JP4608182B2 - Ｏｌｅｄデバイスのカプセル化 - Google Patents

Ｏｌｅｄデバイスのカプセル化 Download PDF

Info

Publication number
JP4608182B2
JP4608182B2 JP2002525882A JP2002525882A JP4608182B2 JP 4608182 B2 JP4608182 B2 JP 4608182B2 JP 2002525882 A JP2002525882 A JP 2002525882A JP 2002525882 A JP2002525882 A JP 2002525882A JP 4608182 B2 JP4608182 B2 JP 4608182B2
Authority
JP
Japan
Prior art keywords
sealing
substrate
enclosure
cap
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002525882A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004508679A5 (enExample
JP2004508679A (ja
Inventor
カール ミヒャエル ギュンター エヴァルト
ダイ ヨーン アウフ マーク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2004508679A publication Critical patent/JP2004508679A/ja
Publication of JP2004508679A5 publication Critical patent/JP2004508679A5/ja
Application granted granted Critical
Publication of JP4608182B2 publication Critical patent/JP4608182B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
JP2002525882A 2000-09-06 2000-09-06 Ｏｌｅｄデバイスのカプセル化 Expired - Fee Related JP4608182B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2000/000133 WO2002021557A1 (en) 2000-09-06 2000-09-06 Encapsulation for oled devices

Publications (3)

Publication Number Publication Date
JP2004508679A JP2004508679A (ja) 2004-03-18
JP2004508679A5 JP2004508679A5 (enExample) 2005-03-17
JP4608182B2 true JP4608182B2 (ja) 2011-01-05

Family

ID=20428857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002525882A Expired - Fee Related JP4608182B2 (ja) 2000-09-06 2000-09-06 Ｏｌｅｄデバイスのカプセル化

Country Status (8)

Country Link
US (1) US7255823B1 (enExample)
EP (1) EP1320862B1 (enExample)
JP (1) JP4608182B2 (enExample)
CN (1) CN1292499C (enExample)
AU (1) AU2000274682A1 (enExample)
DE (1) DE60027021T2 (enExample)
TW (1) TW533611B (enExample)
WO (1) WO2002021557A1 (enExample)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
TWI222839B (en) * 1999-12-17 2004-10-21 Osram Opto Semiconductors Gmbh Method for encapsulation of electronic devices
EP1240808B1 (en) 1999-12-17 2003-05-21 Osram Opto Semiconductors GmbH Encapsulation for organic led device
US7394153B2 (en) 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
US6933537B2 (en) 2001-09-28 2005-08-23 Osram Opto Semiconductors Gmbh Sealing for OLED devices
KR100768182B1 (ko) 2001-10-26 2007-10-17 삼성에스디아이 주식회사 유기 전자 발광 소자와 그 제조방법
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7221093B2 (en) 2002-06-10 2007-05-22 Institute Of Materials Research And Engineering Patterning of electrodes in OLED devices
JP2004103337A (ja) * 2002-09-06 2004-04-02 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
JP2004303733A (ja) 2003-03-31 2004-10-28 Osram Opto Semiconductors Gmbh 構成素子、とりわけ有機発光ダイオードを備える表示装置
DE10329366B4 (de) * 2003-03-31 2005-06-02 Osram Opto Semiconductors Gmbh Bauelement, insbesondere Anzeigevorrichtung mit organischen Leuchtdioden
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US20050116245A1 (en) 2003-04-16 2005-06-02 Aitken Bruce G. Hermetically sealed glass package and method of fabrication
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7344901B2 (en) 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
EP1639658A1 (en) * 2003-06-16 2006-03-29 Koninklijke Philips Electronics N.V. Double seal with getter in flexible organic displays
JP4057017B2 (ja) * 2005-01-31 2008-03-05 富士通株式会社 電子装置及びその製造方法
US7419565B2 (en) 2005-02-01 2008-09-02 Eastman Kodak Company Method for encapsulating
JPWO2006088185A1 (ja) * 2005-02-21 2008-08-07 京セラ株式会社 Ｅｌ表示装置およびその製造方法
CN100424908C (zh) * 2005-07-28 2008-10-08 吉林大学 导电态聚苯胺/纳米晶体TiO2异质结二极管及其制备方法
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US7597603B2 (en) 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
US7537504B2 (en) 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
US20070164673A1 (en) * 2006-01-18 2007-07-19 Au Optronics Corporation Organic electro-luminescent display device and method for making same
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100673765B1 (ko) 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100635514B1 (ko) 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4456092B2 (ja) 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100685853B1 (ko) 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US8164257B2 (en) * 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
KR100688795B1 (ko) 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100671641B1 (ko) * 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100688796B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
KR100671639B1 (ko) * 2006-01-27 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100688790B1 (ko) * 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100703446B1 (ko) * 2006-02-21 2007-04-03 삼성에스디아이 주식회사 유기 전계 발광표시장치의 제조방법
KR100703519B1 (ko) * 2006-02-21 2007-04-03 삼성에스디아이 주식회사 유기 전계 발광표시장치의 제조방법
KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
JP5052829B2 (ja) * 2006-06-19 2012-10-17 住友化学株式会社 カプセル状マイクロ発光素子の製造方法
US7510400B2 (en) * 2007-03-14 2009-03-31 Visteon Global Technologies, Inc. LED interconnect spring clip assembly
CN101641424B (zh) * 2007-03-19 2013-12-04 纳米系统公司 用于包封纳米晶体的方法
US20100110728A1 (en) 2007-03-19 2010-05-06 Nanosys, Inc. Light-emitting diode (led) devices comprising nanocrystals
US20100155749A1 (en) * 2007-03-19 2010-06-24 Nanosys, Inc. Light-emitting diode (led) devices comprising nanocrystals
US7621752B2 (en) * 2007-07-17 2009-11-24 Visteon Global Technologies, Inc. LED interconnection integrated connector holder package
WO2009099425A2 (en) 2008-02-07 2009-08-13 Qd Vision, Inc. Flexible devices including semiconductor nanocrystals, arrays, and methods
US20090207617A1 (en) * 2008-02-20 2009-08-20 Merchant Viren B Light emitting diode (led) connector clip
US8448468B2 (en) 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
JP5328261B2 (ja) * 2008-08-13 2013-10-30 ローム株式会社 有機ｅｌ素子
US8247827B2 (en) * 2008-09-30 2012-08-21 Bridgelux, Inc. LED phosphor deposition
US8102119B2 (en) 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US10214686B2 (en) 2008-12-30 2019-02-26 Nanosys, Inc. Methods for encapsulating nanocrystals and resulting compositions
US11198270B2 (en) 2008-12-30 2021-12-14 Nanosys, Inc. Quantum dot films, lighting devices, and lighting methods
US8343575B2 (en) 2008-12-30 2013-01-01 Nanosys, Inc. Methods for encapsulating nanocrystals and resulting compositions
KR101097317B1 (ko) * 2009-11-18 2011-12-21 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
US8952552B2 (en) * 2009-11-19 2015-02-10 Qualcomm Incorporated Semiconductor package assembly systems and methods using DAM and trench structures
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
CN101859880B (zh) * 2010-05-06 2012-10-03 友达光电股份有限公司 电致发光显示装置及其制备方法
JP2010238678A (ja) * 2010-07-28 2010-10-21 Semiconductor Energy Lab Co Ltd 発光装置の作製方法および発光装置
EP3839335A1 (en) 2010-11-10 2021-06-23 Nanosys, Inc. Quantum dot films, lighting devices, and lighting methods
KR20130008100A (ko) * 2011-06-22 2013-01-22 삼성디스플레이 주식회사 유기 발광 조명 장치
KR20130065219A (ko) 2011-12-09 2013-06-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
CN102854666B (zh) * 2012-07-23 2015-11-25 北京京东方光电科技有限公司 一种液晶面板及液晶显示装置
KR101924526B1 (ko) * 2012-08-22 2018-12-04 삼성디스플레이 주식회사 유기 발광 표시장치 및 그 제조방법
KR20150050575A (ko) 2012-08-30 2015-05-08 코닝 인코포레이티드 안티몬-비함유 유리, 안티몬-비함유 프릿 및 프릿으로 기밀된 유리 패키지
KR102113600B1 (ko) * 2012-12-07 2020-05-21 엘지디스플레이 주식회사 유기 발광 다이오드 표시 장치 및 이의 제조 방법
KR20150043080A (ko) * 2013-10-14 2015-04-22 삼성디스플레이 주식회사 유기 발광 표시 장치
US9812667B2 (en) 2015-11-04 2017-11-07 Microsoft Technology Licensing, Llc Patterning of OLED display stacks
KR102466959B1 (ko) 2015-12-31 2022-11-11 엘지디스플레이 주식회사 유기 발광 표시 장치
CN106784379A (zh) * 2016-12-29 2017-05-31 长春海谱润斯科技有限公司 一种有机发光显示面板及其制造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228293A (en) * 1975-08-27 1977-03-03 Sharp Corp Electric colour display unit
JPS61234161A (ja) * 1985-04-10 1986-10-18 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサ
JPS62201727U (enExample) * 1986-06-16 1987-12-23
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
JP3158667B2 (ja) * 1991-08-01 2001-04-23 セイコーエプソン株式会社 液晶表示素子の製造方法及び液晶表示素子の再生方法
JPH07168195A (ja) * 1993-12-15 1995-07-04 Casio Comput Co Ltd 液晶表示素子及びその製造方法
US5964030A (en) * 1994-06-10 1999-10-12 Vlsi Technology, Inc. Mold flow regulating dam ring
US5577319A (en) * 1995-03-31 1996-11-26 Motorola, Inc. Method of encapsulating a crystal oscillator
US5714838A (en) * 1996-09-20 1998-02-03 International Business Machines Corporation Optically transparent diffusion barrier and top electrode in organic light emitting diode structures
NL1004651C2 (nl) * 1996-11-29 1998-06-03 Nedcard Werkwijze voor het inkapselen van een chip op een drager.
CA2275542A1 (en) 1996-12-23 1998-07-02 The Trustees Of Princeton University An organic light emitting device containing a protection layer
CA2275514A1 (en) * 1996-12-23 1998-07-02 Paul Burrows Light emitting articles with light reflecting structures
US5920080A (en) 1997-06-23 1999-07-06 Fed Corporation Emissive display using organic light emitting diodes
US5965907A (en) * 1997-09-29 1999-10-12 Motorola, Inc. Full color organic light emitting backlight device for liquid crystal display applications
US6022583A (en) * 1997-12-16 2000-02-08 Nordson Corporation Method of encapsulating a wire bonded die
JPH11264991A (ja) * 1998-01-13 1999-09-28 Matsushita Electric Ind Co Ltd 液晶表示素子の製造方法
JP2000019566A (ja) * 1998-07-03 2000-01-21 Mitsubishi Motors Corp 調光ガラス構造
JP2000030857A (ja) * 1998-07-08 2000-01-28 Futaba Corp 有機ｅｌ素子とその製造方法
EP1029336A1 (en) * 1998-09-11 2000-08-23 Fed Corporation Top emitting oled with refractory metal compounds as bottom cathode
EP0986112A3 (en) * 1998-09-11 2004-02-04 Agilent Technologies, Inc. (a Delaware corporation) An efficient method for fabricating organic light emitting diodes
US6166489A (en) 1998-09-15 2000-12-26 The Trustees Of Princeton University Light emitting device using dual light emitting stacks to achieve full-color emission
US6219126B1 (en) * 1998-11-20 2001-04-17 International Business Machines Corporation Panel assembly for liquid crystal displays having a barrier fillet and an adhesive fillet in the periphery
US6650392B2 (en) * 2000-03-15 2003-11-18 Kabushiki Kaisha Toshiba Cell structure of liquid crystal device
JP2002277884A (ja) * 2001-03-14 2002-09-25 Koninkl Philips Electronics Nv 液晶表示装置
US6791660B1 (en) * 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
JP2004303733A (ja) * 2003-03-31 2004-10-28 Osram Opto Semiconductors Gmbh 構成素子、とりわけ有機発光ダイオードを備える表示装置

Also Published As

Publication number Publication date
EP1320862B1 (en) 2006-03-29
WO2002021557A1 (en) 2002-03-14
CN1454390A (zh) 2003-11-05
CN1292499C (zh) 2006-12-27
EP1320862A1 (en) 2003-06-25
DE60027021T2 (de) 2006-08-24
DE60027021D1 (de) 2006-05-18
AU2000274682A1 (en) 2002-03-22
TW533611B (en) 2003-05-21
US7255823B1 (en) 2007-08-14
JP2004508679A (ja) 2004-03-18

Similar Documents

Publication Publication Date Title
JP4608182B2 (ja) Ｏｌｅｄデバイスのカプセル化
US6784009B2 (en) Electrode patterning in OLED devices
US6888237B1 (en) Encapsulation of a device
CN100431196C (zh) 在有机发光二极管装置中形成电极图案
US6952078B1 (en) Encapsulation for organic LED device
CN110416434A (zh) 显示基板及其制备方法、显示装置
US20070190682A1 (en) Patterning of electrodes in oled devices
US6888308B1 (en) Organic LED device
US20030209979A1 (en) Encapsulation for electroluminescent devices
JP2010027624A (ja) 電子装置のカプセル化のための方法
CN111864067A (zh) 可拉伸显示面板及其制造方法、显示装置
CN1781199A (zh) 有机器件的连接
CN1653626B (zh) 有机装置
CN111900265A (zh) 显示面板和显示装置
CN114188382B (zh) Oled显示面板及其封装方法
JP7118100B2 (ja) 発光装置及び発光装置の製造方法
CN118678732A (zh) 显示面板和显示装置
KR20040019502A (ko) 포토레지스트를 이용한 유기 ｅｌ 소자 및 제조방법

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070723

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100219

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100517

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100526

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100615

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100622

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100720

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100727

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100819

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100910

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20101008

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131015

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees