JP4747516B2 - 垂直共振器型面発光半導体レーザ装置 - Google Patents
垂直共振器型面発光半導体レーザ装置 Download PDFInfo
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/983—Zener diodes
Description
12:下部ミラー層 14:上部ミラー層
16:p側電極層 20:ツェナーダイオード
22:n型半導体層 24:p型半導体層
26:n側電極層 28:電極層
30:第1の金属リード 32:第2の金属リード
40、42:ボンディングワイヤ 101:基板
110:AlAs層(電流狭窄層) 111、210:酸化領域
113:層間絶縁膜 114:コンタクトホール
115:p側電極層 116:レーザ出射窓
117、118:コンタクトホール 200:n型の半導体基板
210:p型の半導体基板 220:n側電極層
230:電極層 250:酸化膜
Claims (10)
- 保護素子を含む半導体レーザ装置であって、
第1導電型の第1の半導体領域および該第1の半導体領域と接合する第2導電型の第2の半導体領域を含むツェナーダイオードと、
該ツェナーダイオード上に積層され、第1導電型の第1のミラー層、第2導電型の第2のミラー層および前記第1のミラー層と前記第2のミラー層とに挟持された活性領域を少なくとも含む面発光型半導体レーザとを有し、
前記第1の半導体領域と前記第2のミラー層が電気的に接続され、前記第2の半導体領域と前記第1のミラー層とが電気的に接続され、
前記第1の半導体領域は、第1導電型の基板を含み、前記第2の半導体領域は、該基板上に形成されたエピタキシャル層であり、
前記第1のミラー層、前記活性領域および前記第2のミラー層は、前記第2の半導体領域上に形成されるエピタキシャル層であり、
前記第1のミラー層から前記第2のミラー層に至るまで延びる第1のポストが形成され、前記第1のポストの下には前記ツェナーダイオードの端部が突出するように第2のポストが形成され、
前記第1のポストは、前記活性領域に隣接する位置に前記第1のポストの側面から酸化された選択酸化領域を含み、
前記第2のポストは、前記第2の半導体領域と前記第2のミラー層との間に前記第2のポストの側面から前記第2のポスト内が酸化された酸化膜を含み、当該酸化膜は前記選択酸化領域と同時に酸化される、半導体レーザ装置。 - 第1導電型の基板の裏面側に当該基板と電気的に接続される第1の電極層が形成され、第2のミラー層上に当該第2のミラー層と電気的に接続される第2の電極層が形成され、第1、第2の電極層が電気的に接続される、請求項1に記載の半導体レーザ装置。
- 前記第1の半導体領域は、第1導電型の基板を含み、第2の半導体領域は、該基板内に不純物を拡散または注入することによって形成された領域である、請求項1に記載の半導体レーザ装置。
- 前記第2のポスト内の酸化膜の酸化速度は、前記第1のポスト内の選択酸化領域の酸化速度よりも大きい、請求項1に記載の半導体レーザ装置。
- 前記酸化膜がAlxGa1−xAs、前記選択酸化領域がAlyGa1−yAsであるとき、X>Yである、請求項1または4に記載の半導体レーザ装置。
- ツェナーダイオードのツェナー電圧は、面発光型半導体レーザの駆動電圧よりも高い、請求項1ないし5いずれか1つに記載の半導体レーザ装置。
- ツェナー電圧は、約3ボルト以上である、請求項6に記載の半導体レーザ装置。
- 保護素子を含む半導体レーザ装置の製造方法であって、
少なくとも第1導電型の第1の半導体層、前記第1の半導体層と接合する第2導電型の第2の半導体層、前記第2の半導体層上に形成される第1導電型の第3の半導体層、前記第3の半導体層上に形成される活性領域、および前記活性領域上に形成される第2導電型の第4の半導体層を含む複数の半導体層を形成し、
複数の半導体層の一部をエッチングして、前記第3の半導体層に至る第1のポストを形成し、
前記第1のポストの下に前記第2の半導体層に至る第2のポストを形成し、
前記第1のポスト内に含まれる前記活性領域に隣接する電流狭窄層の一部を選択酸化すると同時に前記第2のポストの側面から第2のポスト内に酸化された酸化膜を形成し、
前記第1の半導体層と前記第4の半導体層を電気的に結合し、前記第2の半導体層と前記第3の半導体層とを電気的に結合する、
半導体レーザ装置の製造方法。 - 前記第1の半導体層は、第1導電型の基板を含み、前記第2ないし第4の半導体層は、エピタキシャル成長によって形成される、請求項8に記載の半導体レーザ装置の製造方法。
- 前記酸化膜がAlxGa1−xAs、電流狭窄層がAlyGa1−yAsであるとき、X>Yである、請求項8に記載の半導体レーザ装置の製造方法。
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JP2004169673A JP4747516B2 (ja) | 2004-06-08 | 2004-06-08 | 垂直共振器型面発光半導体レーザ装置 |
US10/990,373 US7995636B2 (en) | 2004-06-08 | 2004-11-18 | Semiconductor laser apparatus and manufacturing method thereof |
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