ATE391753T1 - Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen - Google Patents

Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen

Info

Publication number
ATE391753T1
ATE391753T1 AT05752846T AT05752846T ATE391753T1 AT E391753 T1 ATE391753 T1 AT E391753T1 AT 05752846 T AT05752846 T AT 05752846T AT 05752846 T AT05752846 T AT 05752846T AT E391753 T1 ATE391753 T1 AT E391753T1
Authority
AT
Austria
Prior art keywords
temperature curable
curable organopolysiloxane
electrical
room temperature
electronic devices
Prior art date
Application number
AT05752846T
Other languages
English (en)
Inventor
Osamu Mitani
Masayuki Onishi
Harumi Kodama
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE391753T1 publication Critical patent/ATE391753T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT05752846T 2004-07-09 2005-06-17 Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen ATE391753T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004203660A JP4733937B2 (ja) 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

Publications (1)

Publication Number Publication Date
ATE391753T1 true ATE391753T1 (de) 2008-04-15

Family

ID=35466158

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05752846T ATE391753T1 (de) 2004-07-09 2005-06-17 Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen

Country Status (8)

Country Link
US (1) US20080319121A1 (de)
EP (1) EP1789495B1 (de)
JP (1) JP4733937B2 (de)
CN (1) CN100577734C (de)
AT (1) ATE391753T1 (de)
DE (1) DE602005006004T2 (de)
TW (1) TWI379869B (de)
WO (1) WO2006006371A2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4799835B2 (ja) * 2004-07-09 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP5285892B2 (ja) * 2007-10-25 2013-09-11 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
JP2010284869A (ja) * 2009-06-11 2010-12-24 Shin-Etsu Chemical Co Ltd 接合部材
JP5409695B2 (ja) * 2011-04-26 2014-02-05 信越化学工業株式会社 オルガノポリシロキサン、オルガノポリシロキサンを含む仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法
JP2012236942A (ja) * 2011-05-13 2012-12-06 Dow Corning Toray Co Ltd 透明非金属製導電部の保護方法
WO2013035432A1 (ja) * 2011-09-08 2013-03-14 リンテック株式会社 変性ポリシラザンフィルム、および、ガスバリアフィルムの製造方法
JP5339655B1 (ja) 2012-01-20 2013-11-13 リンテック株式会社 ガスバリアフィルムおよびガスバリアフィルムの製造方法
CN104137649B (zh) 2012-02-21 2016-05-11 琳得科株式会社 有机电子元件和有机电子元件的制造方法
JP2017500393A (ja) 2013-12-27 2017-01-05 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物およびその用途
WO2015098118A1 (en) 2013-12-27 2015-07-02 Dow Corning Toray Co., Ltd. Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device
JP6528930B2 (ja) * 2014-12-22 2019-06-12 株式会社スリーボンド コーティング剤組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3759867A (en) * 1972-03-02 1973-09-18 Gen Electric Molding compositions containing silanol free resins
US4111890A (en) * 1977-12-19 1978-09-05 Sws Silicones Corporation Curable organopolysiloxane compositions containing titanium esters
JPS58162660A (ja) * 1982-03-19 1983-09-27 Toray Silicone Co Ltd プライマ−組成物
JP3725178B2 (ja) * 1991-03-22 2005-12-07 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
US5645941A (en) * 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
JPH06329914A (ja) * 1993-05-18 1994-11-29 Toray Dow Corning Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物およびその製造方法
JP2764678B2 (ja) * 1993-05-20 1998-06-11 信越化学工業株式会社 マスキングまたはパッキング用室温硬化性シリコーン組成物
US5417265A (en) * 1993-10-12 1995-05-23 Newman Machine Company, Inc. Infeed method and apparatus for a machining device
JP3846640B2 (ja) * 1994-01-20 2006-11-15 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
TW343218B (en) * 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
US5859127A (en) * 1996-11-29 1999-01-12 Shin-Etsu Polymer Co., Ltd. Thermosetting resin composition and two-parts composite body thereof with silcone rubber
JP3420473B2 (ja) * 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 シリコーン系接着性シート、その製造方法、および半導体装置
DE19725501C1 (de) * 1997-06-17 1998-12-10 Huels Silicone Gmbh Alkoxyvernetzende RTVl-Siliconkautschuk-Mischungen
JP3394164B2 (ja) * 1997-08-14 2003-04-07 信越化学工業株式会社 剥離性紫外線硬化型シリコーン組成物
EP1187880A1 (de) * 1999-06-08 2002-03-20 Rhodia Chimie Bei umgebungstemperatur und luftfeuchtigkeit zum elastomeren härtende zusammensetzungen auf basis von diorganopolysiloxanen und silylierten polymeren
JP2002020719A (ja) * 2000-07-11 2002-01-23 Shin Etsu Chem Co Ltd シリコーンゴム接着剤組成物及び該接着剤組成物と熱可塑性樹脂との一体成形体
JP4823431B2 (ja) * 2001-01-30 2011-11-24 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst

Also Published As

Publication number Publication date
CN100577734C (zh) 2010-01-06
WO2006006371A3 (en) 2006-03-02
WO2006006371A2 (en) 2006-01-19
EP1789495B1 (de) 2008-04-09
TWI379869B (en) 2012-12-21
DE602005006004T2 (de) 2009-05-14
EP1789495A2 (de) 2007-05-30
TW200604291A (en) 2006-02-01
CN1984964A (zh) 2007-06-20
US20080319121A1 (en) 2008-12-25
JP2006022277A (ja) 2006-01-26
DE602005006004D1 (de) 2008-05-21
JP4733937B2 (ja) 2011-07-27

Similar Documents

Publication Publication Date Title
ATE391753T1 (de) Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen
ATE406414T1 (de) Härtbare organopolysiloxanzusammensetzung, härtungsverfahren dafür, halbleitervorrichtung und haftvermittler
MY158361A (en) Curable organopolysiloxane composition and semiconductor device
ATE476485T1 (de) Härtbare verbindungen, verfahren und herstellung und verwendung davon und artikel daraus
ATE476488T1 (de) Siliconbasiertes haftklebemittel sowie klebeband
AU2003213207A8 (en) High fracture toughness hydrosilyation cured silicone resin
TW200833788A (en) Heat stable aryl polysiloxane compositions
DE602004026452D1 (de) Silikonelastomerklebefolie
WO2007100445A3 (en) Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
ATE442417T1 (de) Silikonzusammensetzung und gehärtetes silikonharz
MY156257A (en) Curable organopolysiloxane composition and semiconductor device
DE60219179D1 (de) Wärmestabile, feuchtigkeitshärtende polysilazane und polysiloxazane
DE602005019277D1 (de) Silicon Antihaftmittelbeschichtung und damit beschichteter Plastikfilm
DE602004026456D1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
ATE410484T1 (de) Härtbare silikonzusammensetzung und elektronische komponenten
ATE514751T1 (de) Härtbare silikonzusammensetzung und gehärtetes produkt daraus
EP1988125A3 (de) Additionsvernetzende Silikonharzzusammensetzung und Silikonlinse damit
TW200736338A (en) Silicone composition and cured products thereof
TW200712158A (en) Self-adhesive organopolysiloxane composition
DE602007004235D1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
DE60311733D1 (de) Silikonharz Zusammensetzung für LED Bauteile
DE60223832D1 (de) Härtbare organopolysiloxanzusammensetzung, verwendung des gehärteten produkts der zusammensetzung und halbleitervorrichtung
ES2488409T3 (es) Composición de caucho de silicona
MA32930B1 (fr) Composition intumescente
JP2009138166A5 (de)

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties