CN111712764A - 热固化和uv固化粘合剂组合物 - Google Patents
热固化和uv固化粘合剂组合物 Download PDFInfo
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- CN111712764A CN111712764A CN201980012951.1A CN201980012951A CN111712764A CN 111712764 A CN111712764 A CN 111712764A CN 201980012951 A CN201980012951 A CN 201980012951A CN 111712764 A CN111712764 A CN 111712764A
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- meth
- epoxy
- adhesive composition
- acrylate
- heat
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 59
- 239000000203 mixture Substances 0.000 title claims abstract description 49
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- 239000004925 Acrylic resin Substances 0.000 claims abstract description 36
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 11
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 10
- 238000001029 thermal curing Methods 0.000 claims abstract description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011256 inorganic filler Substances 0.000 claims description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 13
- 238000013007 heat curing Methods 0.000 claims description 11
- 229920000768 polyamine Polymers 0.000 claims description 6
- 229920001519 homopolymer Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 10
- 238000001723 curing Methods 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 description 22
- 229920000647 polyepoxide Polymers 0.000 description 22
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 150000002148 esters Chemical class 0.000 description 11
- 239000002245 particle Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 8
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- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 2
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- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 2
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical class C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
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- 238000002844 melting Methods 0.000 description 2
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- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- UPPUJFRSINZXTE-UHFFFAOYSA-N (2,2,3,3,4-pentamethylpiperidin-1-yl) 2-methylprop-2-enoate Chemical compound CC1CCN(OC(=O)C(C)=C)C(C)(C)C1(C)C UPPUJFRSINZXTE-UHFFFAOYSA-N 0.000 description 1
- ZODNDDPVCIAZIQ-UHFFFAOYSA-N (2-hydroxy-3-prop-2-enoyloxypropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)COC(=O)C=C ZODNDDPVCIAZIQ-UHFFFAOYSA-N 0.000 description 1
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- JMIZWXDKTUGEES-UHFFFAOYSA-N 2,2-di(cyclopenten-1-yloxy)ethyl 2-methylprop-2-enoate Chemical compound C=1CCCC=1OC(COC(=O)C(=C)C)OC1=CCCC1 JMIZWXDKTUGEES-UHFFFAOYSA-N 0.000 description 1
- YWEJNVNVJGORIU-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-hydroxy-2-phenylacetate Chemical compound OCCOCCOC(=O)C(O)C1=CC=CC=C1 YWEJNVNVJGORIU-UHFFFAOYSA-N 0.000 description 1
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- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明提供了一种粘合剂组合物,其使得能够在相机模块装配中,在该粘合剂固化时充分固化紫外线未到达的位点;并且在将透镜支架粘着至其上固定有图像传感器的基板时,可以减少或防止加热步骤中透镜和图像传感器之间的距离变化。热固化和UV固化粘合剂组合物包含(a)环氧(甲基)丙烯酸酯树脂;(b)(甲基)丙烯酸酯;(c)热固化剂;以及(d)光聚合引发剂;其中该环氧(甲基)丙烯酸酯树脂(a)含有,基于该树脂的总重量,20重量%或更多的(甲基)丙烯酰基,并且环氧(甲基)丙烯酸酯树脂(a)与(甲基)丙烯酸酯(b)的重量比(a)/(b)为30/70至70/30。
Description
技术领域
本发明涉及一种热固化和UV固化粘合剂组合物。
背景技术
配备于例如智能电话中的紧凑型相机模块包括透镜、用于保持透镜的圆柱形透镜支架,以及将由透镜收集的光转换成电信号且固定于基板上的图像传感器。在此类紧凑型相机模块的装配中,透镜支架以及其上固定有图像传感器的基板必须彼此牢固地粘接,且使用粘合剂来将它们其粘接(PTL 1)。
为将透镜支架粘接至其上固定有图像传感器的基板,必须准确地保持透镜与图像传感器之间的距离。具体而言,透镜与图像传感器的光接收表面之间的距离必须与透镜的焦点距离匹配。出于此目的,提出使用UV可固化粘合剂(PTL 2)。
引用列表
专利文献
PTL 1:JP2007-184801A
PTL 2:JP2009-141406A
发明内容
技术问题
本发明人发现,在装配相机模块时,在将透镜支架粘接至其上固定有图像传感器的基板之后,可能需要进行基板加热步骤;并且在此情况下,使用传统的粘合剂可能会在加热步骤中改变透镜与图像传感器之间的距离。
本发明人还发现,尽管使用UV可固化粘合剂可防止加热步骤中透镜和图像传感器之间的距离变化,但使用UV可固化粘合剂可能会引起紫外线未到达的位点未充分固化。在这种情况下,在未充分固化的位点上可能会产生气泡,或粘合无法在恶劣环境中得到保持。
本发明的目的是提供一种粘合剂组合物,该粘合剂组合物能够在该粘合剂组合物固化时充分固化紫外线没有到达的位点;并且在将透镜支架粘接至其上固定有图像传感器的基板以装配相机模块时,可以减少或防止加热步骤中透镜和图像传感器之间的距离变化。
问题的解决方案
本发明人为实现该目的进行了广泛的研究,并且发现,本发明目的可以通过使用热固化和UV固化粘合剂组合物来实现,该组合物包括:(a)环氧(甲基)丙烯酸酯树脂;(b)(甲基)丙烯酸酯;(c)热固化剂;以及(d)光聚合引发剂,其中该环氧(甲基)丙烯酸酯树脂(a)含有,基于该树脂的总重量,20重量%或更多的(甲基)丙烯酰基,并且环氧(甲基)丙烯酸酯树脂(a)与(甲基)丙烯酸酯(b)的重量比((a)/(b))为30/70至70/30。通过基于该发现进行进一步的研究而完成本发明,并且本发明包括以下主题。
项目1.一种热固化和UV固化粘合剂组合物,其包括:
(a)环氧(甲基)丙烯酸酯树脂;
(b)(甲基)丙烯酸酯;
(c)热固化剂;以及
(d)光聚合引发剂,
其中环氧(甲基)丙烯酸酯树脂(a)包含,基于该树脂的总重量,20重量%或更多的(甲基)丙烯酰基,并且
环氧(甲基)丙烯酸酯树脂(a)与(甲基)丙烯酸酯(b)的重量比((a)/(b))为30/70至70/30。
项目2.根据项目1所述的热固化和UV固化粘合剂组合物,其中(甲基)丙烯酸酯(b)是其均聚物的Tg为60℃或更高的(甲基)丙烯酸酯。
项目3.根据项目1或2所述的热固化和UV固化粘合剂组合物,其中环氧(甲基)丙烯酸酯树脂(a)是双酚A型环氧(甲基)丙烯酸酯树脂。
项目4.根据项目1至3中任一项所述的热固化和UV固化粘合剂组合物,其中所述热固化剂(c)为多胺。
项目5.根据项目1至4中任一项所述的热固化和UV固化粘合剂组合物,其还包括(e)无机填料。
项目6.根据项目1至5中任一项所述的热固化和UV固化粘合剂组合物,其用于装配相机模块。
本发明的有益效果
在相机模块的装配中,使用根据本发明的热固化和UV固化粘合剂组合物将透镜支架粘接至其上固定有图像传感器的基板,使得能够在粘合剂组合物固化时充分固化紫外线未到达的位点;并且减少或防止加热步骤中透镜与图像传感器之间的距离变化。
附图说明
图1示出了在实施例中进行的对液晶聚合物(LCP)的粘合强度的测量测试流程图。
具体实施方式
(a)环氧(甲基)丙烯酸酯树脂
适用于本发明的环氧(甲基)丙烯酸酯树脂包括通过使(甲基)丙烯酸与环氧树脂反应而获得的那些。该反应可以根据标准方法在碱性催化剂的存在下进行。
特别地,由于所得的固化产物具有优异的耐湿性,所以环氧甲基丙烯酸酯树脂是优选的。
在本说明书中,(甲基)丙烯酸酯、(甲基)丙烯酸类和(甲基)丙烯酰基分别是指丙烯酸酯或甲基丙烯酸酯;丙烯酸类或甲基丙烯酸类;以及丙烯酰基或甲基丙烯酰基。
可用于制备环氧(甲基)丙烯酸酯树脂的起始原料中的环氧树脂不受特别限制。其示例包括双酚A型环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、2,2'-二烯丙基双酚A型环氧树脂、氢化双酚型环氧树脂、环氧丙烷加成双酚A型环氧树脂、间苯二酚型环氧树脂、联苯型环氧树脂、硫化物型环氧树脂、二苯醚型环氧树脂、二环戊二烯型环氧树脂、萘型环氧树脂、苯酚酚醛清漆型环氧树脂、邻甲酚酚醛清漆型环氧树脂、二环戊二烯酚醛清漆型环氧树脂、联苯酚醛清漆型环氧树脂、萘酚酚醛清漆型环氧树脂、缩水甘油胺型环氧树脂、烷基多元醇型环氧树脂、橡胶改性型环氧树脂、缩水甘油酯化合物和双酚A型环硫树脂。
对于环氧(甲基)丙烯酸酯树脂,市售的示例包括EA-1010、EA-1020、EA-5323、EA-5520、EA-CHD、EMA-1020(均由Shin-Nakamura Chemical有限公司生产);Ebecryl 860、Ebecryl 3200、Ebecryl 3201、Ebecryl 3412、Ebecryl 3600、Ebecryl 3700、Ebecryl3701、Ebecryl 3702、Ebecryl 3703、Ebecryl 3800、Ebecryl 6040和Ebecryl RDX63182(均由Daicel-Cytec有限公司生产);环氧酯M-600A、环氧酯40EM、环氧酯70PA、环氧酯200PA、环氧酯80MFA、环氧酯3002M、环氧酯3002A、环氧酯1600A、环氧酯3000M、环氧酯3000A、环氧酯200EA和环氧酯400EA(均由Kyoeisha Chemical有限公司生产);以及Denacol AcrylateDA-141、Denacol Acrylate DA-314和Denacol Acrylate DA-911(均由Nagase ChemteX公司生产)。
环氧(甲基)丙烯酸酯树脂(a)优选为双酚A型环氧(甲基)丙烯酸酯树脂。
环氧(甲基)丙烯酸酯树脂(a)包含,基于该树脂的总重量,20重量%或更多的(甲基)丙烯酰基。这使得根据本发明的热固化和UV固化粘合剂组合物具有足够的UV可固化性。在这一点上,环氧(甲基)丙烯酸酯树脂(a)优选地包含,基于该树脂的总重量,30重量%或更多的(甲基)丙烯酰基。从固化后玻璃化转变温度(Tg)足够高以及在第一阶段以及在可靠性测试之后优异粘合性的角度出发,环氧(甲基)丙烯酸酯树脂(a)通常包含,基于该树脂的总重量,80重量%或更少,优选为60重量%或更少的(甲基)丙烯酰基。
环氧(甲基)丙烯酸酯树脂(a)的重均分子量(Mw)不受特别限制,优选为300至1000,更优选为400至800。在本说明书中,重均分子量(Mw)是指通过使用诸如四氢呋喃的溶剂作为洗脱剂通过凝胶渗透色谱法(GPC)相对于聚苯乙烯标准物确定的值。
根据本发明的热固化和UV固化粘合剂组合物可包含单一类型的环氧(甲基)丙烯酸酯树脂(a)或两种或更多种类型的环氧(甲基)丙烯酸酯树脂(a)的组合。
(b)(甲基)丙烯酸酯
根据本发明的热固化和UV固化粘合剂组合物还包含(甲基)丙烯酸酯。(甲基)丙烯酸酯可以是单官能(甲基)丙烯酸酯或多官能(甲基)丙烯酸酯。
(甲基)丙烯酸酯(b)的均聚物的Tg优选为60℃或更高。这使得根据本发明的热固化和UV固化粘合剂组合物具有足够高的固化后玻璃化转变温度(Tg);并且在第一阶段及可靠性测试后具有优异的粘合力。在这一点上,(甲基)丙烯酸酯(b)的均聚物的Tg更优选地为90℃或更高。(甲基)丙烯酸酯(b)的均聚物的Tg通常为250℃或更低,优选地为200℃或更低。
单官能甲基丙烯酸酯的具体示例包括甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丙酯、甲基丙烯酸缩水甘油酯、甲基丙烯酸2-羟乙酯、甲基丙烯酸2-异氰酸基乙酯、甲基丙烯酸异冰片酯(例如,“IBXA”,Osaka Organic Chemical Industry有限公司)、2-甲基丙烯酰氧基乙基三甲氧基硅烷、2-甲基丙烯酰氧基乙基三乙氧基硅烷、3-甲基丙烯酰氧基丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷、3-甲基丙烯酰氧基丙基三乙氧基硅烷、3-甲基丙烯酰氧基甲基二乙氧基硅烷、4-甲基丙烯酰氧基丁基三甲氧基硅烷、4-甲基丙烯酰氧基丁基三乙氧基硅烷、甲基丙烯酸二环戊烯氧基乙酯(例如,HitachiChemical有限公司生产的“FA-512M”)、甲基丙烯酸二环戊酯(例如,Hitachi Chemical有限公司生产的“FA-513M”)、甲基丙烯酸五甲基哌啶酯(例如,Hitachi Chemical有限公司生产的“FA-711MM”)、甲基丙烯酸四甲基哌啶酯(例如,Hitachi Chemical有限公司生产的“FA-712HM”)、甲氧基聚乙二醇甲基丙烯酸酯(例如,Hitachi Chemical有限公司生产的)、甲基丙烯酸苄酯(例如,Hitachi Chemical有限公司生产的“FA-BZM”)、甲基丙烯酸2-羟基-3-丙烯酰氧基丙酯(例如,Kyoeisha Chemical有限公司生产的“Light Ester G-201P”)、邻苯二甲酸2-甲基丙烯酰氧基乙酯(例如,Shin-Nakamura Chemical有限公司生产的“CB-1”)、甲氧基聚乙二醇甲基丙烯酸酯、苯氧基乙二醇甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“PHE-1G”)、甲基丙烯酸硬脂酯(例如,Shin-Nakamura Chemical有限公司生产的“S”)、丁二酸2-甲基丙烯酰氧基乙酯(例如,Shin-Nakamura Chemical有限公司生产的“SA”)、以及甲基丙烯酸3,4-环氧环己基甲酯(例如,Daicel公司生产的“CyclomerM100”)。
双官能甲基丙烯酸酯的具体示例包括二丙二醇二丙烯酸酯(例如,Shin-NakamuraChemical有限公司的“APG-100”)、三环癸烷二甲醇二丙烯酸酯(例如,Shin-NakamuraChemical有限公司的“A-DCP”)、1,4-丁二醇二甲基丙烯酸酯(例如,Hitachi Chemical有限公司生产的“FA-124M”)、新戊二醇二甲基丙烯酸酯(例如,Hitachi Chemical有限公司的“FA-125”)、聚乙二醇#200二甲基丙烯酸酯(例如,Hitachi Chemical有限公司生产的“FA-220M”)、EO改性双酚A二甲基丙烯酸酯(例如,Hitachi Chemical有限公司生产的“FA-321M”)、EO改性聚丙二醇#700二甲基丙烯酸酯(例如,Hitachi Chemical有限公司生产的“FA-023M”)、乙二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“1G”)、二乙二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“2G”)、三乙二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“3G”)、聚乙二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的)、2,2-双[4-(甲基丙烯酰氧基乙氧基)苯基]丙烷(例如,Shin-Nakamura Chemical有限公司生产的“BPE-80N”)、乙氧基化双酚A二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的)、三环癸烷二甲醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“DCP”)、1,10-癸二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“DOD-N”)、1,6-己二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“HD-N”)、1,9-壬二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“NOD-N”)、新戊二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“NPG”)、乙氧基化聚丙二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的)、二甲基丙烯酸甘油酯(例如,Shin-Nakamura Chemical有限公司生产的“701”)、以及聚丙二醇二甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的)。
多官能(三官能或更高官能)甲基丙烯酸酯的具体示例包括三羟甲基丙烷三甲基丙烯酸酯(例如,Shin-Nakamura Chemical有限公司生产的“TMPT”)。
根据本发明的热固化和UV固化粘合剂组合物可包含单一类型的(甲基)丙烯酸酯(b)或两种或更多种类型的(甲基)丙烯酸酯(b)的组合。
环氧(甲基)丙烯酸酯树脂(a)与(甲基)丙烯酸酯(b)的重量比(a)/(b)为30/70至70/30。由于环氧(甲基)丙烯酸酯树脂(a)的比例为30%或更高,因此根据本发明的热固化和UV固化粘合剂组合物在第一阶段及可靠性测试之后具有足够的粘合性。由于环氧(甲基)丙烯酸酯树脂(a)的比例为70%或更低,因此根据本发明的热固化和UV固化粘合剂组合物的粘度在适当范围内,使得其操作更为容易。由于这些原因,环氧(甲基)丙烯酸酯树脂(a)与(甲基)丙烯酸酯(b)的重量比(a)/(b)优选地为40/60至60/40。
环氧(甲基)丙烯酸酯树脂(a)和(甲基)丙烯酸酯(b)的总含量,基于该热固化和UV固化粘合剂组合物的总重量,优选地为30-70重量%,并且更优选地为40-60重量%。
(c)热固化剂
热固化剂(c)优选地为多胺系热固化剂。热固化剂(c)更优选地为包含伯胺和仲胺的多胺系热固化剂。
从延长产品寿命的角度考虑,热固化剂(c)的熔点优选地为50℃或更高,更优选地为60℃或更高。为了在正常热固温度(通常为80℃)下具有充分的热固性,热固化剂(c)的熔点为80℃或更低,更优选地为70℃或更低。
对于多胺系热固化剂,市售的示例包括Fujicure FXR-1020、FXR-1030、FXR-1050和FXR-1080(由Fuji Kasei Kogyo K.K.生产);以及ADK Hardener EH-4357S、EH-5057P和EH-5057PK(由ADEKA公司生产)。
根据本发明的热固化和UV固化粘合剂组合物可包含单一类型的热固化剂(c)或两种或更多种类型的热固化剂(c)的组合。
热固化剂(c)的含量,基于该热固化和UV固化粘合剂组合物的总重量,优选地为10-40重量%,更优选地为20-30重量%。
(d)光聚合引发剂
光聚合引发剂(d)不受特别限制,可以使用本领域通常使用的那些。
对于光聚合引发剂(d),市售的示例包括IRGACURE 651(2,2-二甲氧基-1,2-二苯基乙烷-1-酮)、IRGACURE 184(1-羟基-环己基-苯基-酮)、DAROCUR 1173(2-羟基-2-甲基-1-苯基-丙烷-1-酮)、IRGACURE2959(1-[4-(2-羟基乙氧基)-苯基]-2-羟基-2-甲基-1-丙烷-1-酮)、IRGACURE127(2-羟基-1-{4-[4-(2-羟基-2-甲基-丙酰基)-苯甲基]-苯基}-2-甲基-丙烷-1-酮)、IRGACURE 907(2-甲基-1-(4-甲基硫代苯基)-2-吗啉基丙烷-1-酮)、IRGACURE 369(2-苄基-2-二甲基氨基-1-(4-吗啉苯基)-丁酮-1)、IRGACURE379(2-(二甲基氨基)-2-[(4-甲基苯基)甲基]-1-[4-(4-吗啉基)苯基]-1-丁酮)、DAROCUR TPO(2,4,6-三甲基苯甲酰基-二苯基-氧化膦)、IRGACURE 819(双(2,4,6-三甲基苯甲酰基)-苯基氧化膦)、IRGACURE 784(双(η5-2,4-环戊二烯-1-基)-双(2,6-二氟-3-(1H-吡咯-1-基)-苯基)钛)、IRGACURE OXE 01(1,2-辛二酮,1-[4-(苯硫基)-,2-(O-苯甲酰基肟)])、IRGACURE OXE02(乙酮,1-[9-乙基-6-(2-甲基苯甲酰基)-9H-咔唑-3-基]-,1-(O-乙酰肟))、IRGACURE754(氧基-苯基乙酸2-[2-氧代-2-苯基乙酰氧基乙氧基]乙酯与氧基-苯基乙酸2-(2-羟基乙氧基)乙酯的混合物)、Lucirin TPO、LR8893、LR8970(上述均由BASF Japan有限公司生产)、DETX-S(2,4-二乙基噻吨酮)(Nippon Kayaku有限公司生产),以及Ebecryl P36(UCB生产)。
根据本发明的热固化和UV固化粘合剂组合物可包含单一类型的光聚合引发剂(d)或两种或更多种类型的光聚合引发剂(d)的组合。
光聚合引发剂(d)的含量,基于该热固化和UV固化粘合剂组合物的总重量,优选地为0.5-5重量%,更优选地为1-2重量%。
(e)无机填料
根据本发明的热固化和UV固化粘合剂组合物还可包含无机填料(e)。通过添加无机填料(e),可以控制热固化和UV固化粘合剂组合物的热膨胀系数。无机填料(e)包括二氧化硅填料,例如胶体二氧化硅、疏水性二氧化硅、精细二氧化硅和纳米二氧化硅;丙烯酸类珠;玻璃珠;氨基甲酸酯珠;膨润土;乙炔黑;以及科琴碳黑(Ketjenblack)。
从对热固化和UV固化粘合剂组合物进行优异操作的角度出发,无机填料(e)的平均粒径(如果填料不是颗粒形式,则为最大平均尺寸)不受特别限制,并且优选地为0.01μm或更大。从填料在热固化和UV固化粘合剂组合物中均匀分散的角度出发,无机填料(e)的平均粒径(如果填料不是颗粒形式,则为最大平均尺寸)优选地为50μm或更小。在本发明中,无机填料的平均粒径是指用动态光散射Nanotrac粒径分析仪测得的值。
可商购获得的无机填料(e)包括合成高纯度球形二氧化硅SO-E5或SO-E2(由Admatechs有限公司生产,SO-E5的平均粒径:2μm,SO-E2的平均粒径:0.6μm)、二氧化硅FB7SDX(由Tatsumori有限公司生产,平均粒径:10μm),以及二氧化硅TS-10-034P(由Micron生产,平均粒径:20μm)。
根据本发明的热固化和UV固化粘合剂组合物可包含单一类型的无机填料(e)或两种或更多种类型的无机填料(e)的组合。
(f)其它组分
根据本发明的热固化和UV固化粘合剂组合物还可包含其它组分。其它组分包括作为粘合剂助剂的各种偶联剂,例如,硅烷和钛酸酯;以及流变调节剂。例如,气相法二氧化硅。
用途
根据本发明的热固化和UV固化粘合剂组合物优选用于装配相机模块。更具体地,根据本发明的热固化和UV固化粘合剂组合物优选用于装配相机模块,以将透镜支架粘合至其上固定有图像传感器的基板。相机模块不受特别限制,并且例如是用于智能电话或其他此类设备的紧凑型相机模块。
实施例
比较实施例1至3和实施例1至3的粘合剂组合物通过以表1所示的组成比混合各组分而制备。更具体地,将其中溶解有粉末状的热固化剂、无机填料和光聚合引发剂的环氧丙烯酸酯和丙烯酸酯树脂很好地分散在三辊磨机中。将得到的混合物和其它添加剂等在行星式混合器中混合,并进一步进行真空脱气以获得粘合剂组合物。
如下评估每种物理性质。表1示出了评估结果。
固化Tg
将粘合剂组合物以300μm的厚度涂布在离型膜上,然后用365-nm的LED(2.5J/cm2)进行照射。之后,在80℃下在热风循环烘箱中固化60分钟。使用TMA(热机械分析仪)对获得的固化产物进行热分析,并测量其Tg。
对LCP(液晶聚合物)的粘合强度
图1示出了该过程。下文描述了详细细节。将量(重量)为约3.5mg的粘合剂组合物分配在陶瓷基板(15mm×15mm)上,以形成空心正方形(5mm×5mm)。之后,将LCP芯片(7mm×7mm)安装在其上,并将粘合剂的厚度调节为100μm。用365-nm LED从四个圆周方向(500mW/cm2×2秒)进行照射以临时固化。之后,通过在热风循环烘箱中在80℃下加热60分钟来固化样品,并使用粘合力测试仪(4000Optima,由Dage生产)在200μm/s的剪切速度和120μm的剪切高度下进行测量。
在85℃和85%RH的条件下进行了250小时的可靠性测试。
实施例1至3的粘合剂组合物通过UV辐射立即固化;当通过加热进一步固化时,固化Tg最终变为85℃或更高。在第一阶段及可靠性测试之后,粘合力极佳。据推测这是因为存在含伯胺和仲胺的多胺作为热固化剂,并且通过加热继续进行加成反应。
相比之下,在其中存在咪唑作为热固化剂的比较实施例1中,丙烯酸类树脂没有通过加热而固化,并且在第一阶段和可靠性测试之后粘合力不足。
随后,在比较实施例2中,整个树脂中(甲基)丙烯酰基的含量在环氧(甲基)丙烯酸酯树脂(a)中较低(10wt%),并且固化Tg也较低。
最后,在比较实施例3中,环氧(甲基)丙烯酸酯树脂(a)与(甲基)丙烯酸酯(b)的重量比((a)/(b))为8/92。由于环氧(甲基)丙烯酸酯树脂(a)的含量过少,因此在第一阶段和可靠性测试之后粘合力不足。
表1
Claims (6)
1.一种热固化和UV固化粘合剂组合物,其包括:
(a)环氧(甲基)丙烯酸酯树脂;
(b)(甲基)丙烯酸酯;
(c)热固化剂;以及
(d)光聚合引发剂,
其中所述环氧(甲基)丙烯酸酯树脂(a)包含,基于所述树脂的总重量,20重量%或更多的(甲基)丙烯酰基,并且
所述环氧(甲基)丙烯酸酯树脂(a)与所述(甲基)丙烯酸酯(b)的重量比((a)/(b))为30/70至70/30。
2.根据权利要求1所述的热固化和UV固化粘合剂组合物,其中所述(甲基)丙烯酸酯(b)是其均聚物的Tg为60℃或更高的(甲基)丙烯酸酯。
3.根据权利要求1或2所述的热固化和UV固化粘合剂组合物,其中所述环氧(甲基)丙烯酸酯树脂(a)是双酚A型环氧(甲基)丙烯酸酯树脂。
4.根据权利要求1至3中任一项所述的热固化和UV固化粘合剂组合物,其中所述热固化剂(c)为多胺。
5.根据权利要求1至4中任一项所述的热固化和UV固化粘合剂组合物,其还包括(e)无机填料。
6.根据权利要求1至5中任一项所述的热固化和UV固化粘合剂组合物在装配相机模块中的用途。
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JP7387400B2 (ja) * | 2019-11-15 | 2023-11-28 | ヘンケルジャパン株式会社 | Uv熱硬化型接着剤組成物 |
TW202219226A (zh) * | 2020-08-05 | 2022-05-16 | 德商漢高智慧財產控股公司 | 低反射率之雙固化黏著劑組合物 |
CN113480958B (zh) * | 2021-06-30 | 2022-12-09 | 顺德职业技术学院 | 汽车摄像头aa制程专用双重固化环氧胶及制备方法及应用 |
KR102606819B1 (ko) | 2021-11-10 | 2023-11-29 | 주식회사 아이델 | Uv 경화형 접착제로 접합한 방범시트의 제조방법 |
KR102569482B1 (ko) | 2021-11-22 | 2023-08-24 | 주식회사 아이델 | Uv 경화형 접착제 조성물 |
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EP3756049A1 (en) | 2020-12-30 |
WO2019163629A1 (en) | 2019-08-29 |
KR102629106B1 (ko) | 2024-01-24 |
KR20200123180A (ko) | 2020-10-28 |
US11111421B2 (en) | 2021-09-07 |
JP2019143038A (ja) | 2019-08-29 |
JP7146409B2 (ja) | 2022-10-04 |
US20200377770A1 (en) | 2020-12-03 |
TW201936820A (zh) | 2019-09-16 |
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