WO2004107837A1 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- WO2004107837A1 WO2004107837A1 PCT/JP2004/007793 JP2004007793W WO2004107837A1 WO 2004107837 A1 WO2004107837 A1 WO 2004107837A1 JP 2004007793 W JP2004007793 W JP 2004007793W WO 2004107837 A1 WO2004107837 A1 WO 2004107837A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat receiving
- cooling device
- heat
- cooling
- heating element
- Prior art date
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- the present invention is provided inside a housing, which can be used for electronic devices such as a projection display device, a personal computer, and a semiconductor laser device, which enlarge and project an image on a screen by a projection lens.
- the present invention relates to a cooling device for cooling or controlling the temperature of heat-generating electronic components such as semiconductors and CPUs by circulating a liquid medium.
- Portable electronic devices such as notebook personal computers and mobile communication devices are equipped with a microprocessor for processing multimedia information.
- a display S typified by a projection display device that illuminates an image modulated into a video signal on light pulp with illumination light and enlarges and projects the image on a screen by a projection lens
- a video element composed of a high-resolution light valve is used, and furthermore, the projection screen has been promoted to be brighter and brighter.
- the image element of a projection display device that requires high luminance absorbs the amount of heat generated by light, such as components that are not effectively projected on the screen, in principle with respect to the amount of incident light.
- the brightness there is a limitation on increasing the brightness.
- a reflection type video element using liquid crystal or the like has been used instead of a transmission type liquid crystal display element.
- the optical system of a projection display device basically includes a light source lamp unit and white (red) light from the light source of the light source lamp unit.
- An image element composed of a reflective liquid crystal panel that separates the light into green (G) and blue (B) according to image information, and an optical unit that combines the modulated light into colors
- a projection lens unit K that magnifies and projects the combined light on the screen.
- FIG. 10 is a diagram showing a schematic configuration of a conventional projection display device.
- Conventional projection display devices use a light source lamp unit 1 as a light source for optically enlarging and projecting image information, and remove infrared light and ultraviolet light from the light from the light source lamp unit 1 so that only visible light is emitted.
- a light source lamp unit 1 for optically enlarging and projecting image information, and remove infrared light and ultraviolet light from the light from the light source lamp unit 1 so that only visible light is emitted.
- an irradiation optical unit 3 for condensing visible light from the finollet 2
- light condensed by the irradiation optical unit 3 passes through a reflection prism unit 6. After that, this is color-separated and led to the reflection type image elements 4a, 4b, 4c, and the light generated optically as image information by the reflection type image elements 4a, 4b, 4c.
- a color separation / combination prism unit 5 for color-combining the image data
- a projection lens unit for enlarging and projecting the image
- the light source lamp unit 1 is composed of an ultra-high pressure mercury lamp 1a, which is generally considered to have high luminous efficiency, and a concave mirror 1b for efficiently condensing light.
- the color separation / combination prism unit 5 which separates and separates the light from the light source lamp unit 1 into R, G, and B, includes, for example, a blue reflection dichroic mirror that selects white light according to wavelength, and a red It consists of a reflective dichroic mirror and a green transparent dichroic mirror.
- the white light is separated into R, G, and B from each film characteristic, and is led to the reflection type image elements 4 a, 4 b, and 4 c of each of R, G, and B, and the reflection type is obtained.
- the light modulated into image information by the video elements 4 a, 4 b, and 4 c is combined again by the color separation / combination prism unit 5.
- the reflection prism unit 6 transmits the light from the irradiation optical unit 3 and guides the light synthesized by the color separation / combination prism unit 5 to the projection lens unit 7, a so-called half mirror configuration. Is an integrated prism.
- FIG. 11 is a schematic cross-sectional view showing a conventional cooling device for a reflective video element.
- FIG. 11 shows only the reflective video element 4c, the reflective video elements 4a and 4b have the same configuration.
- One side of the reflective image element 4c is fixedly bonded to a position adjusting mechanism 8 capable of adjusting a planar position and a focus with an adhesive or the like, and the position adjusting mechanism 8 includes a color separation / combination prism unit. Two It is accurately positioned and fixed to the socket 5 by contact or adhesive.
- the other surface of the reflection type image element 4c is joined to an electronic cooling element 9 made of a semiconductor via a holder 110 which also serves as heat conduction.
- a heat sink 11 for heat dissipation is joined to the electronic cooling element 9, and a cooling fan 12 for cooling the heat sink 11 is joined to the heat sink 11.
- the cooling fan 12, the heat sink 11 and the holder 110 are integrally assembled with screws (not shown).
- an electronic cooling element 9, a heat sink 11 and a cooling fan 12 having larger capabilities are required, which not only increases the size of the device but also increases the weight.
- this cooling device needs to dissipate the total heat generated by the power consumption corresponding to the amount of heat absorbed by the electronic cooling element 9 and the heat generated by the reflective video element. Becomes larger than expected.
- the ventilation resistance may be excessive and the blowing noise may be increased.
- the heat transfer In the holder 10 functioning as a conductive member the temperature at the junction of the electronic cooling element 9 is higher than the ambient temperature and lower than the ambient temperature, so that dew condensation may occur.
- thermoelectric cooler 9 requires power twice to six times the calorific value of the reflective video element 4c, and the power consumption becomes extremely large. Disclosure of the invention
- the present invention has been made in consideration of such conventional problems as described above, and is, for example, a cooling device that can more efficiently cool an image element of a projection display device, a CPu of a personal computer, a semiconductor laser of a semiconductor laser device, and the like.
- the purpose is to provide You.
- a first aspect of the present invention is a heat receiving casing which is directly or indirectly thermally connected to a heating element
- a circulation path communicated with the interior of the heat receiving casing; a liquid medium filled in the interior of the heat reception casing; and the circulation path;
- a cooling device for cooling the circulated liquid medium for cooling the circulated liquid medium.
- the inflow port through which the liquid medium to be circulated flows into the heat receiving casing from the circulation path is provided in the heat receiving casing, wherein the heat receiving casing is directly connected to the heating element or
- the cooling device according to the first aspect of the present invention which is provided on a side that is indirectly thermally joined.
- the pump is a centrifugal pump having a rotating blade
- the cooling device according to the second aspect of the present invention, wherein the inflow port is provided near a rotation center of the rotating blade.
- the heat receiving casing has an inner wall provided with an uneven portion on a side directly or indirectly thermally joined to the heating element.
- the cooling device is not limited to a fourth aspect of the present invention.
- a driving electric board for driving the heating element is disposed on a side of the heating element to which the heat-receiving casing is directly or indirectly thermally bonded.
- a cooling device according to any one of the first to fourth aspects of the present invention.
- the pressing holder for pressing the driving electric board against the heating element is thermally bonded directly or indirectly to the heat receiving casing of the driving electric board. It is a cooling device of the fifth invention arranged on the side.
- the driving electric board has a driving electric board window
- the pressing holder has a pressing holder window at a position overlapping the driving electric board window,
- thermoelectric casing has a heat receiving portion that penetrates through the drive electric board window and the pressing holder window and is in contact with the heating element.
- An eighth aspect of the present invention is the cooling device according to any one of the first to fourth aspects of the present invention, further comprising a heat receiving plate joined to the heating element.
- a ninth aspect of the present invention provides an electronic cooling element joined to the heat-receiving casing,
- a heat receiving frame that forms a sealed space between the heat receiving plate and the electronic cooling element
- the cooling device according to an eighth aspect of the present invention, further comprising a liquid material filled in the closed space.
- a tenth aspect of the present invention provides a detecting means for detecting a temperature of the heating element
- the cooling device according to any one of the first to fourth aspects of the present invention, further comprising: a control unit that controls at least one of the pump and the cooling unit based on a result of the detection. It is.
- the eleventh invention is a cooling device according to the first invention,
- a projection display device comprising: a reflection-type image element as the heating element.
- a twelfth aspect of the present invention is an electronic apparatus including the cooling device of the first aspect of the present invention, and at least one of a semiconductor and a CPU as the heating element.
- a thirteenth aspect of the present invention provides a heat-receiving casing which is directly or indirectly thermally connected to at least one of a reflective video element, a semiconductor, and a CPU.
- a circulation path communicating with the interior of the heat receiving casing, a liquid medium filled in the interior of the heat reception casing, and the circulation path;
- a heat-receiving casing directly or indirectly thermally bonded to a heating element, wherein the inside of the heat-receiving casing is filled with a circulation path communicating with the inside of the heat-receiving casing.
- a cooling step of cooling the circulated liquid medium A cooling step of cooling the circulated liquid medium.
- FIG. 1 is a schematic configuration diagram of a projection display device using the cooling device according to the first embodiment of the present invention.
- FIG. 2 is a schematic sectional view of the cooling device according to the first embodiment of the present invention.
- FIG. 3 is a schematic sectional view of a cooling device according to Embodiment 2 of the present invention.
- FIG. 4 is a schematic sectional view of a cooling device according to Embodiment 3 of the present invention.
- FIG. 5 is a schematic sectional view of a cooling device according to Embodiment 4 of the present invention.
- FIG. 6 is a schematic sectional view of a cooling device according to Embodiment 5 of the present invention.
- FIG. 7 is a schematic plan view of the liquid sending pump 107 according to Embodiment 1 of the present invention.
- FIG. 8 is a schematic configuration diagram of a personal computer using the cooling device 100 according to the embodiment of the present invention.
- FIG. 9 is a schematic configuration diagram of a personal computer using the cooling device 200 according to the embodiment of the present invention.
- FIG. 10 is a schematic configuration diagram of a conventional projection display device.
- FIG. 11 is a schematic sectional view of a conventional cooling device.
- FIG. 1 is a schematic configuration diagram of a projection display device using the cooling device of the first embodiment of the present invention
- FIG. 2 is a schematic sectional view of the cooling device of the first embodiment of the present invention.
- . 1 and 2 the same components as those of the conventional device described with reference to FIGS. 10 and 11 are denoted by the same reference numerals, and the components have the same functions. Omitted.
- FIG. 2 shows a cooling device for the reflective video element 4c which is a heating element, and the cooling devices corresponding to the reflective video elements 4a and 4b have the same function.
- 4a, 4b, and 4c are reflection types corresponding to red (R), green (G), and blue (B) light separated by the color separation / combination prism unit 5 as in the conventional example.
- An image element An image element.
- a metal material having a high thermal conductivity such as a copper alloy or pure aluminum, is formed on the back surface opposite to the light-receiving surface of the reflection-type image element 4c.
- the heat receiving plate 102 thus formed is closely bonded, and both are thermally surface-bonded.
- a window is provided on the light receiving surface side of the reflective image element 4c so as not to hinder light reception.
- a driving electric board 503 for supplying drive power and a drive signal to the reflective image element 4c is provided. Are surface bonded.
- Reference numeral 103 denotes a rectangular frame-shaped heat receiving frame formed by synthetic resin molding or the like, which is made of a material having a lower thermal conductivity than the heat receiving plate 102.
- the heat receiving plate 102 and the heat receiving frame 103 are integrally assembled with the outer peripheral edge of the heat receiving plate 102 being hermetically (watertightly) joined.
- This hermetic bonding can be performed using, for example, a rubber O-ring (not shown).
- a container shape having an internal volume is formed in the rear direction of the reflective video element 4c.
- a frame-shaped positioning portion 104 is formed on the outer peripheral edge on the side of the reflective video element 4c, and the outer peripheral portion of the reflective video element 4c is roughly positioned by the positioning portion 104.
- Reference numeral 105 denotes an electronic cooling element generally called a Peltier element.
- the outer peripheral edge of the thermoelectric cooling element is opposite to the heat receiving plate 102, and is fixed to the heat receiving frame 103 in a hermetically (watertight) manner. Have been.
- This hermetic bonding and fixing can also be performed using, for example, a rubber O-ring (not shown).
- Reference numeral 106 denotes a liquid material filled in a space enclosed by the heat receiving plate 102, the heat receiving frame 103, and the thermoelectric cooler 105, for example, from an aqueous alcohol solution such as proprenda alcohol. Become.
- the liquid material 106 and the heat receiving plate 102 are in direct planar contact, and the liquid material 106 and the electronic cooling element 105 are in direct planar contact and are thermally joined.
- Reference numeral 107 denotes a liquid sending pump (liquid sending means) including a flat centrifugal pump
- reference numeral 108 denotes a heat receiving casing that also serves as a casing of the liquid sending pump 107.
- the heat-receiving casing 108 is formed of a metal material having high thermal conductivity, for example, an aluminum alloy, and one flat surface thereof is thermally bonded to the electronic cooling element 105 in a plane. Is adhered to.
- the heat receiving frame 103 is positioned and fixed integrally by a positioning portion 109 formed on the outer peripheral edge of the heat receiving frame 103.
- Reference numeral 110 denotes a liquid medium which is circulated by the liquid sending pump 107 and transfers heat, and is made of, for example, an aqueous alcohol solution such as propren glycol.
- a motor 107a is provided on the other flat part of the liquid sending pump 107, and a plate 107c is fixed to the motor shaft 107b.
- Reference numeral 112 denotes a circulation path on the inlet side of the liquid medium 110 to the liquid sending pump 107
- reference numeral 113 denotes a liquid medium 110 sent from the liquid sending pump 107. It is a circulation path on the exit side.
- the circulation path 112 on the inlet side of the liquid feed pump 107 is located on one flat side of the heat receiving casing 108, which also serves as the casing of the liquid feed pump 107, that is, the electronic cooling element 105. It is located on the side.
- a pipe-like passage 112a passing through the heat receiving casing 108 is formed, and the open end of the passage 112a is formed by the motor 107a. It is pointed at the center of rotation of the rotated plate 107c.
- the outlet-side circulation path 113 through which the liquid medium 110 is sent from the liquid transfer pump 107 is more heat-receiving than the inlet-side circulation path 112 with the motor 107 a disposed. It is arranged on the other flat side of one thing 108 and at a position facing the rotation outer peripheral part of blade 107c.
- Reference numeral 114 denotes a radiator, and a radiator fan 115 is provided near the radiator 114.
- the inlet side circulation path 1 1 2 and the radiator 1 1 4 and the outlet side circulation path 1 1 3 and the radiator 1 1 4 of the liquid sending pump 107 are flexible hoses 1 1 6 and 1 6 respectively. 1 1 7 are connected.
- the liquid medium 110 is filled inside the liquid supply pump 107, the hoses 116, 117, and the radiator 114, and the liquid supply pump 107 driven by the motor 107a.
- By rotating the blade 107 c of the heat receiving casing 108 it is sucked from the inlet side circulation path 112 of the heat receiving casing 108, guided in the circumferential direction, and circulated through the outlet side circulation path 113. Let me do.
- the operation of the cooling device of the present embodiment will be described as a cooling operation of a projection display device using the cooling device of the present embodiment. .
- the reflective image element 4c which is a heating element, receives light in the direction of the arrow (see FIG. 2) and generates heat due to the presence of a part that is not effectively reflected.
- a heat-receiving plate 102 is adhered to the side opposite to the light-receiving surface of the reflective video element 4c, that is, on the rear side, and the heat-receiving plate 102 is attached to the reflective video element 4c. The heat is received from the back. ⁇
- the heat receiving plate 102 is in contact with the liquid material 106, so that the amount of heat from the heat receiving plate 102 is transmitted to the liquid material 106.
- the electric cooling element 105 to which electric power is applied is a liquid material.
- the heat of the liquid material 106 is directly absorbed to cool the heat receiving plate 102.
- the heat receiving plate 102 cools the reflective image element 4c.
- the electronic cooling element 105 has a surface on the side opposite to the heat absorbing side (the right side in FIG. 2) as a heat radiating surface. From this heat radiating surface, the amount of heat from the reflective video element 4 c and the electronic cooling element 1 0 5 The total amount of heat with the amount of heat generated by its own drive power is dissipated.
- the heat-receiving casing 108 which also serves as the casing of the liquid-feed pump 107, is closely attached to the heat-dissipating surface side of the electronic cooling element 105, so the heat of the electronic cooling element 105 It is transmitted to casing 108.
- thermoelectric cooler 105 The heat conduction between the heat-receiving plate 102 and the thermoelectric cooler 105 is conducted through a liquid material 106 such as an aqueous alcohol solution such as propren glycol, eliminating the disadvantage of low thermal conductivity at the boundary.
- a liquid material 106 such as an aqueous alcohol solution such as propren glycol
- the junction between solids has a large thermal resistance and very poor thermal conductivity.
- a sufficient cooling effect cannot be obtained.
- the liquid medium 106 is in direct contact with the heat receiving plate 102 and the thermoelectric cooler 105. Since heat is conducted by touching, there is no increase in thermal resistance as seen at the joint between solids.
- thermoelectric cooling element 105 heat conduction from the heat receiving plate 102 to the thermoelectric cooling element 105 becomes extremely good, and the cooling efficiency is improved.
- the liquid medium 110 is used in the heat receiving casing 108.
- a circulation path 1 1 2 force S on the entrance side of the gas turbine is provided on one flat surface side that is thermally joined to the electronic cooling element 105. .
- the liquid medium 110 cooled by the radiator 114 flows into the liquid sending pump 107 from the electronic cooling element 105 side through the passage 112a.
- the circulated liquid medium 110 is radiated to the outside by the radiator 114 cooled by the radiating fan 115, the temperature is reduced, and the circulated liquid medium 110 is returned to the heat receiving casing 108.
- the amount of heat of the reflective video element 4c which is a heating element, is remarkably efficiently radiated.
- the cooling device is similarly configured on the reflection-type image elements 4a and 4b, so that high-efficiency cooling of the image elements of the entire projection display device can be realized.
- the heat receiving case 108 corresponds to the heat receiving case of the present invention
- the means including the hose 116 and the hose 117 corresponds to the circulation path of the present invention
- the liquid medium 110 is
- the liquid supply pump 107 corresponds to the liquid medium of the present invention
- the liquid sending pump 107 corresponds to the pump of the present invention
- the means including the heat radiator 114 and the heat radiating fan 115 corresponds to the cooling means of the present invention.
- the heat receiving plate 102 corresponds to the heat receiving plate of the present invention.
- the electronic cooling element 105 corresponds to the electronic cooling element of the present invention
- the heat receiving frame 103 corresponds to the heat receiving frame of the present invention
- the liquid material 106 corresponds to the liquid material of the present invention.
- reflection type image elements 4a, 4b, 4c correspond to the reflection type image element of the present invention.
- FIG. 3 is a schematic sectional view of a cooling device according to Embodiment 2 of the present invention.
- cooling device of the present embodiment is similar to the cooling device of the first embodiment described above, the differences will be mainly described.
- a plurality of openings 1 1 1 1 1 1 1 are formed in the joint case surface (one flat surface) of heat receiving casing 1 1 108 that is thermally joined to electronic cooling element 105. Is provided.
- the liquid medium 110 circulated through the inside of the heat receiving casing 110 through the opening 111 comes into direct contact with the electronic cooling element 105.
- Each of the plurality of openings 111 has, for example, a circular shape, and is arranged in a matrix except for a portion where the passage 112a is located.
- the area of the contact surface between the electronic cooling element 105 and the heat receiving casing 110 should be at least 1 to 3 or more. It is formed to have a total area.
- the liquid medium 110 comes into direct contact with the electronic cooling element 105.
- the temperature boundary layer due to heat conduction is disturbed by such turbulence of the circulating flow, and the heat transfer coefficient from the electronic cooling element 105 to the liquid medium 110, that is, the way of transmitting heat, is significantly improved. Cooling efficiency is greatly improved. ⁇
- heat receiving casing 110 corresponds to the heat receiving casing of the present invention.
- FIG. 4 is a schematic sectional view of a cooling device according to Embodiment 3 of the present invention.
- cooling device of the present embodiment is similar to the cooling device of the second embodiment described above, the differences will be mainly described.
- a temperature detecting means 201 for detecting the temperature of the reflection type image element 4c, which is a heating element, and converting the temperature into an electric signal, is integrally incorporated in the heat receiving plate 102. I have.
- the temperature information of the reflective video element 4c detected by the temperature detecting means 201 is input to the temperature control means 202, and the driving force and heat radiation of the liquid sending pump 107 are inputted.
- the driving force of the fan 115 is controlled according to the control target value, and the input power to the thermoelectric cooler 105 is adjusted.
- the temperature detecting means 201 corresponds to the detecting means of the present invention
- the temperature controlling means 202 corresponds to the controlling means of the present invention.
- FIG. 5 is a schematic sectional view of a cooling device according to Embodiment 4 of the present invention.
- the cooling device according to the present embodiment is the same as the cooling device according to the second embodiment described above. The differences are mainly described because they are similar to the device.
- a heat receiving casing 3 10 8 having a plurality of openings 11 1 is directly adhered to a heat receiving plate 10 2 joined to the reflective video element 4 c, Are joined together.
- the opening 1 1 1 1 of the heat receiving casing 3 1 0 8 is made watertight by the heat receiving plate 1.
- the heat receiving plate 102 and the heat receiving case 310 are positioned relative to each other by a positioning part 310 b formed in the heat receiving case 310.
- the cooling efficiency of the reflective video element 4c is greatly improved.
- the heat receiving casing 310 corresponds to the heat receiving casing of the present invention.
- FIG. 6 is a schematic sectional view of a cooling device according to Embodiment 5 of the present invention.
- the cooling device according to the present embodiment is similar to the cooling device according to the fourth embodiment described above, and therefore, these differences are mainly described. explain.
- Reference numeral 401 denotes a frame-shaped holding member that has a locking portion 401a and holds the reflective video element 4c by the locking portion 401a.
- a driving electric board 403 is surface-bonded to supply driving power and a driving signal to the reflective video element 4c.
- Reference numeral 404 denotes a pressing holder made of a highly rigid aluminum alloy or the like, which is surface-bonded to the surface of the driving electric substrate 403 opposite to the surface to which the reflective image element 4c is bonded.
- the reflective image element 4 c, the driving electric board 400, and the pressing holder 404 are fixed and integrated by a fixing screw 405 screwed to the end of the holding member 401. Being done.
- the terminals of the reflective video element 4c and the terminals of the driving electric board 4003 are electrically connected.
- a heat receiving portion 210a is formed in the shape of a protrusion.
- the heat receiving portion 210a is fitted and positioned in a rectangular hole (not shown) provided in the center of the pressing holder 404 and the driving electric substrate 403, respectively.
- the flat end of the heat receiving portion 210 a of the heat receiving casing 210 is in close contact with the back surface of the reflective video element 4 c and is thermally connected.
- the reflective video element 4c receives light from the direction of the arrow and Heat is generated by the energy component of the light that is not used.
- the heat generated by the reflection-type image element 4c is directly conducted to the heat-receiving portion 210a of the heat-receiving casing 210 that is in close contact with the rear surface.
- a liquid medium 110 is filled inside the heat receiving casing 210, and the heat of the heat receiving casing 210, which has been conducted, is transferred to the liquid medium 110 inside the heat receiving casing 210. Is done.
- the liquid medium 110 is circulated between the radiator 114 and the liquid medium 110 by the liquid sending pump 107 to perform desired cooling, as in the above-described embodiment.
- windows are provided in the central portions of the pressing holder 404 and the driving electric board 403, and the heat receiving portions 210 a of the heat receiving casing 210 are fitted from these windows. Then, the rear surface of the reflective image element 4c was brought into direct contact with the heat-receiving casing 210.
- the positioning of the heat receiving casing 210 with respect to the reflection type image element 4c can be easily performed with reference to the above-mentioned window.
- the heat receiving casing 210 corresponds to the heat receiving casing of the present invention.
- the heat receiving casing 108 provided with the opening 111 is not necessarily required to also serve as the casing of the liquid sending pump 107, and the casing of the liquid sending pump 107 is provided with a hose 1 It may be provided in the middle of hose 16 or hose 117.
- the liquid medium may be water or an aqueous solution of alcohol.
- the medium circulation path is a so-called hose, it is better than a flexible rubber hose such as butyl rubber.
- the pump (liquid sending means) is a centrifugal pump that sucks from the center and discharges it in the circumferential direction.
- FIG. 7 is a schematic plan view of the liquid sending pump 107 of Embodiment 1 of the present invention
- the paper is directed vertically downward (arrow).
- the liquid medium 110 that has entered the blade direction) is pressured in the centrifugal direction due to rotation of the plate 107c, and is sent out from the outlet side circulation path 113.
- the heat receiving plate 102 As a separate body is not always necessary.
- a plurality of openings are provided in the wall on the side where the heat of the heat receiving casing is introduced.
- the present invention is not limited to this, and one large opening may be provided.
- the shape of the opening is not limited to a circle, but may be another shape such as a square.
- the arrangement may be arbitrary.
- An uneven portion for generating turbulence may be provided on the inner wall where the heat of the heat-receiving casing is introduced.
- the reflection type image element 4c which is a heating element
- the heat receiving plate 102 are directly in contact with each other.
- the present invention is not limited to this, and in order to further improve heat conduction, an auxiliary heat conduction member coated with heat conductive grease or the like may be interposed at the joint.
- an auxiliary heat conductive member such as heat conductive grease may be interposed between the reflective image element 4 c and the heat receiving portion 210 a of the heat receiving casing 210. .
- the temperature control means 202 causes the liquid-sending drive conditions by the liquid-sending pump 107 and the heat-dissipating fan 111 for the radiator 114.
- the air-cooling drive condition of No. 5 and the drive condition according to the amount of heat absorbed by the electronic cooling element 105 are controlled.
- the present invention is not limited to this.
- the cooling device of the above-described embodiment is provided for each reflective video element in a three-plate projection display device, so that the heating element of the projection display device can be efficiently cooled. It is something that can be done.
- the cooling device according to the above-described embodiment can be mounted as a cooling device not only for the projection type image display device but also for an electronic device requiring heat control such as a CPU of a personal computer and a semiconductor laser. Things.
- FIG. 8 is a schematic configuration diagram of a personal computer using the cooling device 100 of the embodiment of the present invention, It can cool the CPU of electronic equipment.
- Cooling device 100 has the same configuration as the cooling device of the second embodiment of the present invention described above.
- a cooling device 100 is provided on the surface of the CPU 502, which is a heating element attached to the drive electric board 501 in the housing 500, and a heat receiving plate 102 is provided. It is thermally bonded to the heat dissipation surface of the CPU 502.
- the radiator 114 and the like are the same as those in the second embodiment. According to this, the heat generation and cooling of the CPU 502 can be efficiently performed instead of the reflection type image element.
- CPU 502 corresponds to CPU of the present invention.
- FIG. 9 is a schematic configuration of a personal computer using the cooling device 200 of the embodiment of the present invention
- the CPU of an electronic device such as a personal computer is used. Can be cooled.
- Cooling device 200 has the same configuration as the cooling device of the third embodiment of the present invention described above.
- a cooling device 200 capable of controlling the temperature is provided on the surface of a heating element CPU 602 attached to a driving electric board 600 in the housing 600.
- the heat receiving plate 102 incorporating the temperature detecting means 201 is thermally bonded to the heat dissipation surface of the CPU 602.
- the temperature control means 202 and the radiator 114 are the same as in the third embodiment.
- the temperature control means 202 based on the temperature information of the CPU 602 detected by the temperature detection means 201, sends the liquid supply pump 107, the electronic cooling element 105, the heat radiation It can control a fan (not shown) and perform optimal cooling in accordance with the control target value.
- CPU 602 corresponds to CPU of the present invention.
- the heating element that needs to be cooled is not limited to a personal computer CPU, but may be a laser diode or other heating element having a high output heating value such as a semiconductor laser in other electronic devices. .
- the radiator 1 1 4 does not need to be installed in the center of the housing, but is installed near the outside of the housing in order to perform better cooling using the heat released by the external air. May be. Industrial applicability
- the cooling device of the present invention is useful because it can more efficiently cool, for example, a video device of a projection display device, a CPU of a personal computer, a semiconductor laser of a semiconductor laser device, and the like.
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Projection Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005506582A JP4559361B2 (ja) | 2003-05-30 | 2004-05-28 | 投写型表示装置 |
US10/547,012 US7264359B2 (en) | 2003-05-30 | 2004-05-28 | Cooling apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-155045 | 2003-05-30 | ||
JP2003155045 | 2003-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004107837A1 true WO2004107837A1 (ja) | 2004-12-09 |
Family
ID=33487346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/007793 WO2004107837A1 (ja) | 2003-05-30 | 2004-05-28 | 冷却装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7264359B2 (ja) |
JP (1) | JP4559361B2 (ja) |
CN (1) | CN100531534C (ja) |
WO (1) | WO2004107837A1 (ja) |
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WO2006072102A2 (en) * | 2004-12-31 | 2006-07-06 | Intel Corporation | Systems for integrated pump and cold plate |
JP2007103821A (ja) * | 2005-10-07 | 2007-04-19 | Seiko Epson Corp | 冷却装置、プロジェクタ及び冷却方法 |
JP2009086273A (ja) * | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | 投写型映像表示装置の光源エレメントおよびこの光源エレメントにより構成された光源ユニットを備えた投写型映像表示装置 |
JP2010170148A (ja) * | 2008-03-24 | 2010-08-05 | Seiko Epson Corp | プロジェクタ |
JP2012083701A (ja) * | 2010-09-16 | 2012-04-26 | Ricoh Co Ltd | 冷却装置、画像形成装置 |
US8794767B2 (en) | 2008-03-24 | 2014-08-05 | Seiko Epson Corporation | Liquid-cooling device and projector |
JP2018156075A (ja) * | 2017-03-15 | 2018-10-04 | キヤノン株式会社 | 画像投射装置 |
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EP1923771B1 (en) | 2003-11-07 | 2015-05-20 | Asetek A/S | Cooling system for a computer system |
JP3966288B2 (ja) * | 2004-01-28 | 2007-08-29 | セイコーエプソン株式会社 | 光変調素子保持体、光学装置、およびプロジェクタ |
US20060044524A1 (en) * | 2004-08-31 | 2006-03-02 | Feliss Norbert A | System and method for cooling a beam projector |
KR100688978B1 (ko) * | 2005-04-21 | 2007-03-08 | 삼성전자주식회사 | 영상투사장치 |
TWI301722B (en) * | 2005-04-28 | 2008-10-01 | Benq Corp | Water-cooled projector |
US20060245214A1 (en) * | 2005-04-29 | 2006-11-02 | Kim Won-Nyun | Liquid crystal display having heat dissipation device |
US20090218072A1 (en) | 2005-05-06 | 2009-09-03 | Andre Sloth Eriksen | Cooling system for a computer system |
US20060279706A1 (en) * | 2005-06-14 | 2006-12-14 | Bash Cullen E | Projection system |
KR100628726B1 (ko) * | 2005-07-26 | 2006-09-28 | 삼성전자주식회사 | 영상투사장치 |
US7249625B2 (en) * | 2005-08-03 | 2007-07-31 | Cooler Master Co., Ltd. | Water-cooling heat dissipation device |
TWI328997B (en) * | 2006-08-21 | 2010-08-11 | Delta Electronics Inc | Cooling module for use with a projection apparatus |
WO2009008166A1 (ja) * | 2007-07-12 | 2009-01-15 | Panasonic Corporation | 画像表示装置 |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
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US8746330B2 (en) | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
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US20090161078A1 (en) * | 2007-12-21 | 2009-06-25 | Oculon Optoelectronics, Inc. | Projector, and mobile device and computer device having the same |
WO2009118902A1 (ja) | 2008-03-28 | 2009-10-01 | Necディスプレイソリューションズ株式会社 | 投写型画像表示装置 |
TWM347014U (en) * | 2008-07-04 | 2008-12-11 | yi-fang Zhuang | Handheld electronic device with micro projection module |
JP2011033747A (ja) * | 2009-07-31 | 2011-02-17 | Seiko Epson Corp | プロジェクター、プログラム、情報記憶媒体および冷却制御方法 |
CN102042573B (zh) * | 2009-10-23 | 2013-01-23 | 陈定平 | 半导体照明光、热分离式温度可控的循环散热系统及路灯 |
CN102056459A (zh) * | 2009-10-30 | 2011-05-11 | 鸿富锦精密工业(深圳)有限公司 | 液冷散热装置 |
TW201223426A (en) | 2010-11-25 | 2012-06-01 | Delta Electronics Inc | Cooling system for cooling a heat source and projector having the same |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
JP2013167774A (ja) * | 2012-02-16 | 2013-08-29 | Mitsubishi Electric Corp | マルチ画面表示装置 |
CN103807810B (zh) | 2012-11-14 | 2015-07-29 | 深圳市光峰光电技术有限公司 | 波长转换装置及相关发光装置 |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
KR102392820B1 (ko) * | 2015-05-21 | 2022-05-02 | 주식회사 브라이트론 | 회전팬 블레이드부 자체의 표면냉각효과를 이용한 냉각팬 |
US11249522B2 (en) * | 2016-06-30 | 2022-02-15 | Intel Corporation | Heat transfer apparatus for a computer environment |
JP6743625B2 (ja) * | 2016-09-29 | 2020-08-19 | セイコーエプソン株式会社 | 波長変換装置、光源装置、およびプロジェクター |
US20230167831A1 (en) * | 2017-03-28 | 2023-06-01 | Faizan Ahmed | Thermo-electric chiller/heater component methods and systems |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
CN111856855B (zh) * | 2019-04-29 | 2022-02-22 | 中强光电股份有限公司 | 光机模块与投影机 |
EP4150216A4 (en) | 2020-05-11 | 2023-11-01 | Coolit Systems, Inc. | LIQUID PUMPING UNITS, AND ASSOCIATED SYSTEMS AND METHODS |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
CN115022521B (zh) * | 2022-07-09 | 2024-01-30 | 浙江舜宇智领技术有限公司 | 摄像头模组 |
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- 2004-05-28 WO PCT/JP2004/007793 patent/WO2004107837A1/ja active Application Filing
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006072102A2 (en) * | 2004-12-31 | 2006-07-06 | Intel Corporation | Systems for integrated pump and cold plate |
WO2006072102A3 (en) * | 2004-12-31 | 2006-09-08 | Intel Corp | Systems for integrated pump and cold plate |
US7124811B2 (en) | 2004-12-31 | 2006-10-24 | Intel Corporation | Systems for integrated pump and cold plate |
JP2007103821A (ja) * | 2005-10-07 | 2007-04-19 | Seiko Epson Corp | 冷却装置、プロジェクタ及び冷却方法 |
JP2009086273A (ja) * | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | 投写型映像表示装置の光源エレメントおよびこの光源エレメントにより構成された光源ユニットを備えた投写型映像表示装置 |
US8794767B2 (en) | 2008-03-24 | 2014-08-05 | Seiko Epson Corporation | Liquid-cooling device and projector |
JP2013164595A (ja) * | 2008-03-24 | 2013-08-22 | Seiko Epson Corp | プロジェクタ |
JP2014112258A (ja) * | 2008-03-24 | 2014-06-19 | Seiko Epson Corp | プロジェクタ |
JP2010170148A (ja) * | 2008-03-24 | 2010-08-05 | Seiko Epson Corp | プロジェクタ |
US9128361B2 (en) | 2008-03-24 | 2015-09-08 | Seiko Epson Corporation | Liquid-cooling device and projector |
JP2012083701A (ja) * | 2010-09-16 | 2012-04-26 | Ricoh Co Ltd | 冷却装置、画像形成装置 |
JP2018156075A (ja) * | 2017-03-15 | 2018-10-04 | キヤノン株式会社 | 画像投射装置 |
JP7046656B2 (ja) | 2017-03-15 | 2022-04-04 | キヤノン株式会社 | 画像投射装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2004107837A1 (ja) | 2006-07-20 |
JP4559361B2 (ja) | 2010-10-06 |
CN101002518A (zh) | 2007-07-18 |
US20060157230A1 (en) | 2006-07-20 |
US7264359B2 (en) | 2007-09-04 |
CN100531534C (zh) | 2009-08-19 |
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