JP4504275B2 - 感光性熱硬化型樹脂組成物、並びに該組成物を用いた感光性カバーレイ、及びフレキシブルプリント配線板 - Google Patents

感光性熱硬化型樹脂組成物、並びに該組成物を用いた感光性カバーレイ、及びフレキシブルプリント配線板 Download PDF

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Publication number
JP4504275B2
JP4504275B2 JP2005198167A JP2005198167A JP4504275B2 JP 4504275 B2 JP4504275 B2 JP 4504275B2 JP 2005198167 A JP2005198167 A JP 2005198167A JP 2005198167 A JP2005198167 A JP 2005198167A JP 4504275 B2 JP4504275 B2 JP 4504275B2
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JP
Japan
Prior art keywords
photosensitive
thermosetting resin
resin composition
meth
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005198167A
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English (en)
Japanese (ja)
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JP2007017644A (ja
Inventor
慎一 長谷川
徹 植木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arisawa Manufacturing Co Ltd
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Arisawa Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arisawa Manufacturing Co Ltd filed Critical Arisawa Manufacturing Co Ltd
Priority to JP2005198167A priority Critical patent/JP4504275B2/ja
Priority to KR1020060056800A priority patent/KR100795402B1/ko
Priority to TW095123746A priority patent/TWI332120B/zh
Priority to CN200610090384A priority patent/CN100590527C/zh
Priority to US11/482,672 priority patent/US7335460B2/en
Publication of JP2007017644A publication Critical patent/JP2007017644A/ja
Application granted granted Critical
Publication of JP4504275B2 publication Critical patent/JP4504275B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2005198167A 2005-07-06 2005-07-06 感光性熱硬化型樹脂組成物、並びに該組成物を用いた感光性カバーレイ、及びフレキシブルプリント配線板 Expired - Fee Related JP4504275B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005198167A JP4504275B2 (ja) 2005-07-06 2005-07-06 感光性熱硬化型樹脂組成物、並びに該組成物を用いた感光性カバーレイ、及びフレキシブルプリント配線板
KR1020060056800A KR100795402B1 (ko) 2005-07-06 2006-06-23 감광성 열경화형 수지조성물, 및 그 조성물을 이용한감광성 커버레이, 및 플렉시블 프린트 배선판
TW095123746A TWI332120B (en) 2005-07-06 2006-06-30 Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition
CN200610090384A CN100590527C (zh) 2005-07-06 2006-07-05 光敏热固性树脂组合物、感光性覆盖层和柔性印刷线路板
US11/482,672 US7335460B2 (en) 2005-07-06 2006-07-06 Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005198167A JP4504275B2 (ja) 2005-07-06 2005-07-06 感光性熱硬化型樹脂組成物、並びに該組成物を用いた感光性カバーレイ、及びフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
JP2007017644A JP2007017644A (ja) 2007-01-25
JP4504275B2 true JP4504275B2 (ja) 2010-07-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005198167A Expired - Fee Related JP4504275B2 (ja) 2005-07-06 2005-07-06 感光性熱硬化型樹脂組成物、並びに該組成物を用いた感光性カバーレイ、及びフレキシブルプリント配線板

Country Status (5)

Country Link
US (1) US7335460B2 (ko)
JP (1) JP4504275B2 (ko)
KR (1) KR100795402B1 (ko)
CN (1) CN100590527C (ko)
TW (1) TWI332120B (ko)

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WO2007111003A1 (ja) * 2006-03-28 2007-10-04 Fujifilm Corporation 感光性組成物、及び感光性フィルム、並びに永久パターン形成方法及びプリント基板
JP5164386B2 (ja) * 2006-07-10 2013-03-21 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物、及びその硬化物
JP5056088B2 (ja) * 2007-03-14 2012-10-24 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR101093526B1 (ko) 2009-10-05 2011-12-13 조광페인트주식회사 진동 ｆｉｌｍ 과 코일 접착용 경화성 수지 조성물 및 이를 포함하는 접착제
JP5613172B2 (ja) * 2009-11-17 2014-10-22 株式会社タムラ製作所 難燃性ソルダーレジスト組成物及びそれを用いて得られるフレキシブル配線板
JP5316901B2 (ja) * 2009-12-07 2013-10-16 山栄化学株式会社 プリント配線板及びその製造方法
JP5521800B2 (ja) * 2010-06-08 2014-06-18 Ｊｓｒ株式会社 感放射線性樹脂組成物、硬化膜、硬化膜の形成方法、及び表示素子
JP2010251789A (ja) * 2010-06-22 2010-11-04 Sony Chemical & Information Device Corp 接合体及びその製造方法
EP2445029A1 (en) * 2010-10-25 2012-04-25 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Multilayered protective layer, organic opto-electric device and method of manufacturing the same
EP2445028A1 (en) 2010-10-25 2012-04-25 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electric device and method of manufacturing an opto-electric device
CN102181192A (zh) * 2011-01-24 2011-09-14 上海宏盾防伪材料有限公司 双重固化涂料及其制备方法
JP5897915B2 (ja) * 2012-01-27 2016-04-06 株式会社タムラ製作所 紫外線硬化性透明樹脂組成物
JP5695622B2 (ja) * 2012-09-24 2015-04-08 株式会社タムラ製作所 黒色硬化性樹脂組成物
CN104378907B (zh) * 2013-08-12 2017-06-30 富葵精密组件(深圳)有限公司 电路板及其制作方法
JP6460444B2 (ja) * 2014-07-17 2019-01-30 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びフレキシブルプリント回路板
WO2016073946A1 (en) * 2014-11-07 2016-05-12 Multi-Fineline Electronix, Inc. Photoimageable coverlay composition for flexible printed circuit boards
CN105530763B (zh) * 2015-12-30 2019-03-12 江西芯创光电有限公司 Pcb板面保护的制作方法
TWI591119B (zh) * 2016-06-16 2017-07-11 臻鼎科技股份有限公司 感光性樹脂組合物、覆蓋膜及電路板
CN107529283A (zh) * 2016-06-21 2017-12-29 欣兴同泰科技（昆山）有限公司 柔性线路板的生产工艺
WO2018146821A1 (ja) 2017-02-07 2018-08-16 株式会社有沢製作所 感光性樹脂組成物、該感光性樹脂組成物を用いたソルダーレジストフィルム、フレキシブルプリント配線板及び画像表示装置
JP7146409B2 (ja) * 2018-02-20 2022-10-04 ヘンケルジャパン株式会社 Ｕｖ熱硬化型接着剤組成物
JP2019196444A (ja) * 2018-05-09 2019-11-14 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品

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WO2001073510A1 (fr) * 2000-03-29 2001-10-04 Kanagawa University Composition de resine photodurcissante/thermodurcissante, couche seche photosensible preparee au moyen de cette resine et procede de creation de configurations
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JP2005122048A (ja) * 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法
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Also Published As

Publication number Publication date
KR100795402B1 (ko) 2008-01-17
US7335460B2 (en) 2008-02-26
US20070009834A1 (en) 2007-01-11
JP2007017644A (ja) 2007-01-25
CN100590527C (zh) 2010-02-17
TW200712762A (en) 2007-04-01
CN1892427A (zh) 2007-01-10
KR20070005473A (ko) 2007-01-10
TWI332120B (en) 2010-10-21

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