TWI381768B - 有機ｅｌ元件的製造方法及製造裝置 - Google Patents

有機ｅｌ元件的製造方法及製造裝置 Download PDF

Info

Publication number
TWI381768B
TWI381768B TW094111186A TW94111186A TWI381768B TW I381768 B TWI381768 B TW I381768B TW 094111186 A TW094111186 A TW 094111186A TW 94111186 A TW94111186 A TW 94111186A TW I381768 B TWI381768 B TW I381768B
Authority
TW
Taiwan
Prior art keywords
organic
layer
film thickness
film
inspection
Prior art date
Application number
TW094111186A
Other languages
English (en)
Chinese (zh)
Other versions
TW200534743A (en
Inventor
丹博樹
Original Assignee
日本東北先鋒股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本東北先鋒股份有限公司 filed Critical 日本東北先鋒股份有限公司
Publication of TW200534743A publication Critical patent/TW200534743A/zh
Application granted granted Critical
Publication of TWI381768B publication Critical patent/TWI381768B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/18—Tiled displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10779—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyester
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10366—Reinforcements of the laminated safety glass or glazing against impact or intrusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B32B2037/1223—Hot-melt adhesive film-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
TW094111186A 2004-04-08 2005-04-08 有機ｅｌ元件的製造方法及製造裝置 TWI381768B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004114387 2004-04-08
JP2004244848A JP4476073B2 (ja) 2004-04-08 2004-08-25 有機ｅｌ素子の製造方法及び製造装置

Publications (2)

Publication Number Publication Date
TW200534743A TW200534743A (en) 2005-10-16
TWI381768B true TWI381768B (zh) 2013-01-01

Family

ID=35061060

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094111186A TWI381768B (zh) 2004-04-08 2005-04-08 有機ｅｌ元件的製造方法及製造裝置

Country Status (5)

Country Link
US (1) US7157306B2 (enExample)
JP (1) JP4476073B2 (enExample)
KR (1) KR101157668B1 (enExample)
CN (1) CN100452480C (enExample)
TW (1) TWI381768B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4511488B2 (ja) * 2006-03-31 2010-07-28 株式会社堀場製作所 有機ｅｌ素子の製造装置
TWI331213B (en) * 2005-11-29 2010-10-01 Horiba Ltd Sample analyzing method, sample analyzing apparatus,and recording medium
KR100807552B1 (ko) * 2006-06-01 2008-02-28 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그 제조방법
JP5127814B2 (ja) 2008-12-19 2013-01-23 キヤノン株式会社 有機発光素子及びそれを利用した発光装置、表示装置
CN102169094A (zh) * 2009-12-22 2011-08-31 株式会社日立高新技术 有机el显示器基板的点灯检查设备及其方法
JP2010118359A (ja) * 2010-02-18 2010-05-27 Horiba Ltd 有機ｅｌ素子の製造方法及び製造装置
KR20110096382A (ko) 2010-02-22 2011-08-30 삼성모바일디스플레이주식회사 유기 발광 디스플레이 패널의 증착 및 검사 장치와 그것을 이용한 증착 및 검사방법
JP2012238661A (ja) * 2011-05-10 2012-12-06 Ulvac Japan Ltd 有機薄膜太陽電池の成膜装置
JP2013251226A (ja) * 2012-06-04 2013-12-12 Panasonic Corp 表示パネルの製造方法
GB2515503A (en) * 2013-06-25 2014-12-31 Cambridge Display Tech Ltd Organic light emitting diode fabrication
JP6232880B2 (ja) * 2013-09-26 2017-11-22 日本精機株式会社 有機ｅｌパネルの製造装置及び有機ｅｌパネルの製造方法。
JP5848494B1 (ja) * 2015-02-02 2016-01-27 キヤノンアネルバ株式会社 垂直磁化型ｍｔｊ素子の製造方法
KR102436759B1 (ko) * 2017-10-24 2022-08-29 삼성디스플레이 주식회사 탈착층 성막시스템, 탈착층 성막방법, 탈착층을 포함하는 표시장치의 제조시스템 및 탈착층을 포함하는 표시장치의 제조방법
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
KR102042031B1 (ko) * 2019-03-21 2019-11-08 이재선 평판 디스플레이를 제조하기 위한 맞춤형 자동 공정 장치 및 방법
JP7291098B2 (ja) * 2020-03-31 2023-06-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
KR102527120B1 (ko) * 2020-03-31 2023-04-27 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법, 및 전자 디바이스의 제조 방법
JP7431088B2 (ja) * 2020-03-31 2024-02-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
JP7138673B2 (ja) * 2020-03-31 2022-09-16 キヤノントッキ株式会社 電子デバイスの製造方法、測定方法、及び、成膜装置
JP7329005B2 (ja) 2021-03-01 2023-08-17 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法
JP7301896B2 (ja) * 2021-03-03 2023-07-03 キヤノントッキ株式会社 成膜装置、成膜装置の制御方法、および電子デバイスの製造方法
JP7722894B2 (ja) 2021-10-12 2025-08-13 キヤノントッキ株式会社 成膜装置
JP7535990B2 (ja) 2021-11-26 2024-08-19 キヤノントッキ株式会社 成膜装置、膜厚測定方法及び電子デバイスの製造方法
JP7535030B2 (ja) 2021-11-26 2024-08-15 キヤノントッキ株式会社 成膜装置、膜厚測定方法及び電子デバイスの製造方法
JP2024073943A (ja) 2022-11-18 2024-05-30 キヤノントッキ株式会社 成膜装置及び成膜方法
CN117080205A (zh) * 2023-06-20 2023-11-17 京东方科技集团股份有限公司 显示基板、掩膜版以及蒸镀系统

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW320687B (enExample) * 1996-04-01 1997-11-21 Toray Industries
JP2001291585A (ja) * 2000-04-07 2001-10-19 Tohoku Pioneer Corp 有機ｅｌ素子の製造方法及び製造装置
TW463528B (en) * 1999-04-05 2001-11-11 Idemitsu Kosan Co Organic electroluminescence element and their preparation
JP2003183836A (ja) * 2001-12-11 2003-07-03 Konica Corp 大気圧プラズマ放電薄膜形成方法、光学フィルム、反射防止フィルム及び画像表示素子
TW541856B (en) * 2001-06-05 2003-07-11 Pioneer Tohoku Corp Organic electro-luminescent display apparatus and method for manufacturing the same
JP2003247068A (ja) * 2001-12-19 2003-09-05 Nikon Corp 成膜装置、及び光学部材の製造方法
TW557639B (en) * 2001-09-28 2003-10-11 Sony Corp Organic electroluminescent element
US20040046494A1 (en) * 2002-09-05 2004-03-11 Hsiao-Ping Lai Organic light emitting diode
JP2004079421A (ja) * 2002-08-21 2004-03-11 Tdk Corp 有機ｅｌ素子
TW580844B (en) * 2000-03-30 2004-03-21 Idemitsu Kosan Co Method for forming thin-film layer for device and organic electroluminescence device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10214682A (ja) * 1997-01-30 1998-08-11 Mitsubishi Chem Corp 有機電界発光素子の製造装置及び製造方法
JPH10255972A (ja) * 1997-03-10 1998-09-25 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法およびその製造装置
JPH10270164A (ja) * 1997-03-26 1998-10-09 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法およびその製造装置
JP2000294372A (ja) 1999-04-09 2000-10-20 Pioneer Electronic Corp 有機材料膜の成膜方法、有機ｅｌ素子の製造方法および製造装置
JP2000353593A (ja) * 1999-06-08 2000-12-19 Fuji Electric Co Ltd 有機エレクトロルミネッセンスディスプレイパネルの製造装置および製造方法
WO2001072091A1 (en) * 2000-03-22 2001-09-27 Idemitsu Kosan Co., Ltd. Method and apparatus for manufacturing organic el display
CN100350645C (zh) * 2001-06-14 2007-11-21 三星宝石工业株式会社 一种有机el显示器制造装置和一种有机el显示器制造方法
JP2004055461A (ja) * 2002-07-23 2004-02-19 Seiko Epson Corp 発光装置及びその製造方法、並びに電子機器
US6936961B2 (en) * 2003-05-13 2005-08-30 Eastman Kodak Company Cascaded organic electroluminescent device having connecting units with N-type and P-type organic layers
US7268485B2 (en) * 2003-10-07 2007-09-11 Eastman Kodak Company White-emitting microcavity OLED device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW320687B (enExample) * 1996-04-01 1997-11-21 Toray Industries
TW463528B (en) * 1999-04-05 2001-11-11 Idemitsu Kosan Co Organic electroluminescence element and their preparation
TW580844B (en) * 2000-03-30 2004-03-21 Idemitsu Kosan Co Method for forming thin-film layer for device and organic electroluminescence device
JP2001291585A (ja) * 2000-04-07 2001-10-19 Tohoku Pioneer Corp 有機ｅｌ素子の製造方法及び製造装置
TW541856B (en) * 2001-06-05 2003-07-11 Pioneer Tohoku Corp Organic electro-luminescent display apparatus and method for manufacturing the same
TW557639B (en) * 2001-09-28 2003-10-11 Sony Corp Organic electroluminescent element
JP2003183836A (ja) * 2001-12-11 2003-07-03 Konica Corp 大気圧プラズマ放電薄膜形成方法、光学フィルム、反射防止フィルム及び画像表示素子
JP2003247068A (ja) * 2001-12-19 2003-09-05 Nikon Corp 成膜装置、及び光学部材の製造方法
JP2004079421A (ja) * 2002-08-21 2004-03-11 Tdk Corp 有機ｅｌ素子
US20040046494A1 (en) * 2002-09-05 2004-03-11 Hsiao-Ping Lai Organic light emitting diode

Also Published As

Publication number Publication date
JP4476073B2 (ja) 2010-06-09
KR20060046645A (ko) 2006-05-17
CN100452480C (zh) 2009-01-14
KR101157668B1 (ko) 2012-06-20
US7157306B2 (en) 2007-01-02
JP2005322612A (ja) 2005-11-17
US20050227385A1 (en) 2005-10-13
TW200534743A (en) 2005-10-16
CN1681362A (zh) 2005-10-12

Similar Documents

Publication Publication Date Title
TWI381768B (zh) 有機ｅｌ元件的製造方法及製造裝置
CN100487948C (zh) 测定沉积膜厚度的方法及装置和形成材料层的方法及装置
US8628982B2 (en) Method of depositing and inspecting an organic light emitting display panel
CN107735507B (zh) 用于沉积系统的掩模和使用掩模的方法
US7688446B2 (en) Sample analyzing method, sample analyzing apparatus, manufacturing method of organic EL element, manufacturing equipment, and recording medium
WO2002104078A1 (fr) Dispositif et procede de fabrication d'un ecran electroluminescent organique
JP2009301768A (ja) 電子デバイス装置の製造方法、および電子デバイス装置の製造装置
WO2002104079A1 (fr) Appareil de production permettant un affichage el organique et procede de production de cet affichage el organique
CN115011929B (zh) 成膜装置、成膜装置的控制方法以及电子器件的制造方法
KR102776952B1 (ko) 성막 장치, 성막 방법, 및 전자 디바이스의 제조 방법
JP2004237655A (ja) 交互積層防湿膜、その製造方法及び透明電極板付きの交互積層防湿膜
US7750562B2 (en) Organic light emitting apparatus
KR20210122176A (ko) 전자 디바이스의 제조 방법, 측정 방법 및 성막 장치
GB2515503A (en) Organic light emitting diode fabrication
KR20060061662A (ko) 유기발광 다이오드 표시소자의 다층 증착막 두께 검사용메탈 마스크 및 방법
JP2004303631A (ja) 有機ｅｌディスプレイ、有機ｅｌディスプレイの製造方法および製造装置
WO2013024769A1 (ja) 成膜装置及び成膜方法
KR100793367B1 (ko) 가열로, 그를 포함하는 가열장치 및 그를 이용한유기전계발광소자의 제조방법
WO2012077659A1 (ja) 表示デバイス製造装置、表示デバイスの製造方法、及び表示デバイス
Shin OLED encapsulation technology
JP2010118359A (ja) 有機ｅｌ素子の製造方法及び製造装置
JP2024162788A (ja) 製造方法、成膜装置及び成膜方法
WO2012014881A1 (ja) 基板処理装置および基板処理方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees