CN1259384C - 可紫外线固化压敏粘合剂组合物和可紫外线固化压敏粘合剂片 - Google Patents

可紫外线固化压敏粘合剂组合物和可紫外线固化压敏粘合剂片 Download PDF

Info

Publication number
CN1259384C
CN1259384C CNB011227133A CN01122713A CN1259384C CN 1259384 C CN1259384 C CN 1259384C CN B011227133 A CNB011227133 A CN B011227133A CN 01122713 A CN01122713 A CN 01122713A CN 1259384 C CN1259384 C CN 1259384C
Authority
CN
China
Prior art keywords
sensitive adhesive
ultraviolet
curable pressure
pressure
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB011227133A
Other languages
English (en)
Chinese (zh)
Other versions
CN1332216A (zh
Inventor
金井道生
沼泽英树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN1332216A publication Critical patent/CN1332216A/zh
Application granted granted Critical
Publication of CN1259384C publication Critical patent/CN1259384C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
CNB011227133A 2000-07-07 2001-07-06 可紫外线固化压敏粘合剂组合物和可紫外线固化压敏粘合剂片 Expired - Lifetime CN1259384C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP206642/00 2000-07-07
JP206642/2000 2000-07-07
JP2000206642A JP4597323B2 (ja) 2000-07-07 2000-07-07 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート

Publications (2)

Publication Number Publication Date
CN1332216A CN1332216A (zh) 2002-01-23
CN1259384C true CN1259384C (zh) 2006-06-14

Family

ID=18703533

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011227133A Expired - Lifetime CN1259384C (zh) 2000-07-07 2001-07-06 可紫外线固化压敏粘合剂组合物和可紫外线固化压敏粘合剂片

Country Status (9)

Country Link
US (1) US6605345B2 (https=)
EP (1) EP1170345B1 (https=)
JP (1) JP4597323B2 (https=)
KR (1) KR100778199B1 (https=)
CN (1) CN1259384C (https=)
DE (1) DE60114310T2 (https=)
MY (1) MY125997A (https=)
SG (1) SG134966A1 (https=)
TW (1) TWI293640B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108886843A (zh) * 2016-06-16 2018-11-23 株式会社Lg化学 加热元件及其制造方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7641966B2 (en) * 1999-06-14 2010-01-05 Nitto Denko Corporation Re-release adhesive and re-release adhesive sheet
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
JP4812963B2 (ja) * 2001-05-18 2011-11-09 リンテック株式会社 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法
EP1484377B9 (en) * 2002-03-13 2013-04-10 Bridgestone Corporation Photo-curable adhesive sheet, photo-curable transfer sheet, optical information recording medium and method for preparing optical information recording medium
WO2004088728A2 (en) * 2003-04-02 2004-10-14 Koninklijke Philips Electronics N.V. Method of manufacturing a flexible electronic device and flexible device
JP4531355B2 (ja) * 2003-06-25 2010-08-25 日東電工株式会社 ダイシング用粘着シートおよび半導体素子の製造方法
KR100838973B1 (ko) * 2005-06-08 2008-06-17 주식회사 엘지화학 아크릴계 점착제 조성물
JP2008060151A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JP2011093959A (ja) * 2009-10-27 2011-05-12 Nitto Denko Corp 粘着シートの製造方法
JP5307069B2 (ja) * 2010-03-31 2013-10-02 古河電気工業株式会社 放射線硬化性半導体ウエハ表面保護用粘着テープ
JP5907472B2 (ja) * 2011-05-26 2016-04-26 住友ベークライト株式会社 半導体ウエハ加工用粘着テープ
JP5770038B2 (ja) * 2011-07-25 2015-08-26 リンテック株式会社 粘着シート
WO2014142085A1 (ja) * 2013-03-11 2014-09-18 リンテック株式会社 粘着シートおよび加工されたデバイス関連部材の製造方法
JP6360829B2 (ja) * 2013-06-14 2018-07-18 デンカ株式会社 半導体検査用の耐熱性粘着シート
CN113715458A (zh) 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
CN105482726B (zh) * 2014-09-17 2019-05-07 晟碟信息科技（上海）有限公司 切片胶带和剥离方法
KR102069936B1 (ko) * 2016-04-29 2020-01-23 주식회사 엘지화학 발열체
KR102069937B1 (ko) * 2016-04-29 2020-01-23 주식회사 엘지화학 발열체의 제조방법
JP6539383B2 (ja) * 2018-06-18 2019-07-03 積水化学工業株式会社 粘着テープ
WO2020203574A1 (ja) * 2019-03-29 2020-10-08 富士フイルム株式会社 反射シートおよび反射シート用転写フィルム
KR102318161B1 (ko) * 2021-04-01 2021-10-26 동우 화인켐 주식회사 접착제 조성물 및 전지용 포장재료

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2909994A1 (de) * 1979-03-14 1980-10-02 Basf Ag Acylphosphinoxidverbindungen, ihre herstellung und verwendung
DE3133419A1 (de) * 1981-08-24 1983-03-10 Basf Ag, 6700 Ludwigshafen Acylphosphinoxidverbindungen und ihre verwendung
JPH0616524B2 (ja) 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板
US5714029A (en) 1984-03-12 1998-02-03 Nitto Electric Industrial Co., Ltd. Process for working a semiconductor wafer
JPS60223139A (ja) 1984-04-18 1985-11-07 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板
US5218009A (en) * 1989-08-04 1993-06-08 Ciba-Geigy Corporation Mono- and di-acylphosphine oxides
JP2601956B2 (ja) 1991-07-31 1997-04-23 リンテック株式会社 再剥離型粘着性ポリマー
JPH05179211A (ja) * 1991-12-30 1993-07-20 Nitto Denko Corp ダイシング・ダイボンドフイルム
JP3491911B2 (ja) * 1992-07-29 2004-02-03 リンテック株式会社 半導体ウエハ加工用粘着シート
DE4240964A1 (de) 1992-12-05 1994-06-09 Basf Ag Arenbisphosphinoxide
US5683798A (en) * 1993-11-10 1997-11-04 Minnesota Mining And Manufacturing Company Tackified pressure sensitive adhesives
JP2984549B2 (ja) 1994-07-12 1999-11-29 リンテック株式会社 エネルギー線硬化型感圧粘着剤組成物およびその利用方法
JPH08124881A (ja) * 1994-10-28 1996-05-17 Nec Corp ダイシングテープ及びそれを用いた半導体装置の組立方 法
JP3035179B2 (ja) * 1995-01-13 2000-04-17 住友ベークライト株式会社 半導体ウエハ加工用粘着シート
SG53043A1 (en) * 1996-08-28 1998-09-28 Ciba Geigy Ag Molecular complex compounds as photoinitiators
JPH10130591A (ja) 1996-10-31 1998-05-19 Sekisui Chem Co Ltd 粘着テープの製造方法
JPH10231340A (ja) * 1996-12-20 1998-09-02 Takeda Chem Ind Ltd 光硬化性樹脂組成物およびその製造方法
JPH10337823A (ja) * 1997-04-11 1998-12-22 Lintec Corp 基材および該基材を用いた粘着テープ
IT1309578B1 (it) * 1998-02-27 2002-01-24 Ciba Sc Holding Ag Composizione fotoinduribile pigmentata.
JP3669196B2 (ja) * 1998-07-27 2005-07-06 日東電工株式会社 紫外線硬化型粘着シート
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
SE9904080D0 (sv) * 1998-12-03 1999-11-11 Ciba Sc Holding Ag Fotoinitiatorberedning
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108886843A (zh) * 2016-06-16 2018-11-23 株式会社Lg化学 加热元件及其制造方法
CN108886843B (zh) * 2016-06-16 2021-05-28 株式会社Lg化学 加热元件及其制造方法

Also Published As

Publication number Publication date
EP1170345A2 (en) 2002-01-09
SG134966A1 (en) 2007-09-28
US6605345B2 (en) 2003-08-12
MY125997A (en) 2006-09-29
TWI293640B (en) 2008-02-21
KR20020005468A (ko) 2002-01-17
EP1170345A3 (en) 2002-06-05
JP2002020699A (ja) 2002-01-23
KR100778199B1 (ko) 2007-11-27
JP4597323B2 (ja) 2010-12-15
EP1170345B1 (en) 2005-10-26
DE60114310D1 (de) 2005-12-01
US20020019454A1 (en) 2002-02-14
DE60114310T2 (de) 2006-04-20
CN1332216A (zh) 2002-01-23

Similar Documents

Publication Publication Date Title
CN1259384C (zh) 可紫外线固化压敏粘合剂组合物和可紫外线固化压敏粘合剂片
CN1173000C (zh) 用于粘合晶片的压敏粘合剂片
KR101375397B1 (ko) 점착 시트
CN1145202C (zh) 用于晶片背磨的表面保护片及其使用方法
JP3383227B2 (ja) 半導体ウエハの裏面研削方法
KR101393922B1 (ko) 점착제 조성물, 점착 테이프, 및 웨이퍼의 처리 방법
JP5781302B2 (ja) 放射線硬化型粘着剤組成物及び粘着シート
CN101606229B (zh) 切割带及半导体器件的制造方法
CN1264940C (zh) 切割用胶粘薄膜及切割方法
CN1912038A (zh) 粘合片及其制造方法、以及制品的加工方法
CN1386813A (zh) 用于半导体晶片加工的压敏粘合片
KR102642081B1 (ko) 점착 테이프 및 반도체 장치의 제조 방법
CN1748012A (zh) 用于向其粘结晶片的压敏胶粘带
JPWO2009144985A1 (ja) ダイシング方法
KR20180105568A (ko) 다이싱용 점착 테이프, 다이싱용 점착 테이프의 제조 방법, 및 반도체 칩의 제조 방법
JP2011213879A (ja) 接着剤組成物、接着シートおよび半導体装置の製造方法
JPH10279894A (ja) 半導体ウエハ加工用粘着シ―ト類と加工方法
JP4364368B2 (ja) 半導体チップの製造方法
JP4805549B2 (ja) 粘着シート
CN101138075A (zh) 晶片切割用胶粘带及使用该胶粘带的芯片的制造方法
JP2012033889A (ja) ウエハ加工用テープおよびそれを用いた半導体加工方法
JP2011258636A (ja) ウエハダイシング加工用粘着テープ
JP2004182799A (ja) 両面粘着テープ
TW202525957A (zh) 感壓膠帶、其製造方法及使用方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20060614