JP4559361B2 - 投写型表示装置 - Google Patents
投写型表示装置 Download PDFInfo
- Publication number
- JP4559361B2 JP4559361B2 JP2005506582A JP2005506582A JP4559361B2 JP 4559361 B2 JP4559361 B2 JP 4559361B2 JP 2005506582 A JP2005506582 A JP 2005506582A JP 2005506582 A JP2005506582 A JP 2005506582A JP 4559361 B2 JP4559361 B2 JP 4559361B2
- Authority
- JP
- Japan
- Prior art keywords
- heat receiving
- heat
- cooling
- casing
- liquid medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 114
- 239000007788 liquid Substances 0.000 claims description 68
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 15
- 239000011344 liquid material Substances 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241000756122 Aristida purpurascens Species 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Projection Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
前記駆動電気基板の他方の面に配置され、前記駆動電気基板を前記発熱体に対して押圧するための押圧ホルダーと、
前記発熱体と熱的接合される受熱ケーシングと、
前記受熱ケーシングの内部と連通された循環経路と、
前記受熱ケーシングの内部、および前記循環経路に充填された液状媒体と、
前記充填された液状媒体を循環させるポンプと、
前記循環させられる液状媒体を冷却する冷却手段とを備え、
前記駆動電気基板は、駆動電気基板窓を有しており、
前記押圧ホルダーは、前記駆動電気基板窓と重なる位置に押圧ホルダー窓を有しており、
前記受熱ケーシングは、前記駆動電気基板窓と前記押圧ホルダー窓とを貫通して、前記発熱体に当接する受熱部を有する、冷却装置と、 前記発熱体としての反射型映像素子とを備えた投写型表示装置である。
第2の本発明は、前記ポンプは、前記受熱ケーシングの内部に設けられ、 前記循環させられる液状媒体が前記循環経路から前記受熱ケーシングの内部に流入する流入口は、前記受熱ケーシングの内部の内壁の前記受熱部側に設けられている第1の本発明の、投写型表示装置である。
100 冷却装置
102 受熱プレート
103 受熱フレーム
105 電子冷却素子
106 液状材料
107 送液ポンプ
108、1108、2108、3108 受熱ケーシング
2108a 受熱部
110 液状媒体
111 開口部
112 入り口側の循環経路
112a 通路
114 放熱器
201 温度検出手段
202 温度制御手段
401 保持部材
403 駆動電気基板
404 押圧ホルダー
502、602 CPU
Claims (2)
- 一方の面に発熱体を接合した、前記発熱体を駆動するための駆動電気基板と、
前記駆動電気基板の他方の面に配置され、前記駆動電気基板を前記発熱体に対して押圧するための押圧ホルダーと、
前記発熱体と熱的接合される受熱ケーシングと、
前記受熱ケーシングの内部と連通された循環経路と、
前記受熱ケーシングの内部、および前記循環経路に充填された液状媒体と、
前記充填された液状媒体を循環させるポンプと、
前記循環させられる液状媒体を冷却する冷却手段とを備え、
前記駆動電気基板は、駆動電気基板窓を有しており、
前記押圧ホルダーは、前記駆動電気基板窓と重なる位置に押圧ホルダー窓を有しており、
前記受熱ケーシングは、前記駆動電気基板窓と前記押圧ホルダー窓とを貫通して、前記発熱体に当接する受熱部を有する、冷却装置と、
前記発熱体としての反射型映像素子とを備えた投写型表示装置。 - 前記ポンプは、前記受熱ケーシングの内部に設けられ、
前記循環させられる液状媒体が前記循環経路から前記受熱ケーシングの内部に流入する流入口は、前記受熱ケーシングの内部の内壁の前記受熱部側に設けられている請求項1記載の、投写型表示装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003155045 | 2003-05-30 | ||
JP2003155045 | 2003-05-30 | ||
PCT/JP2004/007793 WO2004107837A1 (ja) | 2003-05-30 | 2004-05-28 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2004107837A1 JPWO2004107837A1 (ja) | 2006-07-20 |
JP4559361B2 true JP4559361B2 (ja) | 2010-10-06 |
Family
ID=33487346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005506582A Expired - Lifetime JP4559361B2 (ja) | 2003-05-30 | 2004-05-28 | 投写型表示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7264359B2 (ja) |
JP (1) | JP4559361B2 (ja) |
CN (1) | CN100531534C (ja) |
WO (1) | WO2004107837A1 (ja) |
Families Citing this family (46)
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WO2005045654A2 (en) | 2003-11-07 | 2005-05-19 | Asetek A/S | Cooling system for a computer system |
JP3966288B2 (ja) * | 2004-01-28 | 2007-08-29 | セイコーエプソン株式会社 | 光変調素子保持体、光学装置、およびプロジェクタ |
US20060044524A1 (en) * | 2004-08-31 | 2006-03-02 | Feliss Norbert A | System and method for cooling a beam projector |
US7124811B2 (en) | 2004-12-31 | 2006-10-24 | Intel Corporation | Systems for integrated pump and cold plate |
KR100688978B1 (ko) * | 2005-04-21 | 2007-03-08 | 삼성전자주식회사 | 영상투사장치 |
TWI301722B (en) * | 2005-04-28 | 2008-10-01 | Benq Corp | Water-cooled projector |
US20060245214A1 (en) * | 2005-04-29 | 2006-11-02 | Kim Won-Nyun | Liquid crystal display having heat dissipation device |
EP2239646A3 (en) | 2005-05-06 | 2011-09-28 | Asetek A/S | A method of cooling a computer system |
US20060279706A1 (en) * | 2005-06-14 | 2006-12-14 | Bash Cullen E | Projection system |
KR100628726B1 (ko) * | 2005-07-26 | 2006-09-28 | 삼성전자주식회사 | 영상투사장치 |
US7249625B2 (en) * | 2005-08-03 | 2007-07-31 | Cooler Master Co., Ltd. | Water-cooling heat dissipation device |
JP4196983B2 (ja) * | 2005-10-07 | 2008-12-17 | セイコーエプソン株式会社 | 冷却装置、プロジェクタ及び冷却方法 |
TWI328997B (en) * | 2006-08-21 | 2010-08-11 | Delta Electronics Inc | Cooling module for use with a projection apparatus |
WO2009008166A1 (ja) * | 2007-07-12 | 2009-01-15 | Panasonic Corporation | 画像表示装置 |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
US8746330B2 (en) | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US9453691B2 (en) * | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
JP2009086273A (ja) * | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | 投写型映像表示装置の光源エレメントおよびこの光源エレメントにより構成された光源ユニットを備えた投写型映像表示装置 |
KR20090046301A (ko) * | 2007-11-05 | 2009-05-11 | 삼성전기주식회사 | 단결정 기판 제조방법 및 이를 이용한 태양전지 제조방법 |
US20090161078A1 (en) * | 2007-12-21 | 2009-06-25 | Oculon Optoelectronics, Inc. | Projector, and mobile device and computer device having the same |
JP4561917B2 (ja) * | 2008-03-24 | 2010-10-13 | セイコーエプソン株式会社 | プロジェクタ |
CN101546105B (zh) * | 2008-03-24 | 2010-11-10 | 精工爱普生株式会社 | 投影机 |
US8550633B2 (en) | 2008-03-28 | 2013-10-08 | Nec Display Solutions, Ltd. | Laser projector having a diffuser vibrated by using component of a cooling mechanism |
TWM347014U (en) * | 2008-07-04 | 2008-12-11 | yi-fang Zhuang | Handheld electronic device with micro projection module |
JP2011033747A (ja) * | 2009-07-31 | 2011-02-17 | Seiko Epson Corp | プロジェクター、プログラム、情報記憶媒体および冷却制御方法 |
CN102042573B (zh) * | 2009-10-23 | 2013-01-23 | 陈定平 | 半导体照明光、热分离式温度可控的循环散热系统及路灯 |
CN102056459A (zh) * | 2009-10-30 | 2011-05-11 | 鸿富锦精密工业(深圳)有限公司 | 液冷散热装置 |
JP5880998B2 (ja) * | 2010-09-16 | 2016-03-09 | 株式会社リコー | 冷却装置、画像形成装置 |
TW201223426A (en) | 2010-11-25 | 2012-06-01 | Delta Electronics Inc | Cooling system for cooling a heat source and projector having the same |
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JP2013167774A (ja) * | 2012-02-16 | 2013-08-29 | Mitsubishi Electric Corp | マルチ画面表示装置 |
CN103807810B (zh) * | 2012-11-14 | 2015-07-29 | 深圳市光峰光电技术有限公司 | 波长转换装置及相关发光装置 |
TWI531795B (zh) | 2013-03-15 | 2016-05-01 | 水冷系統公司 | 感測器、多工通信技術及相關系統 |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
KR102392820B1 (ko) * | 2015-05-21 | 2022-05-02 | 주식회사 브라이트론 | 회전팬 블레이드부 자체의 표면냉각효과를 이용한 냉각팬 |
US11249522B2 (en) | 2016-06-30 | 2022-02-15 | Intel Corporation | Heat transfer apparatus for a computer environment |
JP6743625B2 (ja) * | 2016-09-29 | 2020-08-19 | セイコーエプソン株式会社 | 波長変換装置、光源装置、およびプロジェクター |
JP7046656B2 (ja) * | 2017-03-15 | 2022-04-04 | キヤノン株式会社 | 画像投射装置 |
US20230167831A1 (en) * | 2017-03-28 | 2023-06-01 | Faizan Ahmed | Thermo-electric chiller/heater component methods and systems |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
CN111856855B (zh) * | 2019-04-29 | 2022-02-22 | 中强光电股份有限公司 | 光机模块与投影机 |
WO2021229365A1 (en) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
CN115022521B (zh) * | 2022-07-09 | 2024-01-30 | 浙江舜宇智领技术有限公司 | 摄像头模组 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0832263A (ja) * | 1994-07-20 | 1996-02-02 | Fujitsu Ltd | 発熱体パッケージの冷却構造 |
JP2001015662A (ja) * | 1999-06-30 | 2001-01-19 | Nippon Keiki Works Ltd | 冷却装置 |
JP2001183042A (ja) * | 1999-12-24 | 2001-07-06 | Isuzu Ceramics Res Inst Co Ltd | 冷却液の循環による電気部品の冷却装置 |
WO2002019027A1 (fr) * | 2000-08-28 | 2002-03-07 | Matsushita Electric Industrial Co., Ltd. | Dispositif video de projection |
JP2002151638A (ja) * | 2000-11-08 | 2002-05-24 | Hitachi Ltd | 電子機器の冷却装置 |
JP2002174795A (ja) * | 2000-09-20 | 2002-06-21 | Barco Nv | 空間光変調ユニットを有するプロジェクタ装置およびその冷却方法 |
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JP2004183646A (ja) * | 2002-09-13 | 2004-07-02 | Oliver Laing | 対象物の局部的な冷却または加熱のための装置 |
JP2005338715A (ja) * | 2004-05-31 | 2005-12-08 | Nec Viewtechnology Ltd | 映像表示素子冷却構造および投写型光学装置 |
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-
2004
- 2004-05-28 JP JP2005506582A patent/JP4559361B2/ja not_active Expired - Lifetime
- 2004-05-28 US US10/547,012 patent/US7264359B2/en active Active
- 2004-05-28 WO PCT/JP2004/007793 patent/WO2004107837A1/ja active Application Filing
- 2004-05-28 CN CN200480005435.XA patent/CN100531534C/zh not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0832263A (ja) * | 1994-07-20 | 1996-02-02 | Fujitsu Ltd | 発熱体パッケージの冷却構造 |
JP2001015662A (ja) * | 1999-06-30 | 2001-01-19 | Nippon Keiki Works Ltd | 冷却装置 |
JP2001183042A (ja) * | 1999-12-24 | 2001-07-06 | Isuzu Ceramics Res Inst Co Ltd | 冷却液の循環による電気部品の冷却装置 |
WO2002019027A1 (fr) * | 2000-08-28 | 2002-03-07 | Matsushita Electric Industrial Co., Ltd. | Dispositif video de projection |
JP2002174795A (ja) * | 2000-09-20 | 2002-06-21 | Barco Nv | 空間光変調ユニットを有するプロジェクタ装置およびその冷却方法 |
JP2002151638A (ja) * | 2000-11-08 | 2002-05-24 | Hitachi Ltd | 電子機器の冷却装置 |
JP2004183646A (ja) * | 2002-09-13 | 2004-07-02 | Oliver Laing | 対象物の局部的な冷却または加熱のための装置 |
JP2004134423A (ja) * | 2002-10-08 | 2004-04-30 | Hitachi Ltd | 電子機器冷却装置 |
JP2005338715A (ja) * | 2004-05-31 | 2005-12-08 | Nec Viewtechnology Ltd | 映像表示素子冷却構造および投写型光学装置 |
Also Published As
Publication number | Publication date |
---|---|
US7264359B2 (en) | 2007-09-04 |
JPWO2004107837A1 (ja) | 2006-07-20 |
WO2004107837A1 (ja) | 2004-12-09 |
CN101002518A (zh) | 2007-07-18 |
CN100531534C (zh) | 2009-08-19 |
US20060157230A1 (en) | 2006-07-20 |
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