障スイッチ部のスイッチ素子以外の各スイッチ素子を制御する短絡故障時制御手段とを備え、
前記短絡故障検知手段は、前記電動機の運転中に前記インバータ回路のいずれかの相に対応するアームの正極側のスイッチ部と負極側のスイッチ部とが同時に導通状態となったときに短絡故障状態が発生したことを検知する手段であり、
前記短絡故障極性判断手段は、前記直流電源とインバータ回路との間の通電経路に設けられた電源スイッチを導通状態に維持しつつ、前記インバータ回路の正極側および負極側のいずれか一方の極側の全てのスイッチ素子に対して、該スイッチ素子を導通状態にするための制御信号を付与し、且つ他方の極側の全てのスイッチ素子に対して、該スイッチ素子を遮断状態にするめたの制御信号を付与した状態で、前記短絡故障検知手段により短絡故障状態の発生が検知されるか否かに基づいて、前記短絡故障スイッチ部が正極側であるか負極側であるかを判断し、
前記短絡故障時制御手段による前記インバータ回路のスイッチ素子の制御後に前記電源スイッチを遮断状態に制御する手段をさらに備えることを特徴とする車両。 - 前記インバータ回路の各アームは、各スイッチ部のスイッチ素子と還流ダイオードとの並列接続、該アームの正極側スイッチ部と負極側スイッチ部との直列接続、該アームの一対の電源端子と該正極側および負極側スイッチ部の直列回路との接続、並びに、該アームの出力端子と該正極側および負極側スイッチ部の直列回路の中点との接続が板状の導電性部材によりなされていることを特徴とする請求項2記載の車両。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007054011A JP4757815B2 (ja) | 2007-03-05 | 2007-03-05 | 電動機の制御装置および車両 |
EP08711485A EP2119587A4 (en) | 2007-03-05 | 2008-02-18 | CONTROLLER FOR MOTOR AND VEHICLE |
CN2008800070257A CN101622149B (zh) | 2007-03-05 | 2008-02-18 | 电动机的控制装置和车辆 |
US12/528,908 US8410745B2 (en) | 2007-03-05 | 2008-02-18 | Controller for motor, and vehicle |
PCT/JP2008/052661 WO2008108159A1 (ja) | 2007-03-05 | 2008-02-18 | 電動機の制御装置および車両 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007054011A JP4757815B2 (ja) | 2007-03-05 | 2007-03-05 | 電動機の制御装置および車両 |
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US (1) | US8410745B2 (ja) |
EP (1) | EP2119587A4 (ja) |
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US10933735B2 (en) | 2017-03-31 | 2021-03-02 | Honda Motor Co., Ltd. | Vehicle |
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- 2008-02-18 CN CN2008800070257A patent/CN101622149B/zh not_active Expired - Fee Related
- 2008-02-18 WO PCT/JP2008/052661 patent/WO2008108159A1/ja active Application Filing
- 2008-02-18 EP EP08711485A patent/EP2119587A4/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
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EP2119587A4 (en) | 2010-08-04 |
EP2119587A1 (en) | 2009-11-18 |
CN101622149A (zh) | 2010-01-06 |
CN101622149B (zh) | 2012-07-25 |
US8410745B2 (en) | 2013-04-02 |
JP2008220045A (ja) | 2008-09-18 |
US20100036555A1 (en) | 2010-02-11 |
WO2008108159A1 (ja) | 2008-09-12 |
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