CN100452480C - 有机el元件的制造方法及制造装置 - Google Patents

有机el元件的制造方法及制造装置 Download PDF

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Publication number
CN100452480C
CN100452480C CNB2005100635087A CN200510063508A CN100452480C CN 100452480 C CN100452480 C CN 100452480C CN B2005100635087 A CNB2005100635087 A CN B2005100635087A CN 200510063508 A CN200510063508 A CN 200510063508A CN 100452480 C CN100452480 C CN 100452480C
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China
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organic
film
organic layer
layer
thickness
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Expired - Fee Related
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CNB2005100635087A
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English (en)
Chinese (zh)
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CN1681362A (zh
Inventor
丹博树
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Tohoku Pioneer Corp
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Nippon Tokita Pioneer K K
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Publication of CN1681362A publication Critical patent/CN1681362A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/18—Tiled displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10779—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyester
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10366—Reinforcements of the laminated safety glass or glazing against impact or intrusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B32B2037/1223—Hot-melt adhesive film-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
CNB2005100635087A 2004-04-08 2005-04-08 有机el元件的制造方法及制造装置 Expired - Fee Related CN100452480C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004114387 2004-04-08
JP2004114387 2004-04-08
JP2004244848A JP4476073B2 (ja) 2004-04-08 2004-08-25 有機ｅｌ素子の製造方法及び製造装置
JP2004244848 2004-08-25

Publications (2)

Publication Number Publication Date
CN1681362A CN1681362A (zh) 2005-10-12
CN100452480C true CN100452480C (zh) 2009-01-14

Family

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Family Applications (1)

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CNB2005100635087A Expired - Fee Related CN100452480C (zh) 2004-04-08 2005-04-08 有机el元件的制造方法及制造装置

Country Status (5)

Country Link
US (1) US7157306B2 (enExample)
JP (1) JP4476073B2 (enExample)
KR (1) KR101157668B1 (enExample)
CN (1) CN100452480C (enExample)
TW (1) TWI381768B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4511488B2 (ja) * 2006-03-31 2010-07-28 株式会社堀場製作所 有機ｅｌ素子の製造装置
TWI331213B (en) * 2005-11-29 2010-10-01 Horiba Ltd Sample analyzing method, sample analyzing apparatus,and recording medium
KR100807552B1 (ko) * 2006-06-01 2008-02-28 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그 제조방법
JP5127814B2 (ja) 2008-12-19 2013-01-23 キヤノン株式会社 有機発光素子及びそれを利用した発光装置、表示装置
CN102169094A (zh) * 2009-12-22 2011-08-31 株式会社日立高新技术 有机el显示器基板的点灯检查设备及其方法
JP2010118359A (ja) * 2010-02-18 2010-05-27 Horiba Ltd 有機ｅｌ素子の製造方法及び製造装置
KR20110096382A (ko) 2010-02-22 2011-08-30 삼성모바일디스플레이주식회사 유기 발광 디스플레이 패널의 증착 및 검사 장치와 그것을 이용한 증착 및 검사방법
JP2012238661A (ja) * 2011-05-10 2012-12-06 Ulvac Japan Ltd 有機薄膜太陽電池の成膜装置
JP2013251226A (ja) * 2012-06-04 2013-12-12 Panasonic Corp 表示パネルの製造方法
GB2515503A (en) * 2013-06-25 2014-12-31 Cambridge Display Tech Ltd Organic light emitting diode fabrication
JP6232880B2 (ja) * 2013-09-26 2017-11-22 日本精機株式会社 有機ｅｌパネルの製造装置及び有機ｅｌパネルの製造方法。
JP5848494B1 (ja) * 2015-02-02 2016-01-27 キヤノンアネルバ株式会社 垂直磁化型ｍｔｊ素子の製造方法
KR102436759B1 (ko) * 2017-10-24 2022-08-29 삼성디스플레이 주식회사 탈착층 성막시스템, 탈착층 성막방법, 탈착층을 포함하는 표시장치의 제조시스템 및 탈착층을 포함하는 표시장치의 제조방법
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
KR102042031B1 (ko) * 2019-03-21 2019-11-08 이재선 평판 디스플레이를 제조하기 위한 맞춤형 자동 공정 장치 및 방법
JP7291098B2 (ja) * 2020-03-31 2023-06-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
KR102527120B1 (ko) * 2020-03-31 2023-04-27 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법, 및 전자 디바이스의 제조 방법
JP7431088B2 (ja) * 2020-03-31 2024-02-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
JP7138673B2 (ja) * 2020-03-31 2022-09-16 キヤノントッキ株式会社 電子デバイスの製造方法、測定方法、及び、成膜装置
JP7329005B2 (ja) 2021-03-01 2023-08-17 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
JP7301896B2 (ja) * 2021-03-03 2023-07-03 キヤノントッキ株式会社 成膜装置、成膜装置の制御方法、および電子デバイスの製造方法
JP7722894B2 (ja) 2021-10-12 2025-08-13 キヤノントッキ株式会社 成膜装置
JP7535990B2 (ja) 2021-11-26 2024-08-19 キヤノントッキ株式会社 成膜装置、膜厚測定方法及び電子デバイスの製造方法
JP7535030B2 (ja) 2021-11-26 2024-08-15 キヤノントッキ株式会社 成膜装置、膜厚測定方法及び電子デバイスの製造方法
JP2024073943A (ja) 2022-11-18 2024-05-30 キヤノントッキ株式会社 成膜装置及び成膜方法
CN117080205A (zh) * 2023-06-20 2023-11-17 京东方科技集团股份有限公司 显示基板、掩膜版以及蒸镀系统

Citations (9)

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Publication number Priority date Publication date Assignee Title
JPH10214682A (ja) * 1997-01-30 1998-08-11 Mitsubishi Chem Corp 有機電界発光素子の製造装置及び製造方法
JPH10255972A (ja) * 1997-03-10 1998-09-25 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法およびその製造装置
JPH10270164A (ja) * 1997-03-26 1998-10-09 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法およびその製造装置
JP2000294372A (ja) * 1999-04-09 2000-10-20 Pioneer Electronic Corp 有機材料膜の成膜方法、有機ｅｌ素子の製造方法および製造装置
JP2000353593A (ja) * 1999-06-08 2000-12-19 Fuji Electric Co Ltd 有機エレクトロルミネッセンスディスプレイパネルの製造装置および製造方法
JP2001291585A (ja) * 2000-04-07 2001-10-19 Tohoku Pioneer Corp 有機ｅｌ素子の製造方法及び製造装置
CN1365595A (zh) * 2000-03-22 2002-08-21 出光兴产株式会社 有机el显示装置的制造装置以及使用其制造有机el显示装置的方法
WO2002104079A1 (fr) * 2001-06-14 2002-12-27 Mitsuboshi Diamond Industrial Co., Ltd. Appareil de production permettant un affichage el organique et procede de production de cet affichage el organique
CN1477911A (zh) * 2002-07-23 2004-02-25 ������������ʽ���� 发光装置及其制造方法以及电子仪器

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TW320687B (enExample) * 1996-04-01 1997-11-21 Toray Industries
TW463528B (en) * 1999-04-05 2001-11-11 Idemitsu Kosan Co Organic electroluminescence element and their preparation
JP2001279429A (ja) * 2000-03-30 2001-10-10 Idemitsu Kosan Co Ltd 素子用薄膜層の成膜方法及び有機エレクトロルミネッセンス素子
JP2002367787A (ja) * 2001-06-05 2002-12-20 Tohoku Pioneer Corp 有機ｅｌ表示装置及びその製造方法
JP2003109775A (ja) * 2001-09-28 2003-04-11 Sony Corp 有機電界発光素子
JP2003183836A (ja) * 2001-12-11 2003-07-03 Konica Corp 大気圧プラズマ放電薄膜形成方法、光学フィルム、反射防止フィルム及び画像表示素子
JP4449293B2 (ja) * 2001-12-19 2010-04-14 株式会社ニコン 成膜装置、及び光学部材の製造方法
JP2004079421A (ja) * 2002-08-21 2004-03-11 Tdk Corp 有機ｅｌ素子
TW556447B (en) * 2002-09-05 2003-10-01 Au Optronics Corp An organic light emitting diode
US6936961B2 (en) * 2003-05-13 2005-08-30 Eastman Kodak Company Cascaded organic electroluminescent device having connecting units with N-type and P-type organic layers
US7268485B2 (en) * 2003-10-07 2007-09-11 Eastman Kodak Company White-emitting microcavity OLED device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10214682A (ja) * 1997-01-30 1998-08-11 Mitsubishi Chem Corp 有機電界発光素子の製造装置及び製造方法
JPH10255972A (ja) * 1997-03-10 1998-09-25 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法およびその製造装置
JPH10270164A (ja) * 1997-03-26 1998-10-09 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法およびその製造装置
JP2000294372A (ja) * 1999-04-09 2000-10-20 Pioneer Electronic Corp 有機材料膜の成膜方法、有機ｅｌ素子の製造方法および製造装置
JP2000353593A (ja) * 1999-06-08 2000-12-19 Fuji Electric Co Ltd 有機エレクトロルミネッセンスディスプレイパネルの製造装置および製造方法
CN1365595A (zh) * 2000-03-22 2002-08-21 出光兴产株式会社 有机el显示装置的制造装置以及使用其制造有机el显示装置的方法
JP2001291585A (ja) * 2000-04-07 2001-10-19 Tohoku Pioneer Corp 有機ｅｌ素子の製造方法及び製造装置
WO2002104079A1 (fr) * 2001-06-14 2002-12-27 Mitsuboshi Diamond Industrial Co., Ltd. Appareil de production permettant un affichage el organique et procede de production de cet affichage el organique
CN1477911A (zh) * 2002-07-23 2004-02-25 ������������ʽ���� 发光装置及其制造方法以及电子仪器

Also Published As

Publication number Publication date
JP4476073B2 (ja) 2010-06-09
TWI381768B (zh) 2013-01-01
KR20060046645A (ko) 2006-05-17
KR101157668B1 (ko) 2012-06-20
US7157306B2 (en) 2007-01-02
JP2005322612A (ja) 2005-11-17
US20050227385A1 (en) 2005-10-13
TW200534743A (en) 2005-10-16
CN1681362A (zh) 2005-10-12

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Owner name: TOHOKU PIONEER CORPORATION

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Address after: Yamagata Prefecture, Japan

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