JP2002020699A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002020699A5 JP2002020699A5 JP2000206642A JP2000206642A JP2002020699A5 JP 2002020699 A5 JP2002020699 A5 JP 2002020699A5 JP 2000206642 A JP2000206642 A JP 2000206642A JP 2000206642 A JP2000206642 A JP 2000206642A JP 2002020699 A5 JP2002020699 A5 JP 2002020699A5
- Authority
- JP
- Japan
- Prior art keywords
- ultraviolet
- sensitive adhesive
- curable pressure
- adhesive composition
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical compound O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000206642A JP4597323B2 (ja) | 2000-07-07 | 2000-07-07 | 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート |
| US09/894,545 US6605345B2 (en) | 2000-07-07 | 2001-06-28 | Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet |
| MYPI20013221A MY125997A (en) | 2000-07-07 | 2001-07-06 | Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet |
| KR1020010040242A KR100778199B1 (ko) | 2000-07-07 | 2001-07-06 | 자외선-경화형 점착제 조성물 및 자외선-경화성 점착시트 |
| SG200104068-2A SG134966A1 (en) | 2000-07-07 | 2001-07-06 | Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet |
| DE60114310T DE60114310T2 (de) | 2000-07-07 | 2001-07-06 | Durch UV-Strahlung aushärtbare druckempfindliche Klebstoffzusammensetzung und durch UV-Strahlung aushärtbarer druckempfindlicher Klebefilm |
| EP01305880A EP1170345B1 (en) | 2000-07-07 | 2001-07-06 | Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet |
| CNB011227133A CN1259384C (zh) | 2000-07-07 | 2001-07-06 | 可紫外线固化压敏粘合剂组合物和可紫外线固化压敏粘合剂片 |
| TW090116543A TWI293640B (en) | 2000-07-07 | 2001-07-06 | Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000206642A JP4597323B2 (ja) | 2000-07-07 | 2000-07-07 | 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002020699A JP2002020699A (ja) | 2002-01-23 |
| JP2002020699A5 true JP2002020699A5 (https=) | 2007-08-23 |
| JP4597323B2 JP4597323B2 (ja) | 2010-12-15 |
Family
ID=18703533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000206642A Expired - Lifetime JP4597323B2 (ja) | 2000-07-07 | 2000-07-07 | 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6605345B2 (https=) |
| EP (1) | EP1170345B1 (https=) |
| JP (1) | JP4597323B2 (https=) |
| KR (1) | KR100778199B1 (https=) |
| CN (1) | CN1259384C (https=) |
| DE (1) | DE60114310T2 (https=) |
| MY (1) | MY125997A (https=) |
| SG (1) | SG134966A1 (https=) |
| TW (1) | TWI293640B (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7641966B2 (en) * | 1999-06-14 | 2010-01-05 | Nitto Denko Corporation | Re-release adhesive and re-release adhesive sheet |
| JP2001240842A (ja) * | 2000-02-28 | 2001-09-04 | Nitto Denko Corp | 紫外線硬化型粘着剤組成物とその粘着シ―ト類 |
| JP4812963B2 (ja) * | 2001-05-18 | 2011-11-09 | リンテック株式会社 | 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法 |
| EP1484377B9 (en) * | 2002-03-13 | 2013-04-10 | Bridgestone Corporation | Photo-curable adhesive sheet, photo-curable transfer sheet, optical information recording medium and method for preparing optical information recording medium |
| WO2004088728A2 (en) * | 2003-04-02 | 2004-10-14 | Koninklijke Philips Electronics N.V. | Method of manufacturing a flexible electronic device and flexible device |
| JP4531355B2 (ja) * | 2003-06-25 | 2010-08-25 | 日東電工株式会社 | ダイシング用粘着シートおよび半導体素子の製造方法 |
| KR100838973B1 (ko) * | 2005-06-08 | 2008-06-17 | 주식회사 엘지화학 | 아크릴계 점착제 조성물 |
| JP2008060151A (ja) * | 2006-08-29 | 2008-03-13 | Nitto Denko Corp | 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート |
| JP2011093959A (ja) * | 2009-10-27 | 2011-05-12 | Nitto Denko Corp | 粘着シートの製造方法 |
| JP5307069B2 (ja) * | 2010-03-31 | 2013-10-02 | 古河電気工業株式会社 | 放射線硬化性半導体ウエハ表面保護用粘着テープ |
| JP5907472B2 (ja) * | 2011-05-26 | 2016-04-26 | 住友ベークライト株式会社 | 半導体ウエハ加工用粘着テープ |
| JP5770038B2 (ja) * | 2011-07-25 | 2015-08-26 | リンテック株式会社 | 粘着シート |
| WO2014142085A1 (ja) * | 2013-03-11 | 2014-09-18 | リンテック株式会社 | 粘着シートおよび加工されたデバイス関連部材の製造方法 |
| JP6360829B2 (ja) * | 2013-06-14 | 2018-07-18 | デンカ株式会社 | 半導体検査用の耐熱性粘着シート |
| CN113715458A (zh) | 2014-08-05 | 2021-11-30 | 库利克和索夫工业公司 | 用于传送分立元件的方法和装置 |
| CN105482726B (zh) * | 2014-09-17 | 2019-05-07 | 晟碟信息科技（上海）有限公司 | 切片胶带和剥离方法 |
| KR102069936B1 (ko) * | 2016-04-29 | 2020-01-23 | 주식회사 엘지화학 | 발열체 |
| KR102069937B1 (ko) * | 2016-04-29 | 2020-01-23 | 주식회사 엘지화학 | 발열체의 제조방법 |
| KR102101056B1 (ko) | 2016-06-16 | 2020-04-14 | 주식회사 엘지화학 | 발열체 및 이의 제조방법 |
| JP6539383B2 (ja) * | 2018-06-18 | 2019-07-03 | 積水化学工業株式会社 | 粘着テープ |
| WO2020203574A1 (ja) * | 2019-03-29 | 2020-10-08 | 富士フイルム株式会社 | 反射シートおよび反射シート用転写フィルム |
| KR102318161B1 (ko) * | 2021-04-01 | 2021-10-26 | 동우 화인켐 주식회사 | 접착제 조성물 및 전지용 포장재료 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2909994A1 (de) * | 1979-03-14 | 1980-10-02 | Basf Ag | Acylphosphinoxidverbindungen, ihre herstellung und verwendung |
| DE3133419A1 (de) * | 1981-08-24 | 1983-03-10 | Basf Ag, 6700 Ludwigshafen | Acylphosphinoxidverbindungen und ihre verwendung |
| JPH0616524B2 (ja) | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
| US5714029A (en) | 1984-03-12 | 1998-02-03 | Nitto Electric Industrial Co., Ltd. | Process for working a semiconductor wafer |
| JPS60223139A (ja) | 1984-04-18 | 1985-11-07 | Nitto Electric Ind Co Ltd | 半導体ウエハ固定用接着薄板 |
| US5218009A (en) * | 1989-08-04 | 1993-06-08 | Ciba-Geigy Corporation | Mono- and di-acylphosphine oxides |
| JP2601956B2 (ja) | 1991-07-31 | 1997-04-23 | リンテック株式会社 | 再剥離型粘着性ポリマー |
| JPH05179211A (ja) * | 1991-12-30 | 1993-07-20 | Nitto Denko Corp | ダイシング・ダイボンドフイルム |
| JP3491911B2 (ja) * | 1992-07-29 | 2004-02-03 | リンテック株式会社 | 半導体ウエハ加工用粘着シート |
| DE4240964A1 (de) | 1992-12-05 | 1994-06-09 | Basf Ag | Arenbisphosphinoxide |
| US5683798A (en) * | 1993-11-10 | 1997-11-04 | Minnesota Mining And Manufacturing Company | Tackified pressure sensitive adhesives |
| JP2984549B2 (ja) | 1994-07-12 | 1999-11-29 | リンテック株式会社 | エネルギー線硬化型感圧粘着剤組成物およびその利用方法 |
| JPH08124881A (ja) * | 1994-10-28 | 1996-05-17 | Nec Corp | ダイシングテープ及びそれを用いた半導体装置の組立方 法 |
| JP3035179B2 (ja) * | 1995-01-13 | 2000-04-17 | 住友ベークライト株式会社 | 半導体ウエハ加工用粘着シート |
| SG53043A1 (en) * | 1996-08-28 | 1998-09-28 | Ciba Geigy Ag | Molecular complex compounds as photoinitiators |
| JPH10130591A (ja) | 1996-10-31 | 1998-05-19 | Sekisui Chem Co Ltd | 粘着テープの製造方法 |
| JPH10231340A (ja) * | 1996-12-20 | 1998-09-02 | Takeda Chem Ind Ltd | 光硬化性樹脂組成物およびその製造方法 |
| JPH10337823A (ja) * | 1997-04-11 | 1998-12-22 | Lintec Corp | 基材および該基材を用いた粘着テープ |
| IT1309578B1 (it) * | 1998-02-27 | 2002-01-24 | Ciba Sc Holding Ag | Composizione fotoinduribile pigmentata. |
| JP3669196B2 (ja) * | 1998-07-27 | 2005-07-06 | 日東電工株式会社 | 紫外線硬化型粘着シート |
| JP3383227B2 (ja) * | 1998-11-06 | 2003-03-04 | リンテック株式会社 | 半導体ウエハの裏面研削方法 |
| SE9904080D0 (sv) * | 1998-12-03 | 1999-11-11 | Ciba Sc Holding Ag | Fotoinitiatorberedning |
| JP2001240842A (ja) * | 2000-02-28 | 2001-09-04 | Nitto Denko Corp | 紫外線硬化型粘着剤組成物とその粘着シ―ト類 |
-
2000
- 2000-07-07 JP JP2000206642A patent/JP4597323B2/ja not_active Expired - Lifetime
-
2001
- 2001-06-28 US US09/894,545 patent/US6605345B2/en not_active Expired - Lifetime
- 2001-07-06 MY MYPI20013221A patent/MY125997A/en unknown
- 2001-07-06 DE DE60114310T patent/DE60114310T2/de not_active Expired - Fee Related
- 2001-07-06 TW TW090116543A patent/TWI293640B/zh not_active IP Right Cessation
- 2001-07-06 SG SG200104068-2A patent/SG134966A1/en unknown
- 2001-07-06 CN CNB011227133A patent/CN1259384C/zh not_active Expired - Lifetime
- 2001-07-06 KR KR1020010040242A patent/KR100778199B1/ko not_active Expired - Lifetime
- 2001-07-06 EP EP01305880A patent/EP1170345B1/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002020699A5 (https=) | ||
| JP2002338936A5 (ja) | 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法 | |
| JP2005504811A5 (ja) | 置換ペンタセン化合物、半導体デバイス及び物品 | |
| JP2006261623A5 (https=) | ||
| JP2005523924A5 (https=) | ||
| JP2006176493A5 (https=) | ||
| JP2006156562A5 (https=) | ||
| EP1089724A4 (en) | THERAPEUTIC COMPOSITIONS AND METHOD AND ITS USE | |
| JP2007511546A5 (https=) | ||
| BR0005866A (pt) | Composição de resina fotossensìvel | |
| EP1072669A3 (en) | Organic electroluminescent device | |
| JP2008019238A5 (https=) | ||
| WO2002008296A3 (de) | Alkoxysilylgruppenhaltige bindemittel und bindemittelzusammensetzungen, verfahren zu deren herstellung und deren verwendung | |
| DE602004022593D1 (de) | Zusammensetzung eines oligomerischen fluorsilans und oberflächenbehandlung eines retroreflektiven blatts | |
| TW200508315A (en) | Organosilicon compound - curing composition and silicone-base coating composition | |
| JP2008545631A5 (https=) | ||
| JP2003526729A5 (https=) | ||
| WO2003078450A3 (en) | Negatively charged minor groove binders | |
| JP2005536519A5 (https=) | ||
| JP2007096255A5 (https=) | ||
| DE602005027213D1 (de) | Neue imidazolidinderivate | |
| JP2007522444A5 (https=) | ||
| ATE236176T1 (de) | Neue substrate zur detektion von mikrobiellen metaboliten | |
| JP2000226477A5 (https=) | ||
| JP2003064306A5 (https=) |