JP2010089841A - エンボステープ - Google Patents
エンボステープ Download PDFInfo
- Publication number
- JP2010089841A JP2010089841A JP2010005349A JP2010005349A JP2010089841A JP 2010089841 A JP2010089841 A JP 2010089841A JP 2010005349 A JP2010005349 A JP 2010005349A JP 2010005349 A JP2010005349 A JP 2010005349A JP 2010089841 A JP2010089841 A JP 2010089841A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- embossed
- reel
- film
- tab tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 172
- 238000004049 embossing Methods 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 abstract description 25
- 239000010408 film Substances 0.000 description 93
- 238000004804 winding Methods 0.000 description 36
- 125000006850 spacer group Chemical group 0.000 description 27
- 239000000463 material Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 238000012856 packing Methods 0.000 description 16
- 239000000428 dust Substances 0.000 description 9
- -1 polyethylene terephthalate Polymers 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000011295 pitch Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- 230000006378 damage Effects 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B55/00—Preserving, protecting or purifying packages or package contents in association with packaging
- B65B55/20—Embedding contents in shock-absorbing media, e.g. plastic foam, granular material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/28—Wound package of webs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2407/00—Means not provided for in groups B65H2220/00 – B65H2406/00 specially adapted for particular purposes
- B65H2407/30—Means for preventing damage of handled material, e.g. by controlling atmosphere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
- B65H2511/10—Size; Dimensions
- B65H2511/16—Irregularities, e.g. protuberances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2601/00—Problem to be solved or advantage achieved
- B65H2601/20—Avoiding or preventing undesirable effects
- B65H2601/25—Damages to handled material
- B65H2601/253—Damages to handled material to particular parts of material
- B65H2601/2532—Surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/13—Parts concerned of the handled material
- B65H2701/131—Edges
- B65H2701/1315—Edges side edges, i.e. regarded in context of transport
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/18—Form of handled article or web
- B65H2701/186—Several articles or webs processed together
- B65H2701/1864—Superposed webs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01038—Strontium [Sr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0104—Zirconium [Zr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Wire Bonding (AREA)
- Packaging Of Machine Parts And Wound Products (AREA)
- Buffer Packaging (AREA)
- Wrappers (AREA)
Abstract
【解決手段】配線パターンが繰り返し形成されたフィルム101上に固着された複数の半導体チップ103を有するTABテープ100と、フィルム201の片面側かつ長尺方向に連続的に形成されたエンボス部202を有する導電性のエンボステープ200とが導電性リールに巻き付けられた梱包構造において、TABテープ100およびエンボステープ200は、フィルム101の半導体チップ103の固着面とフィルム201のエンボス部202の突出面とが向かい合うように重ね合わせられながらリールに巻き付けられており、半導体チップ103の厚みがt(0.2≦t≦0.625)mmであり、かつフィルム201の厚みが略0.125mmであるときに、エンボステープ200の総厚は、(t+0.4)mm以上かつ1.1mm以下である。
【選択図】図12
Description
の低下を引き起こし、輸送費の増大も生じる。ゆえに、これらのために生産性向上にはつながらない。よって、従来のスペーサテープ500では、TABテープ550の長尺化は困難であった。
プ用ラミネートスペーサテープが記載されている。このラミネートスペーサテープは、回路を形成する前の生テープの状態から使用することを目的としているので、突起部の高さを小さくすることが可能となっている。
を形成するために熱変形させやすく、共にリールに巻かれる半導体装置への保護を十分に確保しながら、半導体装置を所望する巻き取り量で梱包させることができるという効果を奏する。
(TABテープの構成)
図1は、TABテープ100の一構成例を示す、(a)は上面図であり、(b)は側面図である。
(エンボステープの構成)
図2は、エンボステープ200の一構成例を示す、(a)は上面図であり、(b)は側面図である。
を有している。ここで、エンボステープ200における、エンボス部202が形成されている面(エンボス部202の山が突出している側の面)をエンボス表面Cと称し、その反対側の面をエンボス裏面Dと称する。
って、歯291の先端の形状に応じてエンボス部202の形状を変更することが可能であり、歯291の先端が最も下に位置するときの位置に応じてエンボス部202の山高さhaを変更することが可能である。また、エンボステープ200のヤング率は、400〜700N/mm2となることが望ましい。
しないようにすれば特に限定されない。これにより、エンボス加工時や廃棄時に、目視だけで材質を認識することが可能となる。
(梱包用の部材)
TABテープ100が出荷・搬送用の梱包形態となるために、いくつかの部材(副資材)が用いられる。ここでは、代表的なものについて説明する。
(TABテープの梱包方法および梱包構造)
次に、図1に示したTABテープ100を、図2に示したエンボステープ200とともに図9に示したリール310に巻き付けて、出荷・搬送用の梱包形態にするまでの処理フ
ローについて説明する。
することも可能となる。
図2に示したエンボステープ200(フィルム201の厚み:0.125mm)の総厚に応じて、図1に示したTABテープ100(フィルム101の厚み:0.04mm、半導体チップ103の厚み:0.625mm)を、φ405mmサイズのリール310にど
れくらいの長さを巻き取ることができるのかを検証した。
mのとき、TABテープ100を82m、84m、86m巻くことができた。よって、これらの結果データにより、エンボステープ200の総厚hが、1.1m以下の場合において、TABテープ100を80m以上巻くことができることがわかった。
(実施例2)
TABテープ100とエンボステープ200とを重ね合わせて巻き付けた場合、図19に示すように、半導体チップ103とエンボステープ200との間に隙間gを形成させている。しかし、TABテープ100やエンボステープ200の反りによって、図20に示すように、半導体チップ103とエンボステープ200とが接触し、エンボステープ200に擦れ傷が転写する場合がある。
わせられながら上記リールに巻き付けられており、上記半導体チップの厚みがt(0.2≦t≦0.625)mmであり、かつ上記導電フィルムの厚みが略0.125mmであるときに、上記エンボステープの総厚は、(t+0.4)mm以上かつ1.1mm以下である構成であってもよい。
ップが固着されている側の面と、突起部の表面との間は滑りやすくなっているので、リールに巻き取った状態において各テープが波打つことを防止することが可能となる。
山による局部的な擦れを抑制し、発塵しにくい形態とすることが可能であり、さらには導電性のエンボステープが半導体チップが固着されている側の面と反対側の面と80%以上が接触することで、輸送時に生じる振動などで発生する半導体チップが固着した絶縁フィルムの帯電量も減少し、半導体チップへの静電気によるダメージも減少することが可能となる。
t(0.2≦t≦0.625)mmであり、かつ上記導電フィルムの厚みが略0.125mmであるときに、上記エンボステープの総厚が、(t+0.4)mm以上かつ1.1mm以下であるものを用いる、という方法であってもよい。
101 フィルム(絶縁フィルム)
102 配線パターン
103 半導体チップ
200,210,220,230,240 エンボステープ
201 フィルム(導電フィルム)
202 エンボス部(突起部)
211,212,221,222,231,232,241 エンボス部(突起部)
242 材質表示部
310 リール
311 中芯部
320 帯電防止袋(袋)
330 内装ケース(第1の箱)
340 外装ケース(第2の箱)
Claims (2)
- テープ状の1層の導電フィルムと、上記導電フィルムの片面側であって、かつ長尺方向に連続的にエンボス加工により形成された突起部とによって構成される導電性のエンボステープであって、
上記エンボステープは、配線パターンが繰り返し形成されたテープ状の絶縁フィルム上に、上記各配線パターンと電気的に接続するように固着された複数の半導体チップを有するCOFタイプの半導体装置とともに、導電性のリールに巻き付けられるためのものであり、
上記エンボステープにおける、総厚は0.6mm以上かつ1.1mm以下であり、および表面抵抗値は106Ω以上かつ109Ω以下であることを特徴とするエンボステープ。 - 上記エンボステープの長尺方向における上記突起部の配置ピッチは、当該エンボステープにおける長さが20mmの範囲内で、当該突起部が1.5個以上かつ3個以下設けられるように設定されていることを特徴とする請求項1に記載のエンボステープ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010005349A JP5174836B2 (ja) | 2007-11-09 | 2010-01-13 | エンボステープ |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007292614 | 2007-11-09 | ||
JP2007292614 | 2007-11-09 | ||
JP2010005349A JP5174836B2 (ja) | 2007-11-09 | 2010-01-13 | エンボステープ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008285554A Division JP4460015B2 (ja) | 2007-11-09 | 2008-11-06 | 半導体装置の梱包構造、および半導体装置の梱包方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010089841A true JP2010089841A (ja) | 2010-04-22 |
JP5174836B2 JP5174836B2 (ja) | 2013-04-03 |
Family
ID=40864759
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008285554A Active JP4460015B2 (ja) | 2007-11-09 | 2008-11-06 | 半導体装置の梱包構造、および半導体装置の梱包方法 |
JP2010005349A Active JP5174836B2 (ja) | 2007-11-09 | 2010-01-13 | エンボステープ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008285554A Active JP4460015B2 (ja) | 2007-11-09 | 2008-11-06 | 半導体装置の梱包構造、および半導体装置の梱包方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8390104B2 (ja) |
JP (2) | JP4460015B2 (ja) |
KR (1) | KR101177329B1 (ja) |
CN (1) | CN101848848B (ja) |
TW (1) | TWI356798B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090159699A1 (en) | 2007-12-24 | 2009-06-25 | Dynamics Inc. | Payment cards and devices operable to receive point-of-sale actions before point-of-sale and forward actions at point-of-sale |
JP2012146883A (ja) * | 2011-01-13 | 2012-08-02 | Kawamura Sangyo Kk | スペーサテープ |
CA2864986C (en) * | 2012-02-20 | 2020-05-12 | Dynamics Inc. | Systems and methods for flexible components, flexible cards, multi-layer boards, multiple sensor detectors, non-time smearing detection mechanisms and electromagnetic field generators for powered cards and devices |
US9916992B2 (en) | 2012-02-20 | 2018-03-13 | Dynamics Inc. | Systems and methods for flexible components for powered cards and devices |
WO2013180722A1 (en) * | 2012-05-31 | 2013-12-05 | Hewlett-Packard Development Company, Lp | Spooling process films |
US9064195B2 (en) | 2012-06-29 | 2015-06-23 | Dynamics Inc. | Multiple layer card circuit boards |
US9010647B2 (en) | 2012-10-29 | 2015-04-21 | Dynamics Inc. | Multiple sensor detector systems and detection methods of magnetic cards and devices |
US10949627B2 (en) | 2012-12-20 | 2021-03-16 | Dynamics Inc. | Systems and methods for non-time smearing detection mechanisms for magnetic cards and devices |
KR102424298B1 (ko) * | 2016-09-29 | 2022-07-25 | 다이니폰 인사츠 가부시키가이샤 | 증착 마스크 곤포체 및 증착 마스크 곤포 방법 |
WO2018112286A1 (en) * | 2016-12-15 | 2018-06-21 | Sealed Air Corporation (Us) | Packaging method |
CN108861069A (zh) * | 2018-08-23 | 2018-11-23 | 长电科技(滁州)有限公司 | 一种防粘黏压纹载带及载带制造方法 |
US11299302B2 (en) * | 2018-10-26 | 2022-04-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated semiconductor die parceling platforms |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10144724A (ja) * | 1996-11-12 | 1998-05-29 | Nec Corp | テープキャリアパッケージテープ |
JP2005225552A (ja) * | 2004-02-16 | 2005-08-25 | Denki Kagaku Kogyo Kk | キャリアテープ及びチップ型電子部品搬送体 |
JP2007158264A (ja) * | 2005-12-08 | 2007-06-21 | Kawamura Sangyo Kk | 半導体実装回路テープ用スペーサテープ |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05326646A (ja) | 1992-05-21 | 1993-12-10 | Mitsui Mining & Smelting Co Ltd | フィルムキャリア用スペーサーとそれを用いたフィルムキャリアの製造方法 |
JPH08597B2 (ja) | 1992-08-29 | 1996-01-10 | 大日化成工業株式会社 | Tab用スペーサテープ |
US5491013A (en) * | 1994-08-31 | 1996-02-13 | Rexam Industries Corp. | Static-dissipating adhesive tape |
US5846621A (en) * | 1995-09-15 | 1998-12-08 | Minnesota Mining And Manufacturing Company | Component carrier tape having static dissipative properties |
US5875897A (en) * | 1997-03-31 | 1999-03-02 | Motorola, Inc. | Packaging apparatus and method |
US6540086B1 (en) * | 2000-10-13 | 2003-04-01 | Peak International Ltd. | Protective cover tape having a foam layer |
EP1445282A4 (en) * | 2001-08-03 | 2004-11-24 | Toray Industries | RESIN COMPOSITION AND MOLDED ARTICLE, FILM AND FIBER |
JP2003197689A (ja) * | 2001-12-27 | 2003-07-11 | Seiko Epson Corp | エンボススペーサテープ及びその製造方法 |
US6857493B2 (en) * | 2002-02-13 | 2005-02-22 | Paragon Technologies, Inc. | Automatic load positioning for a conveyor cart |
US6919513B2 (en) * | 2002-07-24 | 2005-07-19 | Samsung Electronics Co., Ltd. | Film carrier tape for semiconductor package and manufacturing method thereof |
JP3903382B2 (ja) * | 2002-12-10 | 2007-04-11 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの処理装置におけるスペーサの巻き取り装置 |
JP2004327550A (ja) | 2003-04-22 | 2004-11-18 | Renesas Technology Corp | 半導体装置の製造方法および半導体装置の出荷方法 |
JP4336151B2 (ja) * | 2003-06-19 | 2009-09-30 | シャープ株式会社 | テープキャリア型の半導体装置 |
JP2005022701A (ja) * | 2003-07-02 | 2005-01-27 | Sumitomo Bakelite Co Ltd | 半導体エンボスキャリアテープ包装用梱包箱 |
JP2006310476A (ja) * | 2005-04-27 | 2006-11-09 | Kawamura Sangyo Kk | 半導体実装回路テープ用ラミネートスペーサーテープ |
-
2008
- 2008-11-06 JP JP2008285554A patent/JP4460015B2/ja active Active
- 2008-11-07 US US12/734,510 patent/US8390104B2/en active Active
- 2008-11-07 TW TW097143262A patent/TWI356798B/zh active
- 2008-11-07 KR KR1020107011622A patent/KR101177329B1/ko active IP Right Grant
- 2008-11-07 CN CN2008801149092A patent/CN101848848B/zh active Active
-
2010
- 2010-01-13 JP JP2010005349A patent/JP5174836B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10144724A (ja) * | 1996-11-12 | 1998-05-29 | Nec Corp | テープキャリアパッケージテープ |
JP2005225552A (ja) * | 2004-02-16 | 2005-08-25 | Denki Kagaku Kogyo Kk | キャリアテープ及びチップ型電子部品搬送体 |
JP2007158264A (ja) * | 2005-12-08 | 2007-06-21 | Kawamura Sangyo Kk | 半導体実装回路テープ用スペーサテープ |
Also Published As
Publication number | Publication date |
---|---|
JP5174836B2 (ja) | 2013-04-03 |
TWI356798B (en) | 2012-01-21 |
KR101177329B1 (ko) | 2012-08-30 |
JP4460015B2 (ja) | 2010-05-12 |
US8390104B2 (en) | 2013-03-05 |
TW200942464A (en) | 2009-10-16 |
CN101848848B (zh) | 2012-02-29 |
US20100230793A1 (en) | 2010-09-16 |
CN101848848A (zh) | 2010-09-29 |
KR20100085143A (ko) | 2010-07-28 |
JP2009132453A (ja) | 2009-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4460015B2 (ja) | 半導体装置の梱包構造、および半導体装置の梱包方法 | |
TWI423917B (zh) | Tab帶的包裝方法及tab帶的包裝構造 | |
TW525251B (en) | Flexible wiring board, thin film carrying body, stripe semiconductor device, semiconductor device and its manufacturing method, circuit board and electronic machine | |
US8033397B2 (en) | Cover tape for packaging semiconductor device and package for semiconductor device | |
US6105783A (en) | Embossed carrier tape and embossed carrier taping method | |
JP4755410B2 (ja) | テープ状部品包装体 | |
US20060011509A1 (en) | Packaging system and method for storing electronic components | |
JP3229786B2 (ja) | テープキャリアパッケージおよびその収納方法 | |
KR101368089B1 (ko) | 기판 보호 시트 | |
US20070042166A1 (en) | Tape substrate having reinforcement layer for tape packages | |
KR20070029470A (ko) | 보강재가 구비된 반도체 패키지용 필름 및 이를 적용한디스플레이 모듈 | |
JP6467702B2 (ja) | リール状製品の梱包体 | |
TWI338943B (en) | Chip package in tape form | |
CN103935643B (zh) | 膜捆包体、膜捆包方法 | |
JPH08119326A (ja) | キャリアテープ梱包体およびその封止方法 | |
JPH07335734A (ja) | キャリアテープ | |
JP2009289794A (ja) | 半導体実装回路テープ用スペーサテープ | |
JPH10144724A (ja) | テープキャリアパッケージテープ | |
JP2016153313A (ja) | リール状製品の梱包体 | |
TW543162B (en) | Tape carrier package (TCP) on which semiconductor chips are mounted and method of manufacuturing the same | |
JP2011192699A (ja) | 半導体パッケージ用テープを用いた半導体装置の製造方法 | |
TW583125B (en) | Resin protector for transporting plasma display unit, transferring method for plasma display unit and manufacturing method for television apparatus | |
JP2005088948A (ja) | スペーサテープ及びそれを用いた半導体装置の梱包方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100113 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120319 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120417 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120614 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121204 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121228 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5174836 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |