JP7146409B2 - Uv熱硬化型接着剤組成物 - Google Patents
Uv熱硬化型接着剤組成物 Download PDFInfo
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- JP7146409B2 JP7146409B2 JP2018028205A JP2018028205A JP7146409B2 JP 7146409 B2 JP7146409 B2 JP 7146409B2 JP 2018028205 A JP2018028205 A JP 2018028205A JP 2018028205 A JP2018028205 A JP 2018028205A JP 7146409 B2 JP7146409 B2 JP 7146409B2
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- Prior art keywords
- meth
- epoxy
- adhesive composition
- acrylate resin
- thermosetting adhesive
- Prior art date
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- 229920001187 thermosetting polymer Polymers 0.000 title claims description 49
- 239000000853 adhesive Substances 0.000 title claims description 47
- 230000001070 adhesive effect Effects 0.000 title claims description 47
- 239000000203 mixture Substances 0.000 title claims description 39
- 239000004593 Epoxy Substances 0.000 claims description 42
- 239000004925 Acrylic resin Substances 0.000 claims description 34
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- 239000011256 inorganic filler Substances 0.000 claims description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 11
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 9
- 229920001519 homopolymer Polymers 0.000 claims description 5
- 229920000768 polyamine Polymers 0.000 claims description 3
- 150000003141 primary amines Chemical class 0.000 claims description 3
- 150000003335 secondary amines Chemical class 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 19
- 229920000647 polyepoxide Polymers 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- -1 acryl Chemical group 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 11
- 150000002148 esters Chemical class 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 2
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 2
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical class C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- UPPUJFRSINZXTE-UHFFFAOYSA-N (2,2,3,3,4-pentamethylpiperidin-1-yl) 2-methylprop-2-enoate Chemical compound CC1CCN(OC(=O)C(C)=C)C(C)(C)C1(C)C UPPUJFRSINZXTE-UHFFFAOYSA-N 0.000 description 1
- RPNDKNJEUSJAMT-UHFFFAOYSA-N (2,2,3,3-tetramethylpiperidin-1-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)ON1CCCC(C)(C)C1(C)C RPNDKNJEUSJAMT-UHFFFAOYSA-N 0.000 description 1
- ZODNDDPVCIAZIQ-UHFFFAOYSA-N (2-hydroxy-3-prop-2-enoyloxypropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)COC(=O)C=C ZODNDDPVCIAZIQ-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- LRZPQLZONWIQOJ-UHFFFAOYSA-N 10-(2-methylprop-2-enoyloxy)decyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCOC(=O)C(C)=C LRZPQLZONWIQOJ-UHFFFAOYSA-N 0.000 description 1
- JMIZWXDKTUGEES-UHFFFAOYSA-N 2,2-di(cyclopenten-1-yloxy)ethyl 2-methylprop-2-enoate Chemical compound C=1CCCC=1OC(COC(=O)C(=C)C)OC1=CCCC1 JMIZWXDKTUGEES-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- FIQBJLHOPOSODG-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxycarbonyl]benzoic acid Chemical compound CC(=C)C(=O)OCCOC(=O)C1=CC=CC=C1C(O)=O FIQBJLHOPOSODG-UHFFFAOYSA-N 0.000 description 1
- FIOCEWASVZHBTK-UHFFFAOYSA-N 2-[2-(2-oxo-2-phenylacetyl)oxyethoxy]ethyl 2-oxo-2-phenylacetate Chemical compound C=1C=CC=CC=1C(=O)C(=O)OCCOCCOC(=O)C(=O)C1=CC=CC=C1 FIOCEWASVZHBTK-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- VIYWVRIBDZTTMH-UHFFFAOYSA-N 2-[4-[2-[4-[2-(2-methylprop-2-enoyloxy)ethoxy]phenyl]propan-2-yl]phenoxy]ethyl 2-methylprop-2-enoate Chemical compound C1=CC(OCCOC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCCOC(=O)C(C)=C)C=C1 VIYWVRIBDZTTMH-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- ZWVCZSFSZUTSCR-UHFFFAOYSA-N 2-methylprop-2-enoic acid;1-phenoxyethane-1,2-diol Chemical compound CC(=C)C(O)=O.OCC(O)OC1=CC=CC=C1 ZWVCZSFSZUTSCR-UHFFFAOYSA-N 0.000 description 1
- UPTHZKIDNHJFKQ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(O)CO UPTHZKIDNHJFKQ-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- FGSFVBRPCKXYDI-UHFFFAOYSA-N 2-triethoxysilylethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCOC(=O)C(C)=C FGSFVBRPCKXYDI-UHFFFAOYSA-N 0.000 description 1
- RDCTZTAAYLXPDJ-UHFFFAOYSA-N 2-trimethoxysilylethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCOC(=O)C(C)=C RDCTZTAAYLXPDJ-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
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- ZEWLHMQYEZXSBH-UHFFFAOYSA-M 4-[2-(2-methylprop-2-enoyloxy)ethoxy]-4-oxobutanoate Chemical compound CC(=C)C(=O)OCCOC(=O)CCC([O-])=O ZEWLHMQYEZXSBH-UHFFFAOYSA-M 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- QQLLXLMGANLVAX-UHFFFAOYSA-N 4-triethoxysilylbutyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCCOC(=O)C(C)=C QQLLXLMGANLVAX-UHFFFAOYSA-N 0.000 description 1
- ORKJFLQNNVDBKY-UHFFFAOYSA-N 4-trimethoxysilylbutyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCOC(=O)C(C)=C ORKJFLQNNVDBKY-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 1
- YJVIKVWFGPLAFS-UHFFFAOYSA-N 9-(2-methylprop-2-enoyloxy)nonyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCOC(=O)C(C)=C YJVIKVWFGPLAFS-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
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- ZCIJAGHWGVCOHJ-UHFFFAOYSA-N naphthalene phenol Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)O ZCIJAGHWGVCOHJ-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- NWAHZAIDMVNENC-UHFFFAOYSA-N octahydro-1h-4,7-methanoinden-5-yl methacrylate Chemical compound C12CCCC2C2CC(OC(=O)C(=C)C)C1C2 NWAHZAIDMVNENC-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 150000003553 thiiranes Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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Description
UV熱硬化型接着剤組成物であって、
(a)エポキシ(メタ)アクリレート樹脂、
(b)(メタ)アクリル酸エステル、
(c)熱硬化剤、及び
(d)光重合開始剤
を含み、
前記エポキシ(メタ)アクリレート樹脂(a)が、(メタ)アクリロイル基を樹脂全体に対して20重量%以上含み、かつ
前記エポキシ(メタ)アクリレート樹脂(a)と、前記(メタ)アクリル酸エステル(b)との重量比(a)/(b)が、30/70~70/30である、
UV熱硬化型接着剤組成物。
項2.
前記(メタ)アクリル酸エステル(b)が、ホモポリマーのTgが60℃以上となる(メタ)アクリル酸エステルである、項1に記載のUV熱硬化型接着剤組成物。
項3.
前記エポキシ(メタ)アクリレート樹脂(a)が、ビスフェノールA型エポキシ(メタ)アクリレート樹脂である、項1又は2に記載のUV熱硬化型接着剤組成物。
項4.
前記熱硬化剤(c)が、ポリアミンである、項1~3のいずれか一項に記載のUV熱硬化型接着剤組成物。
項5.
さらに、
(e)無機フィラー
を含む、項1~4のいずれか一項に記載のUV熱硬化型接着剤組成物。
項6.
カメラモジュール組み立てのために用いられる、項1~5のいずれか一項に記載のUV熱硬化型接着剤組成物。
本発明で用いるエポキシ(メタ)アクリレート樹脂は、(メタ)アクリル酸とエポキシ樹脂とを反応させることにより得られうるものが挙げられる。かかる反応は常法に従って塩基性触媒の存在下で行うことができる。
本発明のUV熱硬化型接着剤組成物は、さらに(メタ)アクリル酸エステルを含有する。(メタ)アクリル酸エステルは、単官能(メタ)アクリル酸エステルであってもよいし、多官能(メタ)アクリル酸エステルであってもよい。
熱硬化剤(c)は、好ましくはポリアミン型熱硬化剤である。熱硬化剤(c)は、より好ましくは、第一級及び第二級アミンを含むポリアミン型熱硬化剤である。
光重合開始剤(d)としては、特に限定されず、当該技術分野において通常使用されるものを使用できる。
本発明のUV熱硬化型接着剤組成物は、さらに無機フィラー(e)を含有していてもよく、それにより、UV熱硬化型接着剤組成物の線膨張係数を制御することができる。無機フィラー(e)としては、コロイダルシリカ、疎水性シリカ、微細シリカ及びナノシリカ等のシリカフィラー、並びにアクリルビーズ、ガラスビーズ、ウレタンビーズ、ベントナイト、アセチレンブラック及びケッチェンブラック等が挙げられる。
本発明のUV熱硬化型接着剤組成物は、さらに他の成分を含んでいてもよい。他の成分としては、接着剤助剤として、シラン、チタネート等の各種カップリン剤及びヒュームドシリカ等のレオロジー調整剤、が挙げられる。
本発明のUV熱硬化型接着剤組成物は、好ましくは、カメラモジュール組み立てのために用いられる。より具体的には、本発明のUV熱硬化型接着剤組成物は、好ましくは、カメラモジュール組み立てにおいて、レンズホルダと、撮像素子が固定化された基板とを接着するために用いられる。上記において、カメラモジュールは、特に限定されず、例えば、スマートフォン等に使用される小型カメラモジュールである。
<硬化Tg>
厚さ300μmになるよう接着剤組成物を剥離フィルム上に塗布し、365nm-LEDを照射(2.5J/cm2)した後、熱風循環式オーブンを用いて、80℃、60分の条件で硬化させた。得られた硬化物の熱分析をTMA(熱機械分析装置)を用いて行い、Tgを測定した。
図1に示す通り行った。具体的には、以下の通りである。15mm×15mmのセラミック基板上に接着剤組成物を5mm×5mmのロの字の形状で、3.5mg程度の重量になる様ディスペンスし、その後7mm×7mmの形状のLCPチップをマウントし、接着剤の厚みが100μmになるよう調整した。周囲4方向から365nm-LEDを500mW/cm2×2秒の条件で照射し、仮硬化させた。その後、熱風循環式オーブンを用いて、80℃、60分の条件で熱硬化させたサンプルを、Dage製4000万能型ボンドテスターを用いて、シェアスピード200μm/s、シェア高さ120μmの条件で測定した。
Claims (4)
- カメラモジュール組み立て用UV熱硬化型接着剤組成物であって、
(a)エポキシ基を有するエポキシ(メタ)アクリレート樹脂、
(b)(メタ)アクリル酸エステル、
(c)熱硬化剤、及び
(d)光重合開始剤
を含み、
前記エポキシ(メタ)アクリレート樹脂(a)が、(メタ)アクリロイル基をエポキシ(メタ)アクリレート樹脂(a)全体に対して20重量%以上含み、かつ
前記エポキシ(メタ)アクリレート樹脂(a)と、前記(メタ)アクリル酸エステル(b)との重量比(a)/(b)が、30/70~70/30であり、
前記(メタ)アクリル酸エステル(b)が、ホモポリマーのTgが60℃以上となる(メタ)アクリル酸エステルであり、かつ
前記熱硬化剤(c)が、第一級及び第二級アミンを含むポリアミン型熱硬化剤である、
UV熱硬化型接着剤組成物。 - 前記エポキシ(メタ)アクリレート樹脂(a)が、ビスフェノールA型エポキシ(メタ)アクリレート樹脂である、請求項1又は2に記載のカメラモジュール組み立て用UV熱硬化型接着剤組成物。
- 前記熱硬化剤(c)が、ポリアミンである、請求項1又は2に記載のカメラモジュール組み立て用UV熱硬化型接着剤組成物。
- さらに、
(e)無機フィラー
を含む、請求項1~3のいずれか一項に記載のカメラモジュール組み立て用UV熱硬化型接着剤組成物。
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JP2018028205A JP7146409B2 (ja) | 2018-02-20 | 2018-02-20 | Uv熱硬化型接着剤組成物 |
CN201980012951.1A CN111712764A (zh) | 2018-02-20 | 2019-02-14 | 热固化和uv固化粘合剂组合物 |
KR1020207026772A KR102629106B1 (ko) | 2018-02-20 | 2019-02-14 | 열 및 uv 경화 접착제 조성물 |
PCT/JP2019/005299 WO2019163629A1 (en) | 2018-02-20 | 2019-02-14 | Thermal- and uv-curing adhesive composition |
EP19708905.5A EP3756049A1 (en) | 2018-02-20 | 2019-02-14 | Thermal- and uv-curing adhesive composition |
TW108105632A TWI851554B (zh) | 2018-02-20 | 2019-02-20 | 熱及uv固化黏著劑組合物 |
US16/998,581 US11111421B2 (en) | 2018-02-20 | 2020-08-20 | Thermal- and UV-curing adhesive composition |
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KR102606819B1 (ko) | 2021-11-10 | 2023-11-29 | 주식회사 아이델 | Uv 경화형 접착제로 접합한 방범시트의 제조방법 |
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TW201936820A (zh) | 2019-09-16 |
EP3756049A1 (en) | 2020-12-30 |
KR102629106B1 (ko) | 2024-01-24 |
KR20200123180A (ko) | 2020-10-28 |
US11111421B2 (en) | 2021-09-07 |
US20200377770A1 (en) | 2020-12-03 |
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