DE60114310D1 - Durch UV-Strahlung aushärtbare druckempfindliche Klebstoffzusammensetzung und durch UV-Strahlung aushärtbarer druckempfindlicher Klebefilm - Google Patents

Durch UV-Strahlung aushärtbare druckempfindliche Klebstoffzusammensetzung und durch UV-Strahlung aushärtbarer druckempfindlicher Klebefilm

Info

Publication number
DE60114310D1
DE60114310D1 DE60114310T DE60114310T DE60114310D1 DE 60114310 D1 DE60114310 D1 DE 60114310D1 DE 60114310 T DE60114310 T DE 60114310T DE 60114310 T DE60114310 T DE 60114310T DE 60114310 D1 DE60114310 D1 DE 60114310D1
Authority
DE
Germany
Prior art keywords
sensitive adhesive
curable pressure
adhesive composition
adhesive film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60114310T
Other languages
English (en)
Other versions
DE60114310T2 (de
Inventor
Michio Kanai
Hideki Numazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of DE60114310D1 publication Critical patent/DE60114310D1/de
Publication of DE60114310T2 publication Critical patent/DE60114310T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
DE60114310T 2000-07-07 2001-07-06 Durch UV-Strahlung aushärtbare druckempfindliche Klebstoffzusammensetzung und durch UV-Strahlung aushärtbarer druckempfindlicher Klebefilm Expired - Fee Related DE60114310T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000206642A JP4597323B2 (ja) 2000-07-07 2000-07-07 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート
JP2000206642 2000-07-07

Publications (2)

Publication Number Publication Date
DE60114310D1 true DE60114310D1 (de) 2005-12-01
DE60114310T2 DE60114310T2 (de) 2006-04-20

Family

ID=18703533

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60114310T Expired - Fee Related DE60114310T2 (de) 2000-07-07 2001-07-06 Durch UV-Strahlung aushärtbare druckempfindliche Klebstoffzusammensetzung und durch UV-Strahlung aushärtbarer druckempfindlicher Klebefilm

Country Status (9)

Country Link
US (1) US6605345B2 (de)
EP (1) EP1170345B1 (de)
JP (1) JP4597323B2 (de)
KR (1) KR100778199B1 (de)
CN (1) CN1259384C (de)
DE (1) DE60114310T2 (de)
MY (1) MY125997A (de)
SG (1) SG134966A1 (de)
TW (1) TWI293640B (de)

Families Citing this family (22)

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US7641966B2 (en) * 1999-06-14 2010-01-05 Nitto Denko Corporation Re-release adhesive and re-release adhesive sheet
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
JP4812963B2 (ja) * 2001-05-18 2011-11-09 リンテック株式会社 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法
WO2003076541A1 (fr) * 2002-03-13 2003-09-18 Bridgestone Corporation Feuille adhesive photodurcissable, feuille de transfert photocurcissable, et support d'enregistrement d'informations optiques et son procede de preparation
US7951687B2 (en) 2003-04-02 2011-05-31 Polymer Vision Limited Method of manufacturing a flexible electronic device and flexible device
JP4531355B2 (ja) * 2003-06-25 2010-08-25 日東電工株式会社 ダイシング用粘着シートおよび半導体素子の製造方法
KR100838973B1 (ko) * 2005-06-08 2008-06-17 주식회사 엘지화학 아크릴계 점착제 조성물
JP2008060151A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JP2011093959A (ja) * 2009-10-27 2011-05-12 Nitto Denko Corp 粘着シートの製造方法
JP5307069B2 (ja) * 2010-03-31 2013-10-02 古河電気工業株式会社 放射線硬化性半導体ウエハ表面保護用粘着テープ
JP5907472B2 (ja) * 2011-05-26 2016-04-26 住友ベークライト株式会社 半導体ウエハ加工用粘着テープ
JP5770038B2 (ja) * 2011-07-25 2015-08-26 リンテック株式会社 粘着シート
WO2014142085A1 (ja) * 2013-03-11 2014-09-18 リンテック株式会社 粘着シートおよび加工されたデバイス関連部材の製造方法
MY181765A (en) * 2013-06-14 2021-01-06 Denka Company Ltd Heat-resistant adhesive sheet for semiconductor testing
EP3177463A4 (de) 2014-08-05 2018-06-27 Uniqarta, Inc. Aufbau von ultrakleinen oder ultradünnen separaten komponenten zur leichten montage
CN105482726B (zh) * 2014-09-17 2019-05-07 晟碟信息科技（上海）有限公司 切片胶带和剥离方法
KR102069936B1 (ko) * 2016-04-29 2020-01-23 주식회사 엘지화학 발열체
KR102069937B1 (ko) * 2016-04-29 2020-01-23 주식회사 엘지화학 발열체의 제조방법
KR102101056B1 (ko) * 2016-06-16 2020-04-14 주식회사 엘지화학 발열체 및 이의 제조방법
JP6539383B2 (ja) * 2018-06-18 2019-07-03 積水化学工業株式会社 粘着テープ
JPWO2020203574A1 (de) * 2019-03-29 2020-10-08
KR102318161B1 (ko) * 2021-04-01 2021-10-26 동우 화인켐 주식회사 접착제 조성물 및 전지용 포장재료

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DE2909994A1 (de) * 1979-03-14 1980-10-02 Basf Ag Acylphosphinoxidverbindungen, ihre herstellung und verwendung
DE3133419A1 (de) * 1981-08-24 1983-03-10 Basf Ag, 6700 Ludwigshafen Acylphosphinoxidverbindungen und ihre verwendung
US5714029A (en) 1984-03-12 1998-02-03 Nitto Electric Industrial Co., Ltd. Process for working a semiconductor wafer
JPH0616524B2 (ja) 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板
JPS60223139A (ja) 1984-04-18 1985-11-07 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板
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JPH05179211A (ja) * 1991-12-30 1993-07-20 Nitto Denko Corp ダイシング・ダイボンドフイルム
JP3491911B2 (ja) * 1992-07-29 2004-02-03 リンテック株式会社 半導体ウエハ加工用粘着シート
DE4240964A1 (de) * 1992-12-05 1994-06-09 Basf Ag Arenbisphosphinoxide
US5683798A (en) * 1993-11-10 1997-11-04 Minnesota Mining And Manufacturing Company Tackified pressure sensitive adhesives
JP2984549B2 (ja) 1994-07-12 1999-11-29 リンテック株式会社 エネルギー線硬化型感圧粘着剤組成物およびその利用方法
JPH08124881A (ja) * 1994-10-28 1996-05-17 Nec Corp ダイシングテープ及びそれを用いた半導体装置の組立方 法
JP3035179B2 (ja) * 1995-01-13 2000-04-17 住友ベークライト株式会社 半導体ウエハ加工用粘着シート
SG53043A1 (en) * 1996-08-28 1998-09-28 Ciba Geigy Ag Molecular complex compounds as photoinitiators
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JPH10231340A (ja) * 1996-12-20 1998-09-02 Takeda Chem Ind Ltd 光硬化性樹脂組成物およびその製造方法
JPH10337823A (ja) * 1997-04-11 1998-12-22 Lintec Corp 基材および該基材を用いた粘着テープ
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JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
SE9904080D0 (sv) * 1998-12-03 1999-11-11 Ciba Sc Holding Ag Fotoinitiatorberedning
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類

Also Published As

Publication number Publication date
MY125997A (en) 2006-09-29
EP1170345B1 (de) 2005-10-26
KR20020005468A (ko) 2002-01-17
EP1170345A2 (de) 2002-01-09
US20020019454A1 (en) 2002-02-14
TWI293640B (en) 2008-02-21
KR100778199B1 (ko) 2007-11-27
JP4597323B2 (ja) 2010-12-15
US6605345B2 (en) 2003-08-12
SG134966A1 (en) 2007-09-28
DE60114310T2 (de) 2006-04-20
CN1259384C (zh) 2006-06-14
CN1332216A (zh) 2002-01-23
EP1170345A3 (de) 2002-06-05
JP2002020699A (ja) 2002-01-23

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee