JP4457073B2 - 竪型両頭平面研削盤 - Google Patents
竪型両頭平面研削盤 Download PDFInfo
- Publication number
- JP4457073B2 JP4457073B2 JP2005514445A JP2005514445A JP4457073B2 JP 4457073 B2 JP4457073 B2 JP 4457073B2 JP 2005514445 A JP2005514445 A JP 2005514445A JP 2005514445 A JP2005514445 A JP 2005514445A JP 4457073 B2 JP4457073 B2 JP 4457073B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- sharpening
- tool
- grinding
- work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003343437 | 2003-10-01 | ||
JP2003343437 | 2003-10-01 | ||
PCT/JP2004/014360 WO2005032766A1 (ja) | 2003-10-01 | 2004-09-30 | 竪型両頭平面研削盤におけるドレス方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2005032766A1 JPWO2005032766A1 (ja) | 2007-11-15 |
JP4457073B2 true JP4457073B2 (ja) | 2010-04-28 |
Family
ID=34419298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005514445A Active JP4457073B2 (ja) | 2003-10-01 | 2004-09-30 | 竪型両頭平面研削盤 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070021041A1 (zh) |
JP (1) | JP4457073B2 (zh) |
CN (1) | CN1894073A (zh) |
DE (1) | DE112004001774T5 (zh) |
WO (1) | WO2005032766A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5321943B2 (ja) * | 2008-03-03 | 2013-10-23 | Ntn株式会社 | 斜板式コンプレッサの斜板および斜板式コンプレッサ |
JP4876098B2 (ja) * | 2008-05-09 | 2012-02-15 | 大昌精機株式会社 | 竪型両頭平面研削盤 |
DE102010019203A1 (de) * | 2010-05-04 | 2011-11-10 | Peter Wolters Gmbh | Doppelseitenschleifmaschine |
MX2017004251A (es) * | 2014-10-03 | 2017-12-20 | Zeeko Ltd | Metodo para formar y terminar una pieza de trabajo. |
JP6309466B2 (ja) * | 2015-01-22 | 2018-04-11 | 光洋機械工業株式会社 | 両頭平面研削装置 |
CN107150286B (zh) * | 2017-06-21 | 2018-12-18 | 大连理工大学 | 一种用于平面局部高点去除的精密研磨装置及参数确定方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3473269A (en) * | 1967-05-05 | 1969-10-21 | La Salle Machine Tool | Grinding apparatus |
JPH01146660A (ja) * | 1987-12-02 | 1989-06-08 | Mitsubishi Metal Corp | 研削砥石のドレッシング方法 |
JPH0639301U (ja) * | 1992-11-05 | 1994-05-24 | フジオーゼックス株式会社 | ワーク端面の保持装置 |
US6969305B2 (en) * | 2000-02-07 | 2005-11-29 | Ebara Corporation | Polishing apparatus |
US6722964B2 (en) * | 2000-04-04 | 2004-04-20 | Ebara Corporation | Polishing apparatus and method |
JP2002263993A (ja) * | 2001-03-12 | 2002-09-17 | Nisshin Kogyo Kk | ブレーキディスクロータの研削装置および研削方法 |
JP3527213B2 (ja) * | 2001-04-11 | 2004-05-17 | 大昌精機株式会社 | 竪型両頭平面研削盤 |
JP2004050334A (ja) * | 2002-07-18 | 2004-02-19 | Daisho Seiki Kk | ブレーキディスク加工用竪型両頭平面研削盤 |
JP2004066392A (ja) * | 2002-08-06 | 2004-03-04 | Daisho Seiki Kk | ブレーキディスク加工用竪型両頭平面研削盤における研削方法 |
-
2004
- 2004-09-30 US US10/574,096 patent/US20070021041A1/en not_active Abandoned
- 2004-09-30 WO PCT/JP2004/014360 patent/WO2005032766A1/ja active Application Filing
- 2004-09-30 DE DE112004001774T patent/DE112004001774T5/de not_active Ceased
- 2004-09-30 JP JP2005514445A patent/JP4457073B2/ja active Active
- 2004-09-30 CN CNA2004800284455A patent/CN1894073A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JPWO2005032766A1 (ja) | 2007-11-15 |
WO2005032766A1 (ja) | 2005-04-14 |
US20070021041A1 (en) | 2007-01-25 |
DE112004001774T5 (de) | 2007-08-23 |
CN1894073A (zh) | 2007-01-10 |
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