JP4499731B2 - 容量素子とその製造方法、及び半導体装置 - Google Patents
容量素子とその製造方法、及び半導体装置 Download PDFInfo
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- JP4499731B2 JP4499731B2 JP2006527680A JP2006527680A JP4499731B2 JP 4499731 B2 JP4499731 B2 JP 4499731B2 JP 2006527680 A JP2006527680 A JP 2006527680A JP 2006527680 A JP2006527680 A JP 2006527680A JP 4499731 B2 JP4499731 B2 JP 4499731B2
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- layer
- barrier layer
- capacitor
- capacitive element
- resin
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/924—Active solid-state devices, e.g. transistors, solid-state diodes with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/957—Making metal-insulator-metal device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
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Description
途中の断面図である。
ndom Access Memory)では、特許文献5に記載されるように、シリコン、チタン、及びアルミニウムのそれぞれの窒化物からなる保護膜を形成してキャパシタ誘電体層を保護している。
図4〜図7は、本発明の第1実施形態に係る容量素子の製造途中の断面図である。
部バリア層20には、上部電極16aが露出する第1開口20a、20bと、下部電極14aが露出する第2開口20cとが形成されることになる。
となる。
本実施形態は、第1実施形態と比較して下部バリア層13及び上部バリア層20を構成する材料のみが異なり、それ以外は第1実施形態と同じなので、第1実施形態の図4〜図7を参照して説明する。
図9は、本実施形態に係る半導体装置の断面図である。
図10は、本実施形態に係る半導体装置の断面図である。
ア層を形成するので、これらのバリア層によって外部からの水等がキャパシタ誘電体層に浸入するのが防がれて、キャパシタ誘電体層が劣化するのを防ぐことができる。
前記基材の上に形成された下部バリア層と、
前記下部バリア層の上に下部電極、キャパシタ誘電体層、及び上部電極を順に形成してなるキャパシタと、
少なくとも前記キャパシタ誘電体層と前記下部バリア層とを覆う上部バリア層と、
を有することを特徴とする容量素子。(1)
(付記2) 前記上部バリア層は、前記キャパシタ誘電体層と同じ材料で構成されることを特徴とする付記1に記載の容量素子。(2)
(付記3) 前記上部バリア層と前記キャパシタ誘電体層は、共にBST(BaxSr1-xTiO3)又はPZT(Pb(Zr,Ti)O3)により構成されることを特徴とする付記2に記載の容量素子。(3)
(付記4) 前記下部バリア層は、前記キャパシタ誘電体層と同じ材料で構成されることを特徴とする付記2に記載の容量素子。(4)
(付記5) 前記下部バリア層と前記上部バリア層の少なくとも一方は、非晶質金属酸化物材料、酸化シリコン、及び窒化シリコンのいずれかで構成されることを特徴とする付記1に記載の容量素子。
(付記7) 前記可撓性樹脂材料は、ポリイミド樹脂、エポキシ樹脂、ビスマレイド・トリアジン(BT)樹脂、ポリテトラフルオロエチレン(PTFE)樹脂、ベンゾシクロブテン(BCB)樹脂、アクリル樹脂、及びジアリルフタレート樹脂のいずれかであることを特徴とする付記6に記載の容量素子。
前記第1開口を通じて前記下部電極と電気的に接続される下部電極用引出しパッドと、
前記第2開口を通じて前記上部電極と電気的に接続される上部電極用引出しパッドとを更に備えたことを特徴とする付記1に記載の容量素子。
基材と、前記基材の上に形成された下部バリア層と、前記下部バリア層の上に下部電極、キャパシタ誘電体層、及び上部電極を順に形成してなるキャパシタと、少なくとも前記キャパシタ誘電体層と前記下部バリア層とを覆う上部バリア層とを有し、前記半導体素子の一方の面上に実装された容量素子と、
を有することを特徴とする半導体装置。(6)
(付記15) 前記容量素子が、前記半導体素子に対するデカップリングキャパシタとして機能することを特徴とする付記14に記載の半導体装置。
前記半導体素子の他方の面が前記ダイパッド上に固着され、前記半導体素子の一方の面のボンディングパッドと前記リードとが金属細線によってワイヤボンディングされると共に、少なくとも前記容量素子、前記半導体素子、及び前記金属細線が封止体によって封止されたことを特徴とする付記14に記載の半導体装置。
前記基材の上に下部バリア層を形成する工程と、
前記下部バリア層の上に、第1導電層、誘電体層、及び第2導電層を順に形成する工程と、
前記第1導電層、前記誘電体層、及び前記第2導電層をパターニングして、下部電極、キャパシタ誘電体層、及び上部電極で構成されるキャパシタを形成する工程と、
少なくとも前記キャパシタ誘電体層と前記下部バリア層とを覆う上部バリア層を形成する工程と、
前記上部バリア層を形成した後に、前記支持基板を除去する工程と、
を有することを特徴とする容量素子の製造方法。(7)
(付記18) 前記上部バリア層として、前記キャパシタ誘電体層と同じ材料の層を形成することを特徴とする付記17に記載の容量素子の製造方法。(8)
(付記19) 前記下部バリア層として、前記キャパシタ誘電体層と同じ材料の層を形成することを特徴とする付記17に記載の容量素子の製造方法。(9)
(付記20) 前記下部バリア層と前記上部バリア層の少なくとも一方として、非晶質金属酸化物材料、酸化シリコン、及び窒化シリコンのいずれかで構成されることを特徴とする付記17に記載の容量素子の製造方法。
前記支持基板を除去する工程において、フッ酸によって前記シリコン基板をエッチングして除去することを特徴とする付記17に記載の容量素子の製造方法。(10)
(付記24) 前記基材を形成する工程は、前記支持基板の上に樹脂を塗布し、該樹脂を熱硬化させて前記基材とすることにより行われることを特徴とする付記17に記載の容量素子の製造方法。
Claims (29)
- 基材と、
前記基材の上に形成された下部バリア層と、
前記下部バリア層の上に下部電極、キャパシタ誘電体層、及び上部電極を順に形成してなるキャパシタと、
少なくとも前記キャパシタ誘電体層と前記下部バリア層とを覆う上部バリア層とを有し、
前記下部電極が、前記下部バリア層上に形成されたTi-W合金層を有することを特徴とする容量素子。 - 前記上部バリア層は、前記キャパシタ誘電体層と同じ材料で構成されることを特徴とする請求項1に記載の容量素子。
- 前記上部バリア層と前記キャパシタ誘電体層は、共にBST(BaxSr1-xTiO3)又はPZT(Pb(Zr,Ti)O3)により構成されることを特徴とする請求項2に記載の容量素子。
- 前記下部バリア層は、前記キャパシタ誘電体層と同じ材料で構成されることを特徴とする請求項2に記載の容量素子。
- 前記下部バリア層と前記上部バリア層の少なくとも一方は、非晶質金属酸化物材料、酸化シリコン、及び窒化シリコンのいずれかで構成されることを特徴とする請求項1に記載の容量素子。
- 前記基材は可撓性樹脂材料で構成されることを特徴とする請求項1に記載の容量素子。
- 前記可撓性樹脂材料は、ポリイミド樹脂、エポキシ樹脂、ビスマレイド・トリアジン(BT)樹脂、ポリテトラフルオロエチレン(PTFE)樹脂、ベンゾシクロブテン(BCB)樹脂、アクリル樹脂、及びジアリルフタレート樹脂のいずれかであることを特徴とする請求項6に記載の容量素子。
- 前記基材はフィルム状であることを特徴とする請求項1に記載の容量素子。
- 前記基材、前記下部バリア層、前記キャパシタ、及び前記上部バリア層を合わせた高さが10μmよりも低いことを特徴とする請求項1に記載の容量素子。
- 前記上部バリア層の上に保護層が形成されたことを特徴とする請求項1に記載の容量素子。
- 前記キャパシタ誘電体層は、Sr、Ba、Pb、Zr、Bi、Ta、Ti、Mg、及びNbの少なくとも一つを含む複合酸化物であることを特徴とする請求項1に記載の容量素子。
- 前記下部電極と前記上部電極の少なくとも一方は、Au、Cr、Cu、W、Pt、Pd、Ru、Ru酸化物、Ir、Ir酸化物、及びPt酸化物のうちのいずれかで構成されることを特徴とする請求項1に記載の容量素子。
- 前記上部電極と前記下部電極の上の前記上部バリア層にそれぞれ第1、第2開口が形成され、
前記第1開口を通じて前記下部電極と電気的に接続される下部電極用引出しパッドと、
前記第2開口を通じて前記上部電極と電気的に接続される上部電極用引出しパッドとを更に備えたことを特徴とする請求項1に記載の容量素子。 - 前記下部電極は、前記下部バリア層と前記上部バリア層の双方に接触することを特徴とする請求項1に記載の容量素子。
- 半導体素子と、
基材と、前記基材の上に形成された下部バリア層と、前記下部バリア層の上に下部電極、キャパシタ誘電体層、及び上部電極を順に形成してなるキャパシタと、少なくとも前記キャパシタ誘電体層と前記下部バリア層とを覆う上部バリア層とを有し、前記半導体素子の一方の面上に実装された容量素子とを備え、
前記下部電極が、前記下部バリア層上に形成されたTi-W合金層を有することを特徴とする半導体装置。 - 前記容量素子が、前記半導体素子に対するデカップリングキャパシタとして機能することを特徴とする請求項15に記載の半導体装置。
- ダイパッド及びリードを有するリードフレームを備え、
前記半導体素子の他方の面が前記ダイパッド上に固着され、前記半導体素子の一方の面のボンディングパッドと前記リードとが金属細線によってワイヤボンディングされると共に、少なくとも前記容量素子、前記半導体素子、及び前記金属細線が封止体によって封止されたことを特徴とする請求項15に記載の半導体装置。 - 前記下部電極は、前記下部バリア層と前記上部バリア層の双方に接触することを特徴とする請求項15に記載の半導体装置。
- 支持基板の上に密着層を形成する工程と、
前記密着層の上に基材を形成する工程と、
前記基材の上に下部バリア層を形成する工程と、
前記下部バリア層の上に、第1導電層、誘電体層、及び第2導電層を順に形成する工程と、
前記第1導電層、前記誘電体層、及び前記第2導電層をパターニングして、下部電極、キャパシタ誘電体層、及び上部電極で構成されるキャパシタを形成する工程と、
少なくとも前記キャパシタ誘電体層と前記下部バリア層とを覆う上部バリア層を形成する工程と、
前記上部バリア層を形成した後に、前記支持基板を除去する工程と、
を有することを特徴とする容量素子の製造方法。 - 前記上部バリア層として、前記キャパシタ誘電体層と同じ材料の層を形成することを特徴とする請求項19に記載の容量素子の製造方法。
- 前記下部バリア層として、前記キャパシタ誘電体層と同じ材料の層を形成することを特徴とする請求項19に記載の容量素子の製造方法。
- 前記下部バリア層と前記上部バリア層の少なくとも一方として、非晶質金属酸化物材料、酸化シリコン、及び窒化シリコンのいずれかで構成されることを特徴とする請求項19に記載の容量素子の製造方法。
- 前記上部バリア層の上に保護層を形成する工程を有することを特徴とする請求項19に記載の容量素子の製造方法。
- 前記保護層としてポリイミド樹脂を含む層を形成することを特徴とする請求項23に記載の容量素子の製造方法。
- 前記支持基板としてシリコン基板を使用し、
前記支持基板を除去する工程において、フッ酸によって前記シリコン基板をエッチングして除去することを特徴とする請求項19に記載の容量素子の製造方法。 - 前記基材を形成する工程は、前記支持基板の上に樹脂を塗布し、該樹脂を熱硬化させて前記基材とすることにより行われることを特徴とする請求項19に記載の容量素子の製造方法。
- 前記樹脂として、ポリイミド樹脂、エポキシ樹脂、ビスマレイド・トリアジン(BT)樹脂、ポリテトラフルオロエチレン(PTFE)樹脂、ベンゾシクロブテン(BCB)樹脂、アクリル樹脂、及びジアリルフタレート樹脂のいずれかを採用することを特徴とする請求項26に記載の容量素子の製造方法。
- 前記密着層としてチタン層又は銅層を形成することを特徴とする請求項19に記載の容量素子の製造方法。
- 前記第1導電層を形成する工程は、下部バリア層の上に、基板バイアスを印加するDCスパッタ法によりTi-W合金層を形成する工程を含むことを特徴とする請求項19に記載の容量素子の製造方法。
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Also Published As
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US20080315358A1 (en) | 2008-12-25 |
JPWO2006008789A1 (ja) | 2008-05-01 |
WO2006008789A1 (ja) | 2006-01-26 |
US8264063B2 (en) | 2012-09-11 |
US7439199B2 (en) | 2008-10-21 |
US20070034989A1 (en) | 2007-02-15 |
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