WO2009060949A1 - 半導体装置の梱包構造、半導体装置の梱包方法、およびエンボステープ - Google Patents

半導体装置の梱包構造、半導体装置の梱包方法、およびエンボステープ Download PDF

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Publication number
WO2009060949A1
WO2009060949A1 PCT/JP2008/070335 JP2008070335W WO2009060949A1 WO 2009060949 A1 WO2009060949 A1 WO 2009060949A1 JP 2008070335 W JP2008070335 W JP 2008070335W WO 2009060949 A1 WO2009060949 A1 WO 2009060949A1
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WO
WIPO (PCT)
Prior art keywords
tape
film
embossed
semiconductor device
tab tape
Prior art date
Application number
PCT/JP2008/070335
Other languages
English (en)
French (fr)
Inventor
Satoru Kudose
Kenji Toyosawa
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008285554A external-priority patent/JP4460015B2/ja
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to CN2008801149092A priority Critical patent/CN101848848B/zh
Priority to KR1020107011622A priority patent/KR101177329B1/ko
Priority to US12/734,510 priority patent/US8390104B2/en
Publication of WO2009060949A1 publication Critical patent/WO2009060949A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/7965—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01038—Strontium [Sr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0104—Zirconium [Zr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)

Abstract

　ＴＡＢテープ（１００）の梱包構造は、配線パターンが繰り返し形成されたフィルム（１０１）上に固着された複数の半導体チップ（１０３）を有するＴＡＢテープ（１００）と、フィルム（２０１）の片面側かつ長尺方向に連続的に形成されたエンボス部（２０２）を有する導電性のエンボステープ（２００）とが導電性リールに巻き付けられた梱包構造において、ＴＡＢテープ（１００）およびエンボステープ（２００）は、フィルム（１０１）の半導体チップ（１０３）の固着面とフィルム（２０１）のエンボス部（２０２）の突出面とが向かい合うように重ね合わせられながらリールに巻き付けられており、半導体チップ（１０３）の厚みがｔ（０．２≦ｔ≦０．６２５）ｍｍであり、かつフィルム（２０１）の厚みが略０．１２５ｍｍであるときに、エンボステープ（２００）の総厚は、（ｔ＋０．４）ｍｍ以上かつ１．１ｍｍ以下である。これにより、出荷・搬送時におけるＴＡＢテープへの保護を十分に確保しながら、ＴＡＢテープを所望する巻き取り量で梱包することができる。
PCT/JP2008/070335 2007-11-09 2008-11-07 半導体装置の梱包構造、半導体装置の梱包方法、およびエンボステープ WO2009060949A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801149092A CN101848848B (zh) 2007-11-09 2008-11-07 半导体装置的包装结构、半导体装置的包装方法和压纹带
KR1020107011622A KR101177329B1 (ko) 2007-11-09 2008-11-07 반도체 장치의 곤포 구조, 반도체 장치의 곤포 방법, 및 엠보스 테이프
US12/734,510 US8390104B2 (en) 2007-11-09 2008-11-07 Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007292614 2007-11-09
JP2007-292614 2007-11-09
JP2008285554A JP4460015B2 (ja) 2007-11-09 2008-11-06 半導体装置の梱包構造、および半導体装置の梱包方法
JP2008-285554 2008-11-06

Publications (1)

Publication Number Publication Date
WO2009060949A1 true WO2009060949A1 (ja) 2009-05-14

Family

ID=40625835

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070335 WO2009060949A1 (ja) 2007-11-09 2008-11-07 半導体装置の梱包構造、半導体装置の梱包方法、およびエンボステープ

Country Status (1)

Country Link
WO (1) WO2009060949A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022701A (ja) * 2003-07-02 2005-01-27 Sumitomo Bakelite Co Ltd 半導体エンボスキャリアテープ包装用梱包箱
JP2006310476A (ja) * 2005-04-27 2006-11-09 Kawamura Sangyo Kk 半導体実装回路テープ用ラミネートスペーサーテープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022701A (ja) * 2003-07-02 2005-01-27 Sumitomo Bakelite Co Ltd 半導体エンボスキャリアテープ包装用梱包箱
JP2006310476A (ja) * 2005-04-27 2006-11-09 Kawamura Sangyo Kk 半導体実装回路テープ用ラミネートスペーサーテープ

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