CN100577734C - 可室温固化的有机基聚硅氧烷组合物和电气或电子器件 - Google Patents

可室温固化的有机基聚硅氧烷组合物和电气或电子器件 Download PDF

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Publication number
CN100577734C
CN100577734C CN200580023209A CN200580023209A CN100577734C CN 100577734 C CN100577734 C CN 100577734C CN 200580023209 A CN200580023209 A CN 200580023209A CN 200580023209 A CN200580023209 A CN 200580023209A CN 100577734 C CN100577734 C CN 100577734C
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China
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composition
organopolysiloxane
temperature curable
component
organopolysiloxane composition
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Expired - Fee Related
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CN200580023209A
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Chinese (zh)
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CN1984964A (zh
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三谷修
大西正之
小玉春美
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN200580023209A 2004-07-09 2005-06-17 可室温固化的有机基聚硅氧烷组合物和电气或电子器件 Expired - Fee Related CN100577734C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004203660A JP4733937B2 (ja) 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP203660/2004 2004-07-09

Publications (2)

Publication Number Publication Date
CN1984964A CN1984964A (zh) 2007-06-20
CN100577734C true CN100577734C (zh) 2010-01-06

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CN200580023209A Expired - Fee Related CN100577734C (zh) 2004-07-09 2005-06-17 可室温固化的有机基聚硅氧烷组合物和电气或电子器件

Country Status (8)

Country Link
US (1) US20080319121A1 (enExample)
EP (1) EP1789495B1 (enExample)
JP (1) JP4733937B2 (enExample)
CN (1) CN100577734C (enExample)
AT (1) ATE391753T1 (enExample)
DE (1) DE602005006004T2 (enExample)
TW (1) TWI379869B (enExample)
WO (1) WO2006006371A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4799835B2 (ja) * 2004-07-09 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP5285892B2 (ja) * 2007-10-25 2013-09-11 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
JP2010284869A (ja) * 2009-06-11 2010-12-24 Shin-Etsu Chemical Co Ltd 接合部材
JP5409695B2 (ja) * 2011-04-26 2014-02-05 信越化学工業株式会社 オルガノポリシロキサン、オルガノポリシロキサンを含む仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法
JP2012236942A (ja) * 2011-05-13 2012-12-06 Dow Corning Toray Co Ltd 透明非金属製導電部の保護方法
KR101921131B1 (ko) * 2011-09-08 2018-11-22 린텍 가부시키가이샤 변성 폴리실라잔 필름, 및, 가스 배리어 필름의 제조 방법
KR101954710B1 (ko) 2012-01-20 2019-03-06 린텍 가부시키가이샤 가스 배리어 필름 및 가스 배리어 필름의 제조 방법
US9577211B2 (en) 2012-02-21 2017-02-21 Lintec Corporation Organic electronic element and method for manufacturing organic electronic element
CN113773505A (zh) 2013-12-27 2021-12-10 陶氏东丽株式会社 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法
US10072151B2 (en) 2013-12-27 2018-09-11 Dow Corning Toray Co., Ltd. Room-temperature-curable silicone rubber composition, and the use thereof
JP6528930B2 (ja) * 2014-12-22 2019-06-12 株式会社スリーボンド コーティング剤組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0625548A2 (en) * 1993-05-18 1994-11-23 Dow Corning Toray Silicone Company, Limited Room-temperature-curable organopolysiloxane composition and method for its preparation
CN1365379A (zh) * 1999-06-08 2002-08-21 罗狄亚化学公司 在湿分存在下在环境温度下固化为弹性体的基于有机聚硅氧烷和甲硅烷基聚合物的组合物
CN1368520A (zh) * 2001-01-30 2002-09-11 陶氏康宁东丽硅氧烷株式会社 室温可固化的硅橡胶组合物

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US3759867A (en) * 1972-03-02 1973-09-18 Gen Electric Molding compositions containing silanol free resins
US4111890A (en) * 1977-12-19 1978-09-05 Sws Silicones Corporation Curable organopolysiloxane compositions containing titanium esters
JPS58162660A (ja) * 1982-03-19 1983-09-27 Toray Silicone Co Ltd プライマ−組成物
JP3725178B2 (ja) * 1991-03-22 2005-12-07 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
US5645941A (en) * 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
JP2764678B2 (ja) * 1993-05-20 1998-06-11 信越化学工業株式会社 マスキングまたはパッキング用室温硬化性シリコーン組成物
US5417265A (en) * 1993-10-12 1995-05-23 Newman Machine Company, Inc. Infeed method and apparatus for a machining device
JP3846640B2 (ja) * 1994-01-20 2006-11-15 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
TW343218B (en) * 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
US5859127A (en) * 1996-11-29 1999-01-12 Shin-Etsu Polymer Co., Ltd. Thermosetting resin composition and two-parts composite body thereof with silcone rubber
JP3420473B2 (ja) * 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 シリコーン系接着性シート、その製造方法、および半導体装置
DE19725501C1 (de) * 1997-06-17 1998-12-10 Huels Silicone Gmbh Alkoxyvernetzende RTVl-Siliconkautschuk-Mischungen
JP3394164B2 (ja) * 1997-08-14 2003-04-07 信越化学工業株式会社 剥離性紫外線硬化型シリコーン組成物
JP2002020719A (ja) * 2000-07-11 2002-01-23 Shin Etsu Chem Co Ltd シリコーンゴム接着剤組成物及び該接着剤組成物と熱可塑性樹脂との一体成形体
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0625548A2 (en) * 1993-05-18 1994-11-23 Dow Corning Toray Silicone Company, Limited Room-temperature-curable organopolysiloxane composition and method for its preparation
CN1365379A (zh) * 1999-06-08 2002-08-21 罗狄亚化学公司 在湿分存在下在环境温度下固化为弹性体的基于有机聚硅氧烷和甲硅烷基聚合物的组合物
CN1368520A (zh) * 2001-01-30 2002-09-11 陶氏康宁东丽硅氧烷株式会社 室温可固化的硅橡胶组合物

Also Published As

Publication number Publication date
TW200604291A (en) 2006-02-01
JP4733937B2 (ja) 2011-07-27
EP1789495B1 (en) 2008-04-09
DE602005006004D1 (de) 2008-05-21
ATE391753T1 (de) 2008-04-15
EP1789495A2 (en) 2007-05-30
WO2006006371A2 (en) 2006-01-19
DE602005006004T2 (de) 2009-05-14
WO2006006371A3 (en) 2006-03-02
TWI379869B (en) 2012-12-21
US20080319121A1 (en) 2008-12-25
CN1984964A (zh) 2007-06-20
JP2006022277A (ja) 2006-01-26

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