JP4744751B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4744751B2 JP4744751B2 JP2001296178A JP2001296178A JP4744751B2 JP 4744751 B2 JP4744751 B2 JP 4744751B2 JP 2001296178 A JP2001296178 A JP 2001296178A JP 2001296178 A JP2001296178 A JP 2001296178A JP 4744751 B2 JP4744751 B2 JP 4744751B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- transistor
- impurity
- regions
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
- G11C11/417—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
- G11C11/4125—Cells incorporating circuit means for protecting against loss of information
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/005—Circuit means for protection against loss of information of semiconductor storage devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Static Random-Access Memory (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001296178A JP4744751B2 (ja) | 2000-12-06 | 2001-09-27 | 半導体装置 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000371153 | 2000-12-06 | ||
| JP2000-371153 | 2000-12-06 | ||
| JP2000371153 | 2000-12-06 | ||
| JP2001296178A JP4744751B2 (ja) | 2000-12-06 | 2001-09-27 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011023539A Division JP5280469B2 (ja) | 2000-12-06 | 2011-02-07 | 半導体記憶装置及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002237539A JP2002237539A (ja) | 2002-08-23 |
| JP2002237539A5 JP2002237539A5 (enExample) | 2008-07-31 |
| JP4744751B2 true JP4744751B2 (ja) | 2011-08-10 |
Family
ID=18840923
Family Applications (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001296178A Expired - Lifetime JP4744751B2 (ja) | 2000-12-06 | 2001-09-27 | 半導体装置 |
| JP2011023539A Expired - Lifetime JP5280469B2 (ja) | 2000-12-06 | 2011-02-07 | 半導体記憶装置及び半導体装置 |
| JP2013093581A Expired - Lifetime JP5654081B2 (ja) | 2000-12-06 | 2013-04-26 | 半導体装置 |
| JP2014112540A Expired - Lifetime JP5722491B2 (ja) | 2000-12-06 | 2014-05-30 | 半導体装置 |
| JP2015023272A Expired - Lifetime JP5993043B2 (ja) | 2000-12-06 | 2015-02-09 | 半導体装置 |
| JP2016145998A Expired - Lifetime JP6121604B2 (ja) | 2000-12-06 | 2016-07-26 | 半導体装置 |
| JP2017042935A Expired - Lifetime JP6188983B2 (ja) | 2000-12-06 | 2017-03-07 | 半導体装置 |
| JP2017137189A Expired - Lifetime JP6275905B2 (ja) | 2000-12-06 | 2017-07-13 | 半導体記憶装置 |
| JP2017224452A Expired - Lifetime JP6620388B2 (ja) | 2000-12-06 | 2017-11-22 | 半導体記憶装置 |
| JP2019007819A Expired - Lifetime JP6707157B2 (ja) | 2000-12-06 | 2019-01-21 | 半導体記憶装置 |
Family Applications After (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011023539A Expired - Lifetime JP5280469B2 (ja) | 2000-12-06 | 2011-02-07 | 半導体記憶装置及び半導体装置 |
| JP2013093581A Expired - Lifetime JP5654081B2 (ja) | 2000-12-06 | 2013-04-26 | 半導体装置 |
| JP2014112540A Expired - Lifetime JP5722491B2 (ja) | 2000-12-06 | 2014-05-30 | 半導体装置 |
| JP2015023272A Expired - Lifetime JP5993043B2 (ja) | 2000-12-06 | 2015-02-09 | 半導体装置 |
| JP2016145998A Expired - Lifetime JP6121604B2 (ja) | 2000-12-06 | 2016-07-26 | 半導体装置 |
| JP2017042935A Expired - Lifetime JP6188983B2 (ja) | 2000-12-06 | 2017-03-07 | 半導体装置 |
| JP2017137189A Expired - Lifetime JP6275905B2 (ja) | 2000-12-06 | 2017-07-13 | 半導体記憶装置 |
| JP2017224452A Expired - Lifetime JP6620388B2 (ja) | 2000-12-06 | 2017-11-22 | 半導体記憶装置 |
| JP2019007819A Expired - Lifetime JP6707157B2 (ja) | 2000-12-06 | 2019-01-21 | 半導体記憶装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (7) | US6529401B2 (enExample) |
| JP (10) | JP4744751B2 (enExample) |
| KR (1) | KR100478375B1 (enExample) |
| CN (1) | CN1172374C (enExample) |
| DE (1) | DE10159762A1 (enExample) |
| TW (1) | TW522546B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW522546B (en) | 2000-12-06 | 2003-03-01 | Mitsubishi Electric Corp | Semiconductor memory |
| JP2002353413A (ja) * | 2001-05-28 | 2002-12-06 | Mitsubishi Electric Corp | 半導体記憶装置 |
| JP4877894B2 (ja) * | 2001-07-04 | 2012-02-15 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4278338B2 (ja) * | 2002-04-01 | 2009-06-10 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
| JP4416428B2 (ja) | 2003-04-30 | 2010-02-17 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
| US7023056B2 (en) * | 2003-11-26 | 2006-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory cell structure |
| JP4058417B2 (ja) * | 2004-01-09 | 2008-03-12 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US7365432B2 (en) * | 2004-08-23 | 2008-04-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory cell structure |
| FR2875328B1 (fr) * | 2004-09-15 | 2007-03-16 | St Microelectronics Sa | Cellule memoire sram protegee contre des pics de courant ou de tension |
| JP4578329B2 (ja) | 2005-06-03 | 2010-11-10 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
| JP2009238332A (ja) * | 2008-03-27 | 2009-10-15 | Renesas Technology Corp | 半導体記憶装置 |
| JP2009266942A (ja) * | 2008-04-23 | 2009-11-12 | Toshiba Corp | 半導体記憶装置 |
| US8737107B2 (en) | 2009-01-15 | 2014-05-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory circuits and routing of conductive layers thereof |
| US8004042B2 (en) * | 2009-03-20 | 2011-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Static random access memory (SRAM) cell and method for forming same |
| JP5596335B2 (ja) * | 2009-12-24 | 2014-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| CN101819977A (zh) * | 2010-04-29 | 2010-09-01 | 上海宏力半导体制造有限公司 | 一种静态随机存储器 |
| US8947912B2 (en) | 2010-07-20 | 2015-02-03 | University Of Virginia Licensing & Ventures Group | Memory cell including unidirectional gate conductors and contacts |
| JP5705053B2 (ja) | 2011-07-26 | 2015-04-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| KR20160040577A (ko) * | 2013-08-06 | 2016-04-14 | 르네사스 일렉트로닉스 가부시키가이샤 | 반도체 집적 회로 장치 |
| JP6316727B2 (ja) * | 2014-10-22 | 2018-04-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2016146504A (ja) * | 2016-04-06 | 2016-08-12 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体チップ |
| TWI711159B (zh) * | 2017-03-28 | 2020-11-21 | 聯華電子股份有限公司 | 半導體記憶元件 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0828430B2 (ja) * | 1988-11-30 | 1996-03-21 | 日本電気株式会社 | Cmos型スタティックメモリ |
| US5126279A (en) * | 1988-12-19 | 1992-06-30 | Micron Technology, Inc. | Single polysilicon cross-coupled resistor, six-transistor SRAM cell design technique |
| JP2927463B2 (ja) * | 1989-09-28 | 1999-07-28 | 株式会社日立製作所 | 半導体記憶装置 |
| JPH0821237B2 (ja) * | 1990-06-27 | 1996-03-04 | 株式会社東芝 | 半導体記憶装置 |
| JPH0799630B2 (ja) * | 1990-09-11 | 1995-10-25 | 株式会社東芝 | スタティック型半導体記憶装置 |
| JP2589949Y2 (ja) | 1990-11-02 | 1999-02-03 | 花王株式会社 | 使い捨ておむつ |
| JP3359354B2 (ja) * | 1991-06-24 | 2002-12-24 | テキサス インスツルメンツ インコーポレイテツド | 向上されたダイナミック負フィードバッグを備えた電子ラッチ |
| EP0578915A3 (en) * | 1992-07-16 | 1994-05-18 | Hewlett Packard Co | Two-port ram cell |
| JP2658835B2 (ja) * | 1993-10-20 | 1997-09-30 | 日本電気株式会社 | スタチック型半導体記憶装置 |
| US5338963A (en) | 1993-04-05 | 1994-08-16 | International Business Machines Corporation | Soft error immune CMOS static RAM cell |
| JPH07130877A (ja) | 1993-11-05 | 1995-05-19 | Sony Corp | 完全cmos型スタティック記憶セル |
| US5422296A (en) * | 1994-04-25 | 1995-06-06 | Motorola, Inc. | Process for forming a static-random-access memory cell |
| JPH08125137A (ja) * | 1994-10-28 | 1996-05-17 | Nec Corp | 半導体記憶装置 |
| JPH08204029A (ja) * | 1995-01-23 | 1996-08-09 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP3565290B2 (ja) | 1995-03-28 | 2004-09-15 | 川崎マイクロエレクトロニクス株式会社 | マルチポートメモリ |
| JPH097373A (ja) * | 1995-06-20 | 1997-01-10 | Oki Electric Ind Co Ltd | 半導体記憶装置 |
| JPH09129753A (ja) * | 1995-11-01 | 1997-05-16 | Sony Corp | 半導体装置 |
| KR100197524B1 (ko) * | 1995-12-30 | 1999-06-15 | 김영환 | 에스램 셀 제조방법 |
| JP3824343B2 (ja) | 1996-03-29 | 2006-09-20 | 富士通株式会社 | 半導体装置 |
| US5742557A (en) * | 1996-06-20 | 1998-04-21 | Northern Telecom Limited | Multi-port random access memory |
| JP3523762B2 (ja) | 1996-12-19 | 2004-04-26 | 株式会社東芝 | 半導体記憶装置 |
| KR19980050498A (ko) * | 1996-12-20 | 1998-09-15 | 김광호 | 저전압용 sram 셀 |
| US5923582A (en) * | 1997-06-03 | 1999-07-13 | Cypress Semiconductor Corp. | SRAM with ROM functionality |
| US6140684A (en) * | 1997-06-24 | 2000-10-31 | Stmicroelectronic, Inc. | SRAM cell structure with dielectric sidewall spacers and drain and channel regions defined along sidewall spacers |
| US6271568B1 (en) * | 1997-12-29 | 2001-08-07 | Utmc Microelectronic Systems Inc. | Voltage controlled resistance modulation for single event upset immunity |
| US6005797A (en) * | 1998-03-20 | 1999-12-21 | Micron Technology, Inc. | Latch-up prevention for memory cells |
| WO1999063542A1 (en) * | 1998-06-05 | 1999-12-09 | Lockheed Martin Corporation | Radiation hardened six transistor random access memory and memory device |
| JP2000150651A (ja) * | 1998-11-04 | 2000-05-30 | Nec Corp | 半導体装置及びプラグ構造の製造方法 |
| US5966317A (en) * | 1999-02-10 | 1999-10-12 | Lucent Technologies Inc. | Shielded bitlines for static RAMs |
| JP2000232168A (ja) * | 1999-02-10 | 2000-08-22 | Sony Corp | 半導体記憶装置 |
| JP4674386B2 (ja) * | 1999-02-17 | 2011-04-20 | ソニー株式会社 | 半導体記憶装置 |
| JP4565700B2 (ja) * | 1999-05-12 | 2010-10-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4885365B2 (ja) * | 2000-05-16 | 2012-02-29 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| TW522546B (en) * | 2000-12-06 | 2003-03-01 | Mitsubishi Electric Corp | Semiconductor memory |
| JP3526553B2 (ja) * | 2001-01-26 | 2004-05-17 | 松下電器産業株式会社 | Sram装置 |
-
2001
- 2001-07-04 TW TW090116342A patent/TW522546B/zh not_active IP Right Cessation
- 2001-07-10 US US09/900,917 patent/US6529401B2/en not_active Expired - Lifetime
- 2001-09-27 JP JP2001296178A patent/JP4744751B2/ja not_active Expired - Lifetime
- 2001-12-05 DE DE10159762A patent/DE10159762A1/de not_active Ceased
- 2001-12-05 KR KR10-2001-0076430A patent/KR100478375B1/ko not_active Expired - Lifetime
- 2001-12-06 CN CNB01142754XA patent/CN1172374C/zh not_active Expired - Lifetime
-
2003
- 2003-01-24 US US10/350,221 patent/US6643167B2/en not_active Ceased
-
2005
- 2005-11-03 US US11/265,744 patent/USRE41638E1/en not_active Ceased
-
2010
- 2010-07-29 US US12/846,450 patent/USRE44242E1/en not_active Expired - Lifetime
-
2011
- 2011-02-07 JP JP2011023539A patent/JP5280469B2/ja not_active Expired - Lifetime
-
2013
- 2013-04-15 US US13/863,011 patent/USRE46272E1/en not_active Expired - Lifetime
- 2013-04-26 JP JP2013093581A patent/JP5654081B2/ja not_active Expired - Lifetime
-
2014
- 2014-05-30 JP JP2014112540A patent/JP5722491B2/ja not_active Expired - Lifetime
-
2015
- 2015-02-09 JP JP2015023272A patent/JP5993043B2/ja not_active Expired - Lifetime
-
2016
- 2016-07-26 JP JP2016145998A patent/JP6121604B2/ja not_active Expired - Lifetime
- 2016-12-13 US US15/377,664 patent/USRE47679E1/en not_active Expired - Lifetime
-
2017
- 2017-03-07 JP JP2017042935A patent/JP6188983B2/ja not_active Expired - Lifetime
- 2017-07-13 JP JP2017137189A patent/JP6275905B2/ja not_active Expired - Lifetime
- 2017-11-22 JP JP2017224452A patent/JP6620388B2/ja not_active Expired - Lifetime
-
2019
- 2019-01-21 JP JP2019007819A patent/JP6707157B2/ja not_active Expired - Lifetime
- 2019-01-29 US US16/260,745 patent/USRE47831E1/en not_active Expired - Lifetime
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