JP4753460B2 - 静電チャック及びその製造方法 - Google Patents

静電チャック及びその製造方法 Download PDF

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Publication number
JP4753460B2
JP4753460B2 JP2000246740A JP2000246740A JP4753460B2 JP 4753460 B2 JP4753460 B2 JP 4753460B2 JP 2000246740 A JP2000246740 A JP 2000246740A JP 2000246740 A JP2000246740 A JP 2000246740A JP 4753460 B2 JP4753460 B2 JP 4753460B2
Authority
JP
Japan
Prior art keywords
insulating layer
film
electrostatic chuck
thermoplastic polyimide
adhesive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000246740A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002064134A (ja
JP2002064134A5 (enExample
Inventor
良昭 辰己
欣也 宮下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawamura Sangyo Co Ltd
Original Assignee
Kawamura Sangyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawamura Sangyo Co Ltd filed Critical Kawamura Sangyo Co Ltd
Priority to JP2000246740A priority Critical patent/JP4753460B2/ja
Priority to US09/925,739 priority patent/US6813134B2/en
Priority to KR1020010048966A priority patent/KR100691098B1/ko
Priority to TW90119917A priority patent/TW517326B/zh
Priority to EP20010306975 priority patent/EP1180793A3/en
Publication of JP2002064134A publication Critical patent/JP2002064134A/ja
Priority to US10/774,472 priority patent/US7411773B2/en
Publication of JP2002064134A5 publication Critical patent/JP2002064134A5/ja
Application granted granted Critical
Publication of JP4753460B2 publication Critical patent/JP4753460B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2000246740A 2000-08-16 2000-08-16 静電チャック及びその製造方法 Expired - Lifetime JP4753460B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000246740A JP4753460B2 (ja) 2000-08-16 2000-08-16 静電チャック及びその製造方法
US09/925,739 US6813134B2 (en) 2000-08-16 2001-08-10 Electrostatic chucking device and manufacturing method thereof
TW90119917A TW517326B (en) 2000-08-16 2001-08-14 Electrostatic chucking device and manufacturing method thereof
KR1020010048966A KR100691098B1 (ko) 2000-08-16 2001-08-14 정전 척 및 그 제조방법
EP20010306975 EP1180793A3 (en) 2000-08-16 2001-08-16 Electrostatic chuck and manufacturing method thereof
US10/774,472 US7411773B2 (en) 2000-08-16 2004-02-10 Electrostatic chucking device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000246740A JP4753460B2 (ja) 2000-08-16 2000-08-16 静電チャック及びその製造方法

Publications (3)

Publication Number Publication Date
JP2002064134A JP2002064134A (ja) 2002-02-28
JP2002064134A5 JP2002064134A5 (enExample) 2007-07-12
JP4753460B2 true JP4753460B2 (ja) 2011-08-24

Family

ID=18736992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000246740A Expired - Lifetime JP4753460B2 (ja) 2000-08-16 2000-08-16 静電チャック及びその製造方法

Country Status (5)

Country Link
US (2) US6813134B2 (enExample)
EP (1) EP1180793A3 (enExample)
JP (1) JP4753460B2 (enExample)
KR (1) KR100691098B1 (enExample)
TW (1) TW517326B (enExample)

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JP2006049357A (ja) * 2004-07-30 2006-02-16 Toto Ltd 静電チャックおよび静電チャックを搭載した装置
US7648914B2 (en) * 2004-10-07 2010-01-19 Applied Materials, Inc. Method for etching having a controlled distribution of process results
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US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
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JP4976915B2 (ja) * 2007-05-08 2012-07-18 新光電気工業株式会社 静電チャックおよび静電チャックの製造方法
CN101803000A (zh) * 2007-08-02 2010-08-11 株式会社爱发科 静电卡盘装置的制造方法
TWI484576B (zh) 2007-12-19 2015-05-11 Lam Res Corp 半導體真空處理設備用之薄膜黏接劑
KR101553422B1 (ko) * 2007-12-19 2015-09-15 램 리써치 코포레이션 플라즈마 처리 장치를 위한 복합 샤워헤드 전극 어셈블리
US8876024B2 (en) 2008-01-10 2014-11-04 Applied Materials, Inc. Heated showerhead assembly
US8043433B2 (en) * 2008-02-11 2011-10-25 Applied Materials, Inc. High efficiency electro-static chucks for semiconductor wafer processing
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
CN104538507B (zh) * 2008-06-02 2017-08-15 Lg伊诺特有限公司 用于制备半导体发光装置的方法
KR100995250B1 (ko) * 2008-09-09 2010-11-18 주식회사 코미코 열 응력 감소를 위한 버퍼층을 포함하는 정전 척
US9520314B2 (en) * 2008-12-19 2016-12-13 Applied Materials, Inc. High temperature electrostatic chuck bonding adhesive
JP5193886B2 (ja) * 2009-01-14 2013-05-08 株式会社巴川製紙所 静電チャック装置の補修方法および補修装置、ならびに静電チャック装置
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
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JP5885404B2 (ja) * 2010-08-04 2016-03-15 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
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EP2490073B1 (en) * 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
KR20130025025A (ko) * 2011-09-01 2013-03-11 주식회사 코미코 정전척
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JP5981358B2 (ja) * 2013-01-23 2016-08-31 東京エレクトロン株式会社 伝熱シート貼付方法
KR102046534B1 (ko) * 2013-01-25 2019-11-19 삼성전자주식회사 기판 가공 방법
CN104752301B (zh) * 2013-12-31 2018-05-25 北京北方华创微电子装备有限公司 一种静电卡盘以及腔室
KR102311586B1 (ko) 2014-12-26 2021-10-12 삼성디스플레이 주식회사 증착 장치 및 증착 장치 내 기판 정렬 방법
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Also Published As

Publication number Publication date
US20040160021A1 (en) 2004-08-19
EP1180793A3 (en) 2004-06-16
TW517326B (en) 2003-01-11
KR20020014722A (ko) 2002-02-25
EP1180793A2 (en) 2002-02-20
JP2002064134A (ja) 2002-02-28
US20020021545A1 (en) 2002-02-21
KR100691098B1 (ko) 2007-03-09
US6813134B2 (en) 2004-11-02
US7411773B2 (en) 2008-08-12

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