JP2004183646A - 対象物の局部的な冷却または加熱のための装置 - Google Patents
対象物の局部的な冷却または加熱のための装置 Download PDFInfo
- Publication number
- JP2004183646A JP2004183646A JP2003319266A JP2003319266A JP2004183646A JP 2004183646 A JP2004183646 A JP 2004183646A JP 2003319266 A JP2003319266 A JP 2003319266A JP 2003319266 A JP2003319266 A JP 2003319266A JP 2004183646 A JP2004183646 A JP 2004183646A
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- Prior art keywords
- cooling
- circulation pump
- heating device
- thermal contact
- contact element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
- F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【課題】マイクロプロセッサの液体冷却に用いられるコンパクトな装置を提供する。
【解決手段】液体による対象物の局部的な冷却または加熱のための装置は、単純な設計の液体用の循環ポンプ12を備え、対象物14との熱的接触を行うための熱的接触エレメント32と循環ポンプ12に一体化されているために、単純な設計で提供される。それゆえに、この発明による解決法によれば、対象物14と接触するヒートシンクまたはヒータが循環ポンプ12の一部分をなす。この方法によって、接触する対象物14の効果的な冷却または加熱ができるコンパクトな設計の液体冷却装置または液体加熱装置を実現することができる。
【選択図】図1
Description
図面の説明と共に、以下に示す好ましい実施例の説明は、この発明の詳細な説明をすることが目的である。
12 …循環ポンプ
14 …対象物(マイクロプロセサ)
16,70 …基板
18 …ハウジング
20 …給送管
22,24 …開口
26 …排出管
28 …ループ
30 …冷却または加熱区間
32,90 …熱的接触エレメント
34 …接触表面
38 …電気モータ
40 …回転軸
42 …ロータ
44 …渦巻室
46 …インペラ(水かき車)
54 …ステータ
58 …ベアリングキャップ
60 …スライドパートナ
62 …ベアリングサポート
66 …貫流空間(領域)
67 …リブ
68 …流入領域
71 …磁気エレメント(ヨーク)
76 …カバープレート
80 …柔軟板
82 …柔軟領域
86 …ベローズ
88 …接触板
92 …固定装置
94 …保持クリップ
100 …テンションレバー
102 …ブラケット領域
104 …ハウジング部分
Claims (28)
- 液体による対象物の局部的冷却または加熱のための装置であって、
液体用の循環ポンプ、および
循環ポンプに一体化されるかつ対象物に対して熱的接触をなす熱的接触エレメントを備える、冷却/加熱装置。 - 熱的接触エレメントは、循環ポンプのハウジングの一部である、請求項1記載の冷却/加熱装置。
- 熱的接触エレメントは、循環ポンプのハウジングカバーを提供する、請求項1記載の冷却/加熱装置。
- 熱的接触エレメントは、循環ポンプの渦巻室の境界を規定する、請求項1記載の冷却/加熱装置。
- 渦巻室内に配置される水かき車を備える、請求項4記載の冷却/加熱装置。
- 循環ポンプは、水かき車用のカバープレートを有する、請求項5記載の冷却/加熱装置。
- 水かき車によって発生する貫流が熱的接触エレメントを通ってガイドされる、請求項5記載の冷却/加熱装置。
- 水かき車は、熱的接触エレメントを対向して配置される、請求項5記載の冷却/加熱装置。
- 熱的接触エレメントは、金属材料から成る、請求項1記載の冷却/加熱装置。
- 熱的接触エレメントは、板または板状エレメントである、請求項1記載の冷却/加熱装置。
- 循環ポンプは、遠心ポンプである、請求項1記載の冷却/加熱装置。
- 球状のベアリングが循環ポンプのロータのために提供される、請求項11記載の冷却/加熱装置。
- 循環ポンプは、ステータとロータとを有し、その間に球状の空隙が形成される電気モータを含む、請求項11記載の冷却/加熱装置。
- 循環ポンプを通る軸流を有する、請求項11記載の冷却/加熱装置。
- 液体媒体用の給送管が、循環ポンプのロータの回転軸に対して横断的に、循環ポンプのハウジングへ接続される、請求項1記載の冷却/加熱装置。
- 液体媒体用の排出管が、循環ポンプのロータの回転軸に対して横断的に、循環ポンプのハウジングへ接続される、請求項1記載の冷却/加熱装置。
- 循環ポンプからの液体媒体用の排出管と循環ポンプへの液体媒体用の給送管が、循環ポンプのハウジングの同じ側へ接続される、請求項1記載の冷却/加熱装置。
- 熱的接触エレメントは、循環ポンプの圧力側に配置される、請求項1記載の冷却/加熱装置。
- 熱的接触エレメントは、内側にフィンを有する、請求項1記載の冷却/加熱装置。
- フィンは、乱流を助長させるためのものである、請求項19記載の冷却/加熱装置。
- ステータとロータブレードとの間の空隙は、回転翼上に配置される、請求項1記載の冷却/加熱装置。
- 循環ポンプの渦巻室は、可変容積を有する、請求項1記載の冷却/加熱装置。
- 循環ポンプは、正圧をかけることができる柔軟でかつ/または可動式のハウジング部分を有する、請求項1記載の冷却/加熱装置。
- 循環ポンプは、膨張した液体の体積に備えることができる柔軟でかつ/または可動式のハウジング部分を有する、請求項1記載の冷却/加熱装置。
- 柔軟でかつ/または可動式のハウジング部分は、熱的接触エレメントからハウジングの反対側に配置される、請求項23記載の冷却/加熱装置。
- 熱的接触エレメントは、柔軟でかつ/または循環ポンプのハウジングの上に可動式に搭載される、請求項1記載の冷却/加熱装置。
- 循環ポンプを対象物に固定するための固定装置によって圧力をかける、請求項1記載の冷却/加熱装置。
- 循環ポンプは、1つ以上の固定クリップによって対象物に対して固定される、請求項1記載の冷却/加熱装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10243026A DE10243026B3 (de) | 2002-09-13 | 2002-09-13 | Vorrichtung zur lokalen Kühlung oder Erwärmung eines Gegenstandes |
DE10243026.8 | 2002-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004183646A true JP2004183646A (ja) | 2004-07-02 |
JP4808370B2 JP4808370B2 (ja) | 2011-11-02 |
Family
ID=31724819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003319266A Expired - Fee Related JP4808370B2 (ja) | 2002-09-13 | 2003-09-11 | 対象物の局部的な冷却または加熱のための装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20040052663A1 (ja) |
EP (1) | EP1398511B1 (ja) |
JP (1) | JP4808370B2 (ja) |
DE (1) | DE10243026B3 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006063962A (ja) * | 2004-08-30 | 2006-03-09 | Toshiba Corp | 冷却流体用ポンプ、冷却装置及び電気機器 |
JPWO2004107837A1 (ja) * | 2003-05-30 | 2006-07-20 | 松下電器産業株式会社 | 冷却装置 |
JP2009060122A (ja) * | 2008-10-16 | 2009-03-19 | Panasonic Corp | 冷却装置 |
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- 2003-08-30 EP EP03019804.8A patent/EP1398511B1/de not_active Expired - Lifetime
- 2003-09-11 JP JP2003319266A patent/JP4808370B2/ja not_active Expired - Fee Related
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2007
- 2007-01-16 US US11/653,463 patent/US7648347B2/en not_active Expired - Fee Related
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US6019165A (en) * | 1998-05-18 | 2000-02-01 | Batchelder; John Samuel | Heat exchange apparatus |
JP2001320187A (ja) * | 2000-02-29 | 2001-11-16 | Matsushita Electric Ind Co Ltd | 電子部品の液体冷却装置 |
US6408937B1 (en) * | 2000-11-15 | 2002-06-25 | Sanjay K. Roy | Active cold plate/heat sink |
Cited By (5)
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JPWO2004107837A1 (ja) * | 2003-05-30 | 2006-07-20 | 松下電器産業株式会社 | 冷却装置 |
JP4559361B2 (ja) * | 2003-05-30 | 2010-10-06 | パナソニック株式会社 | 投写型表示装置 |
JP2006063962A (ja) * | 2004-08-30 | 2006-03-09 | Toshiba Corp | 冷却流体用ポンプ、冷却装置及び電気機器 |
JP4653444B2 (ja) * | 2004-08-30 | 2011-03-16 | 株式会社東芝 | 冷却用流体ポンプ、冷却装置及び電気機器 |
JP2009060122A (ja) * | 2008-10-16 | 2009-03-19 | Panasonic Corp | 冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1398511B1 (de) | 2013-12-04 |
JP4808370B2 (ja) | 2011-11-02 |
DE10243026B3 (de) | 2004-06-03 |
US20070115634A1 (en) | 2007-05-24 |
EP1398511A1 (de) | 2004-03-17 |
US7648347B2 (en) | 2010-01-19 |
US20040052663A1 (en) | 2004-03-18 |
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