JP4733937B2 - 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 - Google Patents

室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 Download PDF

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Publication number
JP4733937B2
JP4733937B2 JP2004203660A JP2004203660A JP4733937B2 JP 4733937 B2 JP4733937 B2 JP 4733937B2 JP 2004203660 A JP2004203660 A JP 2004203660A JP 2004203660 A JP2004203660 A JP 2004203660A JP 4733937 B2 JP4733937 B2 JP 4733937B2
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JP
Japan
Prior art keywords
group
room temperature
composition
curable organopolysiloxane
organopolysiloxane composition
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Expired - Lifetime
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JP2004203660A
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English (en)
Japanese (ja)
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JP2006022277A5 (enExample
JP2006022277A (ja
Inventor
修 三谷
正之 大西
春美 小玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2004203660A priority Critical patent/JP4733937B2/ja
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to AT05752846T priority patent/ATE391753T1/de
Priority to PCT/JP2005/011576 priority patent/WO2006006371A2/en
Priority to US11/571,770 priority patent/US20080319121A1/en
Priority to DE602005006004T priority patent/DE602005006004T2/de
Priority to EP05752846A priority patent/EP1789495B1/en
Priority to CN200580023209A priority patent/CN100577734C/zh
Priority to TW094121320A priority patent/TWI379869B/zh
Publication of JP2006022277A publication Critical patent/JP2006022277A/ja
Publication of JP2006022277A5 publication Critical patent/JP2006022277A5/ja
Application granted granted Critical
Publication of JP4733937B2 publication Critical patent/JP4733937B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2004203660A 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 Expired - Lifetime JP4733937B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2004203660A JP4733937B2 (ja) 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
PCT/JP2005/011576 WO2006006371A2 (en) 2004-07-09 2005-06-17 Room-temperature curable organopolysiloxane composition and electrical or electronic devices
US11/571,770 US20080319121A1 (en) 2004-07-09 2005-06-17 Room-Temperature Curable Organopolysiloxane Composition and Electrical or Electronic Devices
DE602005006004T DE602005006004T2 (de) 2004-07-09 2005-06-17 Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen
AT05752846T ATE391753T1 (de) 2004-07-09 2005-06-17 Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen
EP05752846A EP1789495B1 (en) 2004-07-09 2005-06-17 Room-temperature curable organopolysiloxane composition and electrical or electronic devices
CN200580023209A CN100577734C (zh) 2004-07-09 2005-06-17 可室温固化的有机基聚硅氧烷组合物和电气或电子器件
TW094121320A TWI379869B (en) 2004-07-09 2005-06-24 Room-temperature curable organopolysiloxane composition and electrical or electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004203660A JP4733937B2 (ja) 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

Publications (3)

Publication Number Publication Date
JP2006022277A JP2006022277A (ja) 2006-01-26
JP2006022277A5 JP2006022277A5 (enExample) 2007-08-09
JP4733937B2 true JP4733937B2 (ja) 2011-07-27

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Family Applications (1)

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JP2004203660A Expired - Lifetime JP4733937B2 (ja) 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

Country Status (8)

Country Link
US (1) US20080319121A1 (enExample)
EP (1) EP1789495B1 (enExample)
JP (1) JP4733937B2 (enExample)
CN (1) CN100577734C (enExample)
AT (1) ATE391753T1 (enExample)
DE (1) DE602005006004T2 (enExample)
TW (1) TWI379869B (enExample)
WO (1) WO2006006371A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4799835B2 (ja) * 2004-07-09 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP5285892B2 (ja) * 2007-10-25 2013-09-11 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
JP2010284869A (ja) * 2009-06-11 2010-12-24 Shin-Etsu Chemical Co Ltd 接合部材
JP5409695B2 (ja) * 2011-04-26 2014-02-05 信越化学工業株式会社 オルガノポリシロキサン、オルガノポリシロキサンを含む仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法
JP2012236942A (ja) * 2011-05-13 2012-12-06 Dow Corning Toray Co Ltd 透明非金属製導電部の保護方法
KR101921131B1 (ko) * 2011-09-08 2018-11-22 린텍 가부시키가이샤 변성 폴리실라잔 필름, 및, 가스 배리어 필름의 제조 방법
KR101954710B1 (ko) 2012-01-20 2019-03-06 린텍 가부시키가이샤 가스 배리어 필름 및 가스 배리어 필름의 제조 방법
US9577211B2 (en) 2012-02-21 2017-02-21 Lintec Corporation Organic electronic element and method for manufacturing organic electronic element
CN113773505A (zh) 2013-12-27 2021-12-10 陶氏东丽株式会社 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法
US10072151B2 (en) 2013-12-27 2018-09-11 Dow Corning Toray Co., Ltd. Room-temperature-curable silicone rubber composition, and the use thereof
JP6528930B2 (ja) * 2014-12-22 2019-06-12 株式会社スリーボンド コーティング剤組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3759867A (en) * 1972-03-02 1973-09-18 Gen Electric Molding compositions containing silanol free resins
US4111890A (en) * 1977-12-19 1978-09-05 Sws Silicones Corporation Curable organopolysiloxane compositions containing titanium esters
JPS58162660A (ja) * 1982-03-19 1983-09-27 Toray Silicone Co Ltd プライマ−組成物
JP3725178B2 (ja) * 1991-03-22 2005-12-07 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
US5645941A (en) * 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
JPH06329914A (ja) * 1993-05-18 1994-11-29 Toray Dow Corning Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物およびその製造方法
JP2764678B2 (ja) * 1993-05-20 1998-06-11 信越化学工業株式会社 マスキングまたはパッキング用室温硬化性シリコーン組成物
US5417265A (en) * 1993-10-12 1995-05-23 Newman Machine Company, Inc. Infeed method and apparatus for a machining device
JP3846640B2 (ja) * 1994-01-20 2006-11-15 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
TW343218B (en) * 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
US5859127A (en) * 1996-11-29 1999-01-12 Shin-Etsu Polymer Co., Ltd. Thermosetting resin composition and two-parts composite body thereof with silcone rubber
JP3420473B2 (ja) * 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 シリコーン系接着性シート、その製造方法、および半導体装置
DE19725501C1 (de) * 1997-06-17 1998-12-10 Huels Silicone Gmbh Alkoxyvernetzende RTVl-Siliconkautschuk-Mischungen
JP3394164B2 (ja) * 1997-08-14 2003-04-07 信越化学工業株式会社 剥離性紫外線硬化型シリコーン組成物
WO2000075234A1 (fr) * 1999-06-08 2000-12-14 Rhodia Chimie Compositions a base d'organopolysiloxanes et de polymere silyle durcissant en elastomeres des la temperature ambiante en presence d'humidite
JP2002020719A (ja) * 2000-07-11 2002-01-23 Shin Etsu Chem Co Ltd シリコーンゴム接着剤組成物及び該接着剤組成物と熱可塑性樹脂との一体成形体
JP4823431B2 (ja) * 2001-01-30 2011-11-24 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst

Also Published As

Publication number Publication date
TW200604291A (en) 2006-02-01
EP1789495B1 (en) 2008-04-09
DE602005006004D1 (de) 2008-05-21
ATE391753T1 (de) 2008-04-15
EP1789495A2 (en) 2007-05-30
CN100577734C (zh) 2010-01-06
WO2006006371A2 (en) 2006-01-19
DE602005006004T2 (de) 2009-05-14
WO2006006371A3 (en) 2006-03-02
TWI379869B (en) 2012-12-21
US20080319121A1 (en) 2008-12-25
CN1984964A (zh) 2007-06-20
JP2006022277A (ja) 2006-01-26

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