JP4476073B2 - 有機ｅｌ素子の製造方法及び製造装置 - Google Patents

有機ｅｌ素子の製造方法及び製造装置 Download PDF

Info

Publication number
JP4476073B2
JP4476073B2 JP2004244848A JP2004244848A JP4476073B2 JP 4476073 B2 JP4476073 B2 JP 4476073B2 JP 2004244848 A JP2004244848 A JP 2004244848A JP 2004244848 A JP2004244848 A JP 2004244848A JP 4476073 B2 JP4476073 B2 JP 4476073B2
Authority
JP
Japan
Prior art keywords
film
organic
film thickness
layer
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004244848A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005322612A (ja
JP2005322612A5 (enExample
Inventor
博樹 丹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Pioneer Corp
Original Assignee
Tohoku Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Pioneer Corp filed Critical Tohoku Pioneer Corp
Priority to JP2004244848A priority Critical patent/JP4476073B2/ja
Priority to US11/100,503 priority patent/US7157306B2/en
Priority to KR1020050029410A priority patent/KR101157668B1/ko
Priority to TW094111186A priority patent/TWI381768B/zh
Priority to CNB2005100635087A priority patent/CN100452480C/zh
Publication of JP2005322612A publication Critical patent/JP2005322612A/ja
Publication of JP2005322612A5 publication Critical patent/JP2005322612A5/ja
Application granted granted Critical
Publication of JP4476073B2 publication Critical patent/JP4476073B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/18—Tiled displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10779—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyester
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10366—Reinforcements of the laminated safety glass or glazing against impact or intrusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B32B2037/1223—Hot-melt adhesive film-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
JP2004244848A 2004-04-08 2004-08-25 有機ｅｌ素子の製造方法及び製造装置 Expired - Fee Related JP4476073B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004244848A JP4476073B2 (ja) 2004-04-08 2004-08-25 有機ｅｌ素子の製造方法及び製造装置
US11/100,503 US7157306B2 (en) 2004-04-08 2005-04-07 Method of and system for manufacturing organic EL devices
KR1020050029410A KR101157668B1 (ko) 2004-04-08 2005-04-08 유기 ｅｌ 소자의 제조 방법 및 제조 장치
TW094111186A TWI381768B (zh) 2004-04-08 2005-04-08 有機ｅｌ元件的製造方法及製造裝置
CNB2005100635087A CN100452480C (zh) 2004-04-08 2005-04-08 有机el元件的制造方法及制造装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004114387 2004-04-08
JP2004244848A JP4476073B2 (ja) 2004-04-08 2004-08-25 有機ｅｌ素子の製造方法及び製造装置

Publications (3)

Publication Number Publication Date
JP2005322612A JP2005322612A (ja) 2005-11-17
JP2005322612A5 JP2005322612A5 (enExample) 2007-01-11
JP4476073B2 true JP4476073B2 (ja) 2010-06-09

Family

ID=35061060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004244848A Expired - Fee Related JP4476073B2 (ja) 2004-04-08 2004-08-25 有機ｅｌ素子の製造方法及び製造装置

Country Status (5)

Country Link
US (1) US7157306B2 (enExample)
JP (1) JP4476073B2 (enExample)
KR (1) KR101157668B1 (enExample)
CN (1) CN100452480C (enExample)
TW (1) TWI381768B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4511488B2 (ja) * 2006-03-31 2010-07-28 株式会社堀場製作所 有機ｅｌ素子の製造装置
TWI331213B (en) * 2005-11-29 2010-10-01 Horiba Ltd Sample analyzing method, sample analyzing apparatus,and recording medium
KR100807552B1 (ko) * 2006-06-01 2008-02-28 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그 제조방법
JP5127814B2 (ja) 2008-12-19 2013-01-23 キヤノン株式会社 有機発光素子及びそれを利用した発光装置、表示装置
CN102169094A (zh) * 2009-12-22 2011-08-31 株式会社日立高新技术 有机el显示器基板的点灯检查设备及其方法
JP2010118359A (ja) * 2010-02-18 2010-05-27 Horiba Ltd 有機ｅｌ素子の製造方法及び製造装置
KR20110096382A (ko) 2010-02-22 2011-08-30 삼성모바일디스플레이주식회사 유기 발광 디스플레이 패널의 증착 및 검사 장치와 그것을 이용한 증착 및 검사방법
JP2012238661A (ja) * 2011-05-10 2012-12-06 Ulvac Japan Ltd 有機薄膜太陽電池の成膜装置
JP2013251226A (ja) * 2012-06-04 2013-12-12 Panasonic Corp 表示パネルの製造方法
GB2515503A (en) * 2013-06-25 2014-12-31 Cambridge Display Tech Ltd Organic light emitting diode fabrication
JP6232880B2 (ja) * 2013-09-26 2017-11-22 日本精機株式会社 有機ｅｌパネルの製造装置及び有機ｅｌパネルの製造方法。
JP5848494B1 (ja) * 2015-02-02 2016-01-27 キヤノンアネルバ株式会社 垂直磁化型ｍｔｊ素子の製造方法
KR102436759B1 (ko) * 2017-10-24 2022-08-29 삼성디스플레이 주식회사 탈착층 성막시스템, 탈착층 성막방법, 탈착층을 포함하는 표시장치의 제조시스템 및 탈착층을 포함하는 표시장치의 제조방법
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
KR102042031B1 (ko) * 2019-03-21 2019-11-08 이재선 평판 디스플레이를 제조하기 위한 맞춤형 자동 공정 장치 및 방법
JP7291098B2 (ja) * 2020-03-31 2023-06-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
KR102527120B1 (ko) * 2020-03-31 2023-04-27 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법, 및 전자 디바이스의 제조 방법
JP7431088B2 (ja) * 2020-03-31 2024-02-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
JP7138673B2 (ja) * 2020-03-31 2022-09-16 キヤノントッキ株式会社 電子デバイスの製造方法、測定方法、及び、成膜装置
JP7329005B2 (ja) 2021-03-01 2023-08-17 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
JP7301896B2 (ja) * 2021-03-03 2023-07-03 キヤノントッキ株式会社 成膜装置、成膜装置の制御方法、および電子デバイスの製造方法
JP7722894B2 (ja) 2021-10-12 2025-08-13 キヤノントッキ株式会社 成膜装置
JP7535990B2 (ja) 2021-11-26 2024-08-19 キヤノントッキ株式会社 成膜装置、膜厚測定方法及び電子デバイスの製造方法
JP7535030B2 (ja) 2021-11-26 2024-08-15 キヤノントッキ株式会社 成膜装置、膜厚測定方法及び電子デバイスの製造方法
JP2024073943A (ja) 2022-11-18 2024-05-30 キヤノントッキ株式会社 成膜装置及び成膜方法
CN117080205A (zh) * 2023-06-20 2023-11-17 京东方科技集团股份有限公司 显示基板、掩膜版以及蒸镀系统

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW320687B (enExample) * 1996-04-01 1997-11-21 Toray Industries
JPH10214682A (ja) * 1997-01-30 1998-08-11 Mitsubishi Chem Corp 有機電界発光素子の製造装置及び製造方法
JPH10255972A (ja) * 1997-03-10 1998-09-25 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法およびその製造装置
JPH10270164A (ja) * 1997-03-26 1998-10-09 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法およびその製造装置
TW463528B (en) * 1999-04-05 2001-11-11 Idemitsu Kosan Co Organic electroluminescence element and their preparation
JP2000294372A (ja) 1999-04-09 2000-10-20 Pioneer Electronic Corp 有機材料膜の成膜方法、有機ｅｌ素子の製造方法および製造装置
JP2000353593A (ja) * 1999-06-08 2000-12-19 Fuji Electric Co Ltd 有機エレクトロルミネッセンスディスプレイパネルの製造装置および製造方法
WO2001072091A1 (en) * 2000-03-22 2001-09-27 Idemitsu Kosan Co., Ltd. Method and apparatus for manufacturing organic el display
JP2001279429A (ja) * 2000-03-30 2001-10-10 Idemitsu Kosan Co Ltd 素子用薄膜層の成膜方法及び有機エレクトロルミネッセンス素子
JP4372957B2 (ja) 2000-04-07 2009-11-25 東北パイオニア株式会社 有機ｅｌ素子の製造方法及び製造装置
JP2002367787A (ja) * 2001-06-05 2002-12-20 Tohoku Pioneer Corp 有機ｅｌ表示装置及びその製造方法
CN100350645C (zh) * 2001-06-14 2007-11-21 三星宝石工业株式会社 一种有机el显示器制造装置和一种有机el显示器制造方法
JP2003109775A (ja) * 2001-09-28 2003-04-11 Sony Corp 有機電界発光素子
JP2003183836A (ja) * 2001-12-11 2003-07-03 Konica Corp 大気圧プラズマ放電薄膜形成方法、光学フィルム、反射防止フィルム及び画像表示素子
JP4449293B2 (ja) * 2001-12-19 2010-04-14 株式会社ニコン 成膜装置、及び光学部材の製造方法
JP2004055461A (ja) * 2002-07-23 2004-02-19 Seiko Epson Corp 発光装置及びその製造方法、並びに電子機器
JP2004079421A (ja) * 2002-08-21 2004-03-11 Tdk Corp 有機ｅｌ素子
TW556447B (en) * 2002-09-05 2003-10-01 Au Optronics Corp An organic light emitting diode
US6936961B2 (en) * 2003-05-13 2005-08-30 Eastman Kodak Company Cascaded organic electroluminescent device having connecting units with N-type and P-type organic layers
US7268485B2 (en) * 2003-10-07 2007-09-11 Eastman Kodak Company White-emitting microcavity OLED device

Also Published As

Publication number Publication date
TWI381768B (zh) 2013-01-01
KR20060046645A (ko) 2006-05-17
CN100452480C (zh) 2009-01-14
KR101157668B1 (ko) 2012-06-20
US7157306B2 (en) 2007-01-02
JP2005322612A (ja) 2005-11-17
US20050227385A1 (en) 2005-10-13
TW200534743A (en) 2005-10-16
CN1681362A (zh) 2005-10-12

Similar Documents

Publication Publication Date Title
JP4476073B2 (ja) 有機ｅｌ素子の製造方法及び製造装置
TWI389315B (zh) 製作薄膜電子元件的線上製程
US7355341B2 (en) Organic electroluminescence display panel including a gas barrier laminate between a substrate and an organic electroluminescence element
US8638032B2 (en) Organic optoelectronic device coated with a multilayer encapsulation structure and a method for encapsulating said device
US8628982B2 (en) Method of depositing and inspecting an organic light emitting display panel
US20110042702A1 (en) Organic Light Emitting Device and Method for Manufacturing the Same
US10233528B2 (en) Mask for deposition system and method for using the mask
JP2009301768A (ja) 電子デバイス装置の製造方法、および電子デバイス装置の製造装置
CN100446294C (zh) 有机电致发光显示板及其制造方法
WO2002104078A1 (fr) Dispositif et procede de fabrication d'un ecran electroluminescent organique
JP7296204B2 (ja) 成膜装置、有機デバイスの製造装置および有機デバイスの製造方法
KR102544596B1 (ko) 전자 디바이스의 제조 방법, 측정 방법 및 성막 장치
JP2004009665A (ja) バリア膜付き光学フィルムシートおよびこれを用いた表示素子
US7416463B2 (en) Panel substrate, display panel, organic EL panel, and method of manufacturing the same
CN1828976A (zh) 自发光元件的制造方法和制造装置
US7632704B2 (en) Manufacturing method for organic electronic element and manufacturing apparatus therefor
JP4706394B2 (ja) 有機エレクトロルミネッセンス素子の製造方法
KR20150004525A (ko) 패시베이션용 적층 구조물
Shin OLED encapsulation technology
KR101189774B1 (ko) 보호 캡 합착 공정 라인
KR20250147351A (ko) 실시간 측정기용 교정 지그
KR20160076837A (ko) 투명 가스 배리어성 필름 및 이를 제조하는 방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061117

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061117

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091015

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091030

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091211

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100223

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100309

R150 Certificate of patent or registration of utility model

Ref document number: 4476073

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130319

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140319

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees