JP4460015B2 - 半導体装置の梱包構造、および半導体装置の梱包方法 - Google Patents
半導体装置の梱包構造、および半導体装置の梱包方法 Download PDFInfo
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Description
(TABテープの構成)
図1は、TABテープ100の一構成例を示す、(a)は上面図であり、(b)は側面図である。
(エンボステープの構成)
図2は、エンボステープ200の一構成例を示す、(a)は上面図であり、(b)は側面図である。
(梱包用の部材)
TABテープ100が出荷・搬送用の梱包形態となるために、いくつかの部材(副資材)が用いられる。ここでは、代表的なものについて説明する。
(TABテープの梱包方法および梱包構造)
次に、図1に示したTABテープ100を、図2に示したエンボステープ200とともに図9に示したリール310に巻き付けて、出荷・搬送用の梱包形態にするまでの処理フローについて説明する。
図2に示したエンボステープ200(フィルム201の厚み:0.125mm)の総厚に応じて、図1に示したTABテープ100(フィルム101の厚み:0.04mm、半導体チップ103の厚み:0.625mm)を、φ405mmサイズのリール310にどれくらいの長さを巻き取ることができるのかを検証した。
(実施例2)
TABテープ100とエンボステープ200とを重ね合わせて巻き付けた場合、図19に示すように、半導体チップ103とエンボステープ200との間に隙間gを形成させている。しかし、TABテープ100やエンボステープ200の反りによって、図20に示すように、半導体チップ103とエンボステープ200とが接触し、エンボステープ200に擦れ傷が転写する場合がある。
101 フィルム(絶縁フィルム)
102 配線パターン
103 半導体チップ
200,210,220,230,240 エンボステープ
201 フィルム(導電フィルム)
202 エンボス部(突起部)
211,212,221,222,231,232,241 エンボス部(突起部)
242 材質表示部
310 リール
311 中芯部
320 帯電防止袋(袋)
330 内装ケース(第1の箱)
340 外装ケース(第2の箱)
Claims (9)
- 配線パターンが繰り返し形成されたテープ状の絶縁フィルム上に、上記各配線パターンと電気的に接続するように固着された複数の半導体チップを有する半導体装置と、テープ状の導電フィルムの片面側であって、かつ長尺方向に連続的に形成された突起部を有する導電性のエンボステープと、が導電性のリールに巻き付けられた半導体装置の梱包構造において、
上記半導体装置および上記エンボステープは、上記絶縁フィルムの上記半導体チップが固着されている側の面と上記導電フィルムの上記突起部が突出している側の面とが向かい合うように重ね合わせられながら上記リールに巻き付けられており、
上記半導体チップの厚みがt(0.2≦t≦0.625)mmであり、かつ上記導電フィルムの厚みが略0.125mmであるときに、上記エンボステープの総厚は、(t+0.4)mm以上かつ1.1mm以下であり、
上記絶縁フィルムの上記半導体チップが固着されている側の面と反対側の面と、上記導電フィルムの上記突起部が突出している側の面と反対側の面との間は、摩擦係数が0.3以上かつ0.5以下に設定されており、
上記絶縁フィルムの上記半導体チップが固着されている側の面と、上記突起部の表面との間は、摩擦係数が0.3以下に設定されていることを特徴とする半導体装置の梱包構造。 - 上記絶縁フィルムの上記半導体チップが固着されている側の面と反対側の面と、上記導電フィルムの上記突起部が突出している側の面と反対側の面とは、80パーセント以上の面積が密着していることを特徴とする請求項1に記載の半導体装置の梱包構造。
- 上記エンボステープの表面抵抗値は、106Ω以上かつ109Ω以下であることを特徴とする請求項1に記載の半導体装置の梱包構造。
- 上記エンボステープは、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリイミド、ポリエーテルイミド、ポリスルフォン、ポリエチレン、ポリプロピレン、ポリアミド、またはポリエーテルスルフィンの樹脂からなることを特徴とする請求項1に記載の半導体装置の梱包構造。
- 上記突起部は、上記エンボステープの長尺方向における長さが20mmの範囲内で、1.5個以上かつ3個以下設けられていることを特徴とする請求項1に記載の半導体装置の梱包構造。
- 上記半導体装置および上記エンボステープが巻き付けられた上記リールが入れられる帯電防止用または防湿用の袋と、
上記リールが入れられた袋が収められる第1の箱と、
上記第1の箱が複数収められる、上記第1の箱よりも大きいサイズの第2の箱とを備えていることを特徴とする請求項1に記載の半導体装置の梱包構造。 - 配線パターンが繰り返し形成されたテープ状の絶縁フィルム上に、上記各配線パターンと電気的に接続するように固着された複数の半導体チップを有する半導体装置と、テープ状の導電フィルムの片面側であって、かつ長尺方向に連続的に形成された突起部を有する導電性のエンボステープと、を導電性のリールに巻き付ける半導体装置の梱包方法において、
上記半導体装置および上記エンボステープを、上記絶縁フィルムの上記半導体チップが固着されている側の面と上記導電フィルムの上記突起部が突出している側の面とが向かい合うように重ね合わせながら上記リールに巻き付ける第1のステップを含み、
上記エンボステープとして、上記半導体チップの厚みがt(0.2≦t≦0.625)mmであり、かつ上記導電フィルムの厚みが略0.125mmであるときに、上記エンボステープの総厚が、(t+0.4)mm以上かつ1.1mm以下であるものを用い、
上記絶縁フィルムの上記半導体チップが固着されている側の面と反対側の面と、上記導電フィルムの上記突起部が突出している側の面と反対側の面との間は、摩擦係数が0.3以上かつ0.5以下に設定されており、
上記絶縁フィルムの上記半導体チップが固着されている側の面と、上記突起部の表面との間は、摩擦係数が0.3以下に設定されていることを特徴とする半導体装置の梱包方法。 - 上記半導体装置および上記エンボステープを上記リールに巻き付ける際、10gf以上かつ200gf以下のテンションをかけて、上記絶縁フィルムの上記半導体チップが固着されている側の面と反対側の面と、上記導電フィルムの上記突起部が突出している側の面と反対側の面とを、80パーセント以上の面積が密着するように巻き付けることを特徴とする請求項7に記載の半導体装置の梱包方法。
- 上記半導体装置および上記エンボステープを巻き付けた上記リールを、帯電防止用または防湿用の袋に入れる第2のステップと、
上記リールを入れた袋を、第1の箱に収める第3のステップと、
上記第1の箱を、上記第1の箱よりも大きいサイズの第2の箱に複数収める第4のステップとを含むことを特徴とする請求項7に記載の半導体装置の梱包方法。
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TW097143262A TWI356798B (en) | 2007-11-09 | 2008-11-07 | Packing structure for semiconductor device, packin |
CN2008801149092A CN101848848B (zh) | 2007-11-09 | 2008-11-07 | 半导体装置的包装结构、半导体装置的包装方法和压纹带 |
PCT/JP2008/070335 WO2009060949A1 (ja) | 2007-11-09 | 2008-11-07 | 半導体装置の梱包構造、半導体装置の梱包方法、およびエンボステープ |
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