JP4597323B2 - 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート - Google Patents

紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート Download PDF

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Publication number
JP4597323B2
JP4597323B2 JP2000206642A JP2000206642A JP4597323B2 JP 4597323 B2 JP4597323 B2 JP 4597323B2 JP 2000206642 A JP2000206642 A JP 2000206642A JP 2000206642 A JP2000206642 A JP 2000206642A JP 4597323 B2 JP4597323 B2 JP 4597323B2
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JP
Japan
Prior art keywords
sensitive adhesive
ultraviolet curable
pressure
ultraviolet
curable pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000206642A
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English (en)
Japanese (ja)
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JP2002020699A5 (https=
JP2002020699A (ja
Inventor
井 道 生 金
澤 英 樹 沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2000206642A priority Critical patent/JP4597323B2/ja
Priority to US09/894,545 priority patent/US6605345B2/en
Priority to EP01305880A priority patent/EP1170345B1/en
Priority to MYPI20013221A priority patent/MY125997A/en
Priority to KR1020010040242A priority patent/KR100778199B1/ko
Priority to SG200104068-2A priority patent/SG134966A1/en
Priority to DE60114310T priority patent/DE60114310T2/de
Priority to CNB011227133A priority patent/CN1259384C/zh
Priority to TW090116543A priority patent/TWI293640B/zh
Publication of JP2002020699A publication Critical patent/JP2002020699A/ja
Publication of JP2002020699A5 publication Critical patent/JP2002020699A5/ja
Application granted granted Critical
Publication of JP4597323B2 publication Critical patent/JP4597323B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP2000206642A 2000-07-07 2000-07-07 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート Expired - Lifetime JP4597323B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2000206642A JP4597323B2 (ja) 2000-07-07 2000-07-07 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート
US09/894,545 US6605345B2 (en) 2000-07-07 2001-06-28 Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet
MYPI20013221A MY125997A (en) 2000-07-07 2001-07-06 Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet
KR1020010040242A KR100778199B1 (ko) 2000-07-07 2001-07-06 자외선-경화형 점착제 조성물 및 자외선-경화성 점착시트
SG200104068-2A SG134966A1 (en) 2000-07-07 2001-07-06 Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet
DE60114310T DE60114310T2 (de) 2000-07-07 2001-07-06 Durch UV-Strahlung aushärtbare druckempfindliche Klebstoffzusammensetzung und durch UV-Strahlung aushärtbarer druckempfindlicher Klebefilm
EP01305880A EP1170345B1 (en) 2000-07-07 2001-07-06 Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet
CNB011227133A CN1259384C (zh) 2000-07-07 2001-07-06 可紫外线固化压敏粘合剂组合物和可紫外线固化压敏粘合剂片
TW090116543A TWI293640B (en) 2000-07-07 2001-07-06 Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000206642A JP4597323B2 (ja) 2000-07-07 2000-07-07 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート

Publications (3)

Publication Number Publication Date
JP2002020699A JP2002020699A (ja) 2002-01-23
JP2002020699A5 JP2002020699A5 (https=) 2007-08-23
JP4597323B2 true JP4597323B2 (ja) 2010-12-15

Family

ID=18703533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000206642A Expired - Lifetime JP4597323B2 (ja) 2000-07-07 2000-07-07 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート

Country Status (9)

Country Link
US (1) US6605345B2 (https=)
EP (1) EP1170345B1 (https=)
JP (1) JP4597323B2 (https=)
KR (1) KR100778199B1 (https=)
CN (1) CN1259384C (https=)
DE (1) DE60114310T2 (https=)
MY (1) MY125997A (https=)
SG (1) SG134966A1 (https=)
TW (1) TWI293640B (https=)

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US7641966B2 (en) * 1999-06-14 2010-01-05 Nitto Denko Corporation Re-release adhesive and re-release adhesive sheet
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
JP4812963B2 (ja) * 2001-05-18 2011-11-09 リンテック株式会社 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法
EP1484377B9 (en) * 2002-03-13 2013-04-10 Bridgestone Corporation Photo-curable adhesive sheet, photo-curable transfer sheet, optical information recording medium and method for preparing optical information recording medium
WO2004088728A2 (en) * 2003-04-02 2004-10-14 Koninklijke Philips Electronics N.V. Method of manufacturing a flexible electronic device and flexible device
JP4531355B2 (ja) * 2003-06-25 2010-08-25 日東電工株式会社 ダイシング用粘着シートおよび半導体素子の製造方法
KR100838973B1 (ko) * 2005-06-08 2008-06-17 주식회사 엘지화학 아크릴계 점착제 조성물
JP2008060151A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JP2011093959A (ja) * 2009-10-27 2011-05-12 Nitto Denko Corp 粘着シートの製造方法
JP5307069B2 (ja) * 2010-03-31 2013-10-02 古河電気工業株式会社 放射線硬化性半導体ウエハ表面保護用粘着テープ
JP5907472B2 (ja) * 2011-05-26 2016-04-26 住友ベークライト株式会社 半導体ウエハ加工用粘着テープ
JP5770038B2 (ja) * 2011-07-25 2015-08-26 リンテック株式会社 粘着シート
WO2014142085A1 (ja) * 2013-03-11 2014-09-18 リンテック株式会社 粘着シートおよび加工されたデバイス関連部材の製造方法
JP6360829B2 (ja) * 2013-06-14 2018-07-18 デンカ株式会社 半導体検査用の耐熱性粘着シート
CN113715458A (zh) 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
CN105482726B (zh) * 2014-09-17 2019-05-07 晟碟信息科技（上海）有限公司 切片胶带和剥离方法
KR102069936B1 (ko) * 2016-04-29 2020-01-23 주식회사 엘지화학 발열체
KR102069937B1 (ko) * 2016-04-29 2020-01-23 주식회사 엘지화학 발열체의 제조방법
KR102101056B1 (ko) 2016-06-16 2020-04-14 주식회사 엘지화학 발열체 및 이의 제조방법
JP6539383B2 (ja) * 2018-06-18 2019-07-03 積水化学工業株式会社 粘着テープ
WO2020203574A1 (ja) * 2019-03-29 2020-10-08 富士フイルム株式会社 反射シートおよび反射シート用転写フィルム
KR102318161B1 (ko) * 2021-04-01 2021-10-26 동우 화인켐 주식회사 접착제 조성물 및 전지용 포장재료

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Also Published As

Publication number Publication date
EP1170345A2 (en) 2002-01-09
SG134966A1 (en) 2007-09-28
US6605345B2 (en) 2003-08-12
MY125997A (en) 2006-09-29
TWI293640B (en) 2008-02-21
KR20020005468A (ko) 2002-01-17
EP1170345A3 (en) 2002-06-05
JP2002020699A (ja) 2002-01-23
KR100778199B1 (ko) 2007-11-27
EP1170345B1 (en) 2005-10-26
DE60114310D1 (de) 2005-12-01
US20020019454A1 (en) 2002-02-14
DE60114310T2 (de) 2006-04-20
CN1259384C (zh) 2006-06-14
CN1332216A (zh) 2002-01-23

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