JP4518513B2 - 電気的な構成要素を準備するためのウエハテーブル及び構成要素を基板に装着するための装置 - Google Patents
電気的な構成要素を準備するためのウエハテーブル及び構成要素を基板に装着するための装置 Download PDFInfo
- Publication number
- JP4518513B2 JP4518513B2 JP2007530723A JP2007530723A JP4518513B2 JP 4518513 B2 JP4518513 B2 JP 4518513B2 JP 2007530723 A JP2007530723 A JP 2007530723A JP 2007530723 A JP2007530723 A JP 2007530723A JP 4518513 B2 JP4518513 B2 JP 4518513B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- component
- wafer table
- substrate
- rotating disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 22
- 238000009434 installation Methods 0.000 claims description 8
- 238000001125 extrusion Methods 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53478—Means to assemble or disassemble with magazine supply
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
図1は、本発明に基づくウエハテーブルを備えた実装装置の側面図であり、
図2は、図1のII−II線に沿った断面図である。
回転円板26は、ウエハ25に対して垂直な回転軸を有していて、回転駆動部(図示省略)に連結されており、回転駆動部は回転円板26の回動を小さな回転量(ステップ角)で可能にするものである。回転円板26は、往復台20上に支承されており、該往復台(キャリッジ[carriage])は定位置のリニアガイド11に移動可能に配置されていて、直線駆動部(図示省略)によって微細に精度良く移動させられるようになっている。
Claims (5)
- ウエハ(25)の複数の電気的な構成要素(2)を供給するためのウエハテーブル(21)であって、該ウエハテーブル(21)は回転円板(26)を備えており、前記ウエハは前記ウエハテーブル(21)の前記回転円板(26)上に載せられるようになっており、前記回転円板(26)は、前記複数の各構成要素(2)を所定の取り出し位置に到達させるために、前記ウエハ(25)のウエハ平面に対して平行に不連続のステップで運動させられるようになっており、前記取り出し位置に対応して、前記構成要素(2)の取り出しのための少なくとも1つの補助装置を定位置に設けてある形式のものにおいて、前記回転円板(26)は微動操作可能な第1の回転駆動部によって回動させられるようになっており、前記回転円板(26)は、定位置のリニアガイド(11)に沿って移動可能な往復台(20)に支承されており、該往復台は微動操作可能な直線駆動部によって前記ウエハ(25)に対して平行に移動させられるようになっており、前記第1の回転駆動部による前記回転円板(26)の前記回動と前記直線駆動部による前記回転円板(26)の前記移動との組み合せに基づき、前記ウエハの前記複数の各構成要素(2)を前記所定の取り出し位置に到達させるようになっており、前記補助装置は、前記ウエハ(25)の前記構成要素(2)を、該ウエハ(25)の下面に設けられた支持シートから分離するためのエジェクタ(28)として形成されており、かつ、ロータ(29)を有しており、該ロータ(29)は前記ウエハ平面に対して垂直な回転軸を有し、かつ前記支持シートからの前記構成要素(2)の押し上げのための押し出しニードル(27)を備えており、該押し出しニードル(27)は、前記各構成要素(2)の角度位置、ひいては前記所定の取り出し位置における前記各構成要素(2)の角度位置に適した角度位置へ回動させられるようになっていることを特徴とする、電気的な構成要素を供給するためのウエハテーブル。
- 前記取り出し位置に前記補助装置と相対して配置された別の補助装置を設けてあり、該補助装置は、構成要素(2)の受容及び反転のための定位置の反転装置(16)として形成されている請求項1に記載のウエハテーブル。
- 基板(1)に、請求項1又は2に記載のウエハテーブル上に準備された電気的な構成要素を実装ヘッド(3)によって装着するための装置であって、前記実装ヘッドは、基板(1)に対して平行に移動させられるようになっていて、かつ構成要素(2)をつかむための少なくとも1つのグリッパ(7)を備えており、基板(1)は第1の座標軸Xの方向で該装置を通して搬送されるようになっている形式のものにおいて、前記グリッパ(7)は微動操作可能な第2の回転駆動部に連結されており、往復台(20)は第1の座標軸(x)に対して実質的に垂直な第2の座標軸(y)の方向で移動させられるようになっていることを特徴とする、構成要素を基板に装着するための装置。
- 前記構成要素を前記基板に装着するための前記装置は、前記グリッパ(7)につかまれた構成要素(2)の位置の検出のためのカメラ(19)を備えている請求項3に記載の装置。
- 前記実装ヘッド(3)のアクセス領域(24)内で前記ウエハテーブル(21)に並べて、異なる形式の供給装置(15)のための設置箇所を設けてある請求項3又は4に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005003454 | 2005-01-25 | ||
PCT/EP2006/050058 WO2006079577A2 (de) | 2005-01-25 | 2006-01-05 | Wafertisch zum bereitstellen von elektrischen bauelementen und vorrichtung zum bestücken von substraten mit den bauelementen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008512864A JP2008512864A (ja) | 2008-04-24 |
JP4518513B2 true JP4518513B2 (ja) | 2010-08-04 |
Family
ID=36740868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007530723A Active JP4518513B2 (ja) | 2005-01-25 | 2006-01-05 | 電気的な構成要素を準備するためのウエハテーブル及び構成要素を基板に装着するための装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7913380B2 (ja) |
EP (1) | EP1771877B1 (ja) |
JP (1) | JP4518513B2 (ja) |
KR (1) | KR100853887B1 (ja) |
CN (1) | CN100461999C (ja) |
AT (1) | ATE388486T1 (ja) |
DE (1) | DE502006000431D1 (ja) |
WO (1) | WO2006079577A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110248738A1 (en) * | 2010-04-12 | 2011-10-13 | Sze Chak Tong | Testing apparatus for electronic devices |
CN106064305B (zh) * | 2016-07-20 | 2023-10-27 | 梁启明 | 单翼片静脉针组装机 |
DE102018128616A1 (de) * | 2018-06-24 | 2019-12-24 | Besi Switzerland Ag | Vorrichtung und Verfahren zum Ablösen eines Chips von einer Klebefolie |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60207349A (ja) * | 1984-03-31 | 1985-10-18 | Toshiba Seiki Kk | ペレツトの選別摘出装置 |
JP2725702B2 (ja) * | 1988-08-22 | 1998-03-11 | 松下電器産業株式会社 | 電子部品実装方法 |
JPH06169002A (ja) * | 1992-11-30 | 1994-06-14 | Shibuya Kogyo Co Ltd | ボンダにおけるウエハからのチップ供給装置 |
JP3529820B2 (ja) | 1994-02-02 | 2004-05-24 | 株式会社東芝 | 半導体ペレットのピックアップ方法 |
JP3132353B2 (ja) * | 1995-08-24 | 2001-02-05 | 松下電器産業株式会社 | チップの搭載装置および搭載方法 |
KR20010005788A (ko) * | 1997-03-28 | 2001-01-15 | 미가쿠 다카하시 | 자기저항 소자의 제조방법 |
EP0971390A1 (de) * | 1998-07-07 | 2000-01-12 | ESEC Management SA | Einrichtung zum Transportieren von integrierten Schaltungen |
CN1144278C (zh) * | 1998-09-01 | 2004-03-31 | 松下电器产业株式会社 | 压点焊接的判定装置与方法及半导体部件制造装置与方法 |
WO2000069241A1 (fr) * | 1999-05-06 | 2000-11-16 | Matsushita Electric Industrial Co., Ltd. | Appareil de montage de composant et procede afferent |
JP2002111289A (ja) * | 2000-09-27 | 2002-04-12 | Matsushita Electric Ind Co Ltd | チップの供給装置および実装方法 |
US6543513B1 (en) * | 2000-11-27 | 2003-04-08 | Asm Assembly Automation Ltd. | Wafer table for die bonding apparatus |
JP3857949B2 (ja) * | 2002-04-22 | 2006-12-13 | 松下電器産業株式会社 | 電子部品実装装置 |
JP2004103923A (ja) * | 2002-09-11 | 2004-04-02 | Tdk Corp | 電子部品の実装装置および実装方法 |
JP2004203923A (ja) * | 2002-12-24 | 2004-07-22 | Nof Corp | シリコーン樹脂組成物および用途 |
-
2006
- 2006-01-05 EP EP06700043A patent/EP1771877B1/de active Active
- 2006-01-05 WO PCT/EP2006/050058 patent/WO2006079577A2/de active IP Right Grant
- 2006-01-05 KR KR1020077004951A patent/KR100853887B1/ko active IP Right Grant
- 2006-01-05 US US11/662,038 patent/US7913380B2/en not_active Expired - Fee Related
- 2006-01-05 AT AT06700043T patent/ATE388486T1/de not_active IP Right Cessation
- 2006-01-05 CN CNB200680000795XA patent/CN100461999C/zh active Active
- 2006-01-05 JP JP2007530723A patent/JP4518513B2/ja active Active
- 2006-01-05 DE DE502006000431T patent/DE502006000431D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
ATE388486T1 (de) | 2008-03-15 |
US20080089762A1 (en) | 2008-04-17 |
JP2008512864A (ja) | 2008-04-24 |
WO2006079577A2 (de) | 2006-08-03 |
CN101019477A (zh) | 2007-08-15 |
DE502006000431D1 (de) | 2008-04-17 |
US7913380B2 (en) | 2011-03-29 |
WO2006079577A3 (de) | 2007-01-18 |
EP1771877B1 (de) | 2008-03-05 |
EP1771877A2 (de) | 2007-04-11 |
CN100461999C (zh) | 2009-02-11 |
KR20070088500A (ko) | 2007-08-29 |
KR100853887B1 (ko) | 2008-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5791408B2 (ja) | 電子部品実装装置 | |
KR101014293B1 (ko) | 전자 부품의 실장 장치 및 실장 방법 | |
JP6513226B2 (ja) | 電子部品ハンドリングユニット | |
JP6469126B2 (ja) | ロータリーヘッド型部品実装機の部品吸着位置補正システム及び部品吸着位置補正方法 | |
JPWO2016129069A1 (ja) | 部品供給装置 | |
JP4518513B2 (ja) | 電気的な構成要素を準備するためのウエハテーブル及び構成要素を基板に装着するための装置 | |
JP2002319799A (ja) | プリント板保持装置,電気部品装着システムおよびプリント回路板の製造方法 | |
JP5199947B2 (ja) | 部品実装装置 | |
JP2010018402A (ja) | ワーク移送装置とそれを用いたワーク移送方法 | |
JP2012186505A (ja) | 部品供給装置 | |
JP7012890B2 (ja) | 部品実装機 | |
US11116121B2 (en) | Mounting target working device | |
JP2017059777A (ja) | 搬送装置およびはんだボール印刷システム | |
JP2006080158A (ja) | 表面実装装置 | |
JP2008130583A (ja) | 部品実装装置 | |
JP2017092175A (ja) | 部品実装機、部品吸着方法 | |
JP2000174158A (ja) | ボールマウント装置 | |
JP4602838B2 (ja) | 半導体チップの実装装置 | |
JP6650253B2 (ja) | 電子部品装着機 | |
TWI779822B (zh) | 轉位裝置及作業機 | |
JP5479961B2 (ja) | 電子部品の実装装置及び実装方法 | |
JPH08167788A (ja) | 電子部品装着装置 | |
KR100576587B1 (ko) | 전자부품의 공급장치 | |
JP6666832B2 (ja) | 部品実装機、基板搬送装置 | |
JP4147539B2 (ja) | 電子回路部品装着機 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090130 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090430 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090512 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090529 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090605 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090630 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090707 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090727 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090826 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20090925 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091225 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20100202 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100226 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100305 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100326 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100415 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100514 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130528 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4518513 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130528 Year of fee payment: 3 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130528 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |