KR100478375B1 - 반도체 기억 장치 - Google Patents

반도체 기억 장치 Download PDF

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Publication number
KR100478375B1
KR100478375B1 KR10-2001-0076430A KR20010076430A KR100478375B1 KR 100478375 B1 KR100478375 B1 KR 100478375B1 KR 20010076430 A KR20010076430 A KR 20010076430A KR 100478375 B1 KR100478375 B1 KR 100478375B1
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KR
South Korea
Prior art keywords
type
field effect
wiring
electrically connected
diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR10-2001-0076430A
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English (en)
Korean (ko)
Other versions
KR20020071705A (ko
Inventor
니이고지
Original Assignee
미쓰비시덴키 가부시키가이샤
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Publication of KR20020071705A publication Critical patent/KR20020071705A/ko
Application granted granted Critical
Publication of KR100478375B1 publication Critical patent/KR100478375B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/413Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
    • G11C11/417Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/412Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
    • G11C11/4125Cells incorporating circuit means for protecting against loss of information
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/005Circuit means for protection against loss of information of semiconductor storage devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Static Random-Access Memory (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
KR10-2001-0076430A 2000-12-06 2001-12-05 반도체 기억 장치 Expired - Lifetime KR100478375B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00371153 2000-12-06
JP2000371153 2000-12-06

Publications (2)

Publication Number Publication Date
KR20020071705A KR20020071705A (ko) 2002-09-13
KR100478375B1 true KR100478375B1 (ko) 2005-03-23

Family

ID=18840923

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-0076430A Expired - Lifetime KR100478375B1 (ko) 2000-12-06 2001-12-05 반도체 기억 장치

Country Status (6)

Country Link
US (7) US6529401B2 (enExample)
JP (10) JP4744751B2 (enExample)
KR (1) KR100478375B1 (enExample)
CN (1) CN1172374C (enExample)
DE (1) DE10159762A1 (enExample)
TW (1) TW522546B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW522546B (en) 2000-12-06 2003-03-01 Mitsubishi Electric Corp Semiconductor memory
JP2002353413A (ja) * 2001-05-28 2002-12-06 Mitsubishi Electric Corp 半導体記憶装置
JP4877894B2 (ja) * 2001-07-04 2012-02-15 ルネサスエレクトロニクス株式会社 半導体装置
JP4278338B2 (ja) * 2002-04-01 2009-06-10 株式会社ルネサステクノロジ 半導体記憶装置
JP4416428B2 (ja) 2003-04-30 2010-02-17 株式会社ルネサステクノロジ 半導体記憶装置
US7023056B2 (en) * 2003-11-26 2006-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Memory cell structure
JP4058417B2 (ja) * 2004-01-09 2008-03-12 株式会社東芝 半導体装置およびその製造方法
US7365432B2 (en) * 2004-08-23 2008-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Memory cell structure
FR2875328B1 (fr) * 2004-09-15 2007-03-16 St Microelectronics Sa Cellule memoire sram protegee contre des pics de courant ou de tension
JP4578329B2 (ja) 2005-06-03 2010-11-10 ルネサスエレクトロニクス株式会社 半導体記憶装置
JP2009238332A (ja) * 2008-03-27 2009-10-15 Renesas Technology Corp 半導体記憶装置
JP2009266942A (ja) * 2008-04-23 2009-11-12 Toshiba Corp 半導体記憶装置
US8737107B2 (en) 2009-01-15 2014-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Memory circuits and routing of conductive layers thereof
US8004042B2 (en) * 2009-03-20 2011-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Static random access memory (SRAM) cell and method for forming same
JP5596335B2 (ja) * 2009-12-24 2014-09-24 ルネサスエレクトロニクス株式会社 半導体装置
CN101819977A (zh) * 2010-04-29 2010-09-01 上海宏力半导体制造有限公司 一种静态随机存储器
US8947912B2 (en) 2010-07-20 2015-02-03 University Of Virginia Licensing & Ventures Group Memory cell including unidirectional gate conductors and contacts
JP5705053B2 (ja) 2011-07-26 2015-04-22 ルネサスエレクトロニクス株式会社 半導体装置
KR20160040577A (ko) * 2013-08-06 2016-04-14 르네사스 일렉트로닉스 가부시키가이샤 반도체 집적 회로 장치
JP6316727B2 (ja) * 2014-10-22 2018-04-25 ルネサスエレクトロニクス株式会社 半導体装置
JP2016146504A (ja) * 2016-04-06 2016-08-12 ルネサスエレクトロニクス株式会社 半導体装置および半導体チップ
TWI711159B (zh) * 2017-03-28 2020-11-21 聯華電子股份有限公司 半導體記憶元件

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04119592A (ja) * 1990-09-11 1992-04-21 Toshiba Corp スタティック型半導体記憶装置
US5489790A (en) * 1994-04-25 1996-02-06 Motorola, Inc. Static-random-access memory cell
JPH08125137A (ja) * 1994-10-28 1996-05-17 Nec Corp 半導体記憶装置
JPH08204029A (ja) * 1995-01-23 1996-08-09 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPH09129753A (ja) * 1995-11-01 1997-05-16 Sony Corp 半導体装置
KR19980050498A (ko) * 1996-12-20 1998-09-15 김광호 저전압용 sram 셀
KR100197524B1 (ko) * 1995-12-30 1999-06-15 김영환 에스램 셀 제조방법

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JPH0828430B2 (ja) * 1988-11-30 1996-03-21 日本電気株式会社 Cmos型スタティックメモリ
US5126279A (en) * 1988-12-19 1992-06-30 Micron Technology, Inc. Single polysilicon cross-coupled resistor, six-transistor SRAM cell design technique
JP2927463B2 (ja) * 1989-09-28 1999-07-28 株式会社日立製作所 半導体記憶装置
JPH0821237B2 (ja) * 1990-06-27 1996-03-04 株式会社東芝 半導体記憶装置
JP2589949Y2 (ja) 1990-11-02 1999-02-03 花王株式会社 使い捨ておむつ
JP3359354B2 (ja) * 1991-06-24 2002-12-24 テキサス インスツルメンツ インコーポレイテツド 向上されたダイナミック負フィードバッグを備えた電子ラッチ
EP0578915A3 (en) * 1992-07-16 1994-05-18 Hewlett Packard Co Two-port ram cell
JP2658835B2 (ja) * 1993-10-20 1997-09-30 日本電気株式会社 スタチック型半導体記憶装置
US5338963A (en) 1993-04-05 1994-08-16 International Business Machines Corporation Soft error immune CMOS static RAM cell
JPH07130877A (ja) 1993-11-05 1995-05-19 Sony Corp 完全cmos型スタティック記憶セル
JP3565290B2 (ja) 1995-03-28 2004-09-15 川崎マイクロエレクトロニクス株式会社 マルチポートメモリ
JPH097373A (ja) * 1995-06-20 1997-01-10 Oki Electric Ind Co Ltd 半導体記憶装置
JP3824343B2 (ja) 1996-03-29 2006-09-20 富士通株式会社 半導体装置
US5742557A (en) * 1996-06-20 1998-04-21 Northern Telecom Limited Multi-port random access memory
JP3523762B2 (ja) 1996-12-19 2004-04-26 株式会社東芝 半導体記憶装置
US5923582A (en) * 1997-06-03 1999-07-13 Cypress Semiconductor Corp. SRAM with ROM functionality
US6140684A (en) * 1997-06-24 2000-10-31 Stmicroelectronic, Inc. SRAM cell structure with dielectric sidewall spacers and drain and channel regions defined along sidewall spacers
US6271568B1 (en) * 1997-12-29 2001-08-07 Utmc Microelectronic Systems Inc. Voltage controlled resistance modulation for single event upset immunity
US6005797A (en) * 1998-03-20 1999-12-21 Micron Technology, Inc. Latch-up prevention for memory cells
WO1999063542A1 (en) * 1998-06-05 1999-12-09 Lockheed Martin Corporation Radiation hardened six transistor random access memory and memory device
JP2000150651A (ja) * 1998-11-04 2000-05-30 Nec Corp 半導体装置及びプラグ構造の製造方法
US5966317A (en) * 1999-02-10 1999-10-12 Lucent Technologies Inc. Shielded bitlines for static RAMs
JP2000232168A (ja) * 1999-02-10 2000-08-22 Sony Corp 半導体記憶装置
JP4674386B2 (ja) * 1999-02-17 2011-04-20 ソニー株式会社 半導体記憶装置
JP4565700B2 (ja) * 1999-05-12 2010-10-20 ルネサスエレクトロニクス株式会社 半導体装置
JP4885365B2 (ja) * 2000-05-16 2012-02-29 ルネサスエレクトロニクス株式会社 半導体装置
TW522546B (en) * 2000-12-06 2003-03-01 Mitsubishi Electric Corp Semiconductor memory
JP3526553B2 (ja) * 2001-01-26 2004-05-17 松下電器産業株式会社 Sram装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04119592A (ja) * 1990-09-11 1992-04-21 Toshiba Corp スタティック型半導体記憶装置
US5489790A (en) * 1994-04-25 1996-02-06 Motorola, Inc. Static-random-access memory cell
JPH08125137A (ja) * 1994-10-28 1996-05-17 Nec Corp 半導体記憶装置
KR100195683B1 (ko) * 1994-10-28 1999-06-15 가네꼬 히사시 소프트 에러 억제 저항 부하형 sram 셀
JPH08204029A (ja) * 1995-01-23 1996-08-09 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPH09129753A (ja) * 1995-11-01 1997-05-16 Sony Corp 半導体装置
KR100197524B1 (ko) * 1995-12-30 1999-06-15 김영환 에스램 셀 제조방법
KR19980050498A (ko) * 1996-12-20 1998-09-15 김광호 저전압용 sram 셀

Also Published As

Publication number Publication date
US20030112653A1 (en) 2003-06-19
US6643167B2 (en) 2003-11-04
JP2002237539A (ja) 2002-08-23
JP2019075584A (ja) 2019-05-16
USRE47831E1 (en) 2020-01-28
JP2016208051A (ja) 2016-12-08
JP6188983B2 (ja) 2017-08-30
CN1172374C (zh) 2004-10-20
JP6275905B2 (ja) 2018-02-07
JP2015144281A (ja) 2015-08-06
US6529401B2 (en) 2003-03-04
JP2011101050A (ja) 2011-05-19
KR20020071705A (ko) 2002-09-13
JP2013179331A (ja) 2013-09-09
JP6707157B2 (ja) 2020-06-10
JP2014179651A (ja) 2014-09-25
JP2017103494A (ja) 2017-06-08
JP2017188701A (ja) 2017-10-12
DE10159762A1 (de) 2002-07-04
USRE44242E1 (en) 2013-05-28
US20020067637A1 (en) 2002-06-06
JP6620388B2 (ja) 2019-12-18
TW522546B (en) 2003-03-01
USRE46272E1 (en) 2017-01-10
JP5722491B2 (ja) 2015-05-20
JP4744751B2 (ja) 2011-08-10
JP2018029212A (ja) 2018-02-22
CN1357922A (zh) 2002-07-10
JP6121604B2 (ja) 2017-04-26
USRE41638E1 (en) 2010-09-07
JP5654081B2 (ja) 2015-01-14
JP5280469B2 (ja) 2013-09-04
JP5993043B2 (ja) 2016-09-14
USRE47679E1 (en) 2019-10-29

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