DE602005006004T2 - Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen - Google Patents

Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen Download PDF

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Publication number
DE602005006004T2
DE602005006004T2 DE602005006004T DE602005006004T DE602005006004T2 DE 602005006004 T2 DE602005006004 T2 DE 602005006004T2 DE 602005006004 T DE602005006004 T DE 602005006004T DE 602005006004 T DE602005006004 T DE 602005006004T DE 602005006004 T2 DE602005006004 T2 DE 602005006004T2
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Germany
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groups
composition
parts
weight
component
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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DE602005006004T
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German (de)
English (en)
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DE602005006004D1 (de
Inventor
Osamu Ichihara-shi Mitani
Masayuki Ichihara-shi Onishi
Harumi Ichihara-shi KODAMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Publication of DE602005006004D1 publication Critical patent/DE602005006004D1/de
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Publication of DE602005006004T2 publication Critical patent/DE602005006004T2/de
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Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE602005006004T 2004-07-09 2005-06-17 Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen Expired - Lifetime DE602005006004T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004203660A JP4733937B2 (ja) 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP2004203660 2004-07-09
PCT/JP2005/011576 WO2006006371A2 (en) 2004-07-09 2005-06-17 Room-temperature curable organopolysiloxane composition and electrical or electronic devices

Publications (2)

Publication Number Publication Date
DE602005006004D1 DE602005006004D1 (de) 2008-05-21
DE602005006004T2 true DE602005006004T2 (de) 2009-05-14

Family

ID=35466158

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005006004T Expired - Lifetime DE602005006004T2 (de) 2004-07-09 2005-06-17 Bei raumtemperatur härtbare organopolysiloxanzusammensetzung und elektrische oder elektronische vorrichtungen

Country Status (8)

Country Link
US (1) US20080319121A1 (enExample)
EP (1) EP1789495B1 (enExample)
JP (1) JP4733937B2 (enExample)
CN (1) CN100577734C (enExample)
AT (1) ATE391753T1 (enExample)
DE (1) DE602005006004T2 (enExample)
TW (1) TWI379869B (enExample)
WO (1) WO2006006371A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4799835B2 (ja) * 2004-07-09 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP5285892B2 (ja) * 2007-10-25 2013-09-11 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
JP2010284869A (ja) * 2009-06-11 2010-12-24 Shin-Etsu Chemical Co Ltd 接合部材
JP5409695B2 (ja) * 2011-04-26 2014-02-05 信越化学工業株式会社 オルガノポリシロキサン、オルガノポリシロキサンを含む仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法
JP2012236942A (ja) * 2011-05-13 2012-12-06 Dow Corning Toray Co Ltd 透明非金属製導電部の保護方法
EP2700500A4 (en) * 2011-09-08 2015-02-25 Lintec Corp MODIFIED POLYSILAZANE FILM AND PROCESS FOR PRODUCING GAS BARRIER FILM
JP5339655B1 (ja) 2012-01-20 2013-11-13 リンテック株式会社 ガスバリアフィルムおよびガスバリアフィルムの製造方法
EP2819486B1 (en) 2012-02-21 2019-11-13 LINTEC Corporation Method for manufacturing organic electronic element
KR101884177B1 (ko) 2013-12-27 2018-08-02 다우 코닝 도레이 캄파니 리미티드 실온-경화성 실리콘 고무 조성물, 및 그의 용도
JP6574771B2 (ja) 2013-12-27 2019-09-11 ダウ・東レ株式会社 室温硬化性シリコーンゴム組成物、その用途、および電子機器の補修方法
JP6528930B2 (ja) 2014-12-22 2019-06-12 株式会社スリーボンド コーティング剤組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3759867A (en) * 1972-03-02 1973-09-18 Gen Electric Molding compositions containing silanol free resins
US4111890A (en) * 1977-12-19 1978-09-05 Sws Silicones Corporation Curable organopolysiloxane compositions containing titanium esters
JPS58162660A (ja) * 1982-03-19 1983-09-27 Toray Silicone Co Ltd プライマ−組成物
JP3725178B2 (ja) * 1991-03-22 2005-12-07 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
US5645941A (en) * 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
JPH06329914A (ja) * 1993-05-18 1994-11-29 Toray Dow Corning Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物およびその製造方法
JP2764678B2 (ja) * 1993-05-20 1998-06-11 信越化学工業株式会社 マスキングまたはパッキング用室温硬化性シリコーン組成物
US5417265A (en) * 1993-10-12 1995-05-23 Newman Machine Company, Inc. Infeed method and apparatus for a machining device
JP3846640B2 (ja) * 1994-01-20 2006-11-15 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
TW343218B (en) * 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
US5859127A (en) * 1996-11-29 1999-01-12 Shin-Etsu Polymer Co., Ltd. Thermosetting resin composition and two-parts composite body thereof with silcone rubber
JP3420473B2 (ja) * 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 シリコーン系接着性シート、その製造方法、および半導体装置
DE19725501C1 (de) * 1997-06-17 1998-12-10 Huels Silicone Gmbh Alkoxyvernetzende RTVl-Siliconkautschuk-Mischungen
JP3394164B2 (ja) * 1997-08-14 2003-04-07 信越化学工業株式会社 剥離性紫外線硬化型シリコーン組成物
AU5229900A (en) * 1999-06-08 2000-12-28 Rhodia Chimie Compositions based on organopolysiloxanes and silylated polymer cured into elastomers at room temperature in the presence of moisture
JP2002020719A (ja) * 2000-07-11 2002-01-23 Shin Etsu Chem Co Ltd シリコーンゴム接着剤組成物及び該接着剤組成物と熱可塑性樹脂との一体成形体
JP4823431B2 (ja) * 2001-01-30 2011-11-24 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst

Also Published As

Publication number Publication date
DE602005006004D1 (de) 2008-05-21
CN100577734C (zh) 2010-01-06
JP2006022277A (ja) 2006-01-26
CN1984964A (zh) 2007-06-20
JP4733937B2 (ja) 2011-07-27
WO2006006371A2 (en) 2006-01-19
TWI379869B (en) 2012-12-21
TW200604291A (en) 2006-02-01
WO2006006371A3 (en) 2006-03-02
EP1789495B1 (en) 2008-04-09
EP1789495A2 (en) 2007-05-30
US20080319121A1 (en) 2008-12-25
ATE391753T1 (de) 2008-04-15

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: ONISHI, MASAYUKI, ICHIHARA-SHI, CHIBA 299-0108, JP

Inventor name: KODAMA, HARUMI, ICHIHARA-SHI, CHIBA 299-0108, JP

Inventor name: MITANI, OSAMU, ICHIHARA-SHI, CHIBA 299-0108, JP

8364 No opposition during term of opposition