JP4454036B2 - 回路基板用雄電気コネクタ及び電気コネクタ組立体 - Google Patents
回路基板用雄電気コネクタ及び電気コネクタ組立体 Download PDFInfo
- Publication number
- JP4454036B2 JP4454036B2 JP2007150054A JP2007150054A JP4454036B2 JP 4454036 B2 JP4454036 B2 JP 4454036B2 JP 2007150054 A JP2007150054 A JP 2007150054A JP 2007150054 A JP2007150054 A JP 2007150054A JP 4454036 B2 JP4454036 B2 JP 4454036B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- solder
- circuit board
- terminal
- male
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims description 121
- 230000004888 barrier function Effects 0.000 claims description 45
- 230000002093 peripheral effect Effects 0.000 claims description 24
- 230000013011 mating Effects 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 44
- 238000007747 plating Methods 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 238000009736 wetting Methods 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Description
<雄コネクタ>
本発明に係る雄コネクタは、回路基板に取り付けられ該回路基板の面に対して直角な嵌合方向で雌コネクタと嵌合接続され、端子が回路基板の面に平行にハウジング外へ延出していて回路基板の回路部と半田接続される接続部を有し、コネクタの嵌合時に、端子の接続部が雌コネクタのハウジングの周壁上面と嵌合方向で対面する対面域を有する。
<コネクタ組立体>
本発明に係るコネクタ組立体は、二枚の回路基板のそれぞれに取り付けられ該回路基板の面に対して直角な嵌合方向で嵌合接続される雄コネクタと雌コネクタから成り、少なくとも雄コネクタの端子が回路基板の面に平行にハウジング外へ延出していて回路基板の回路部と半田接続される接続部を有し、両コネクタの嵌合時に、該雄コネクタの端子の接続部が雌コネクタのハウジングの周壁上面と嵌合方向で対面する対面域を有する。
11 ハウジング 34A 上面
20 端子 34A−1 近接部分
23 接続部 34A−2 残余部分
24 半田バリア層 50 端子
30 雌コネクタ P1 回路基板
31 ハウジング P2 回路基板
Claims (5)
- 回路基板に取り付けられ該回路基板の面に対して直角な嵌合方向で雌コネクタと嵌合接続される雄コネクタであって、端子が回路基板の面に平行にハウジング外へ延出していて回路基板の回路部と半田接続される接続部を有し、コネクタの嵌合時に、端子の接続部が雌コネクタのハウジングの周壁上面と嵌合方向で対面する対面域を有する回路基板用雄電気コネクタにおいて、上記端子の接続部は、対面域のうち、少なくとも、上記嵌合方向で上記周壁上面に最も近くで位置する最近接対面域に半田バリア層が形成されており、該半田バリア層は、接続部の延出方向での基部側の位置にて端子の面を周方向に帯状をなして延びていることを特徴とする回路基板用雄電気コネクタ。
- 最近接対面域が接続部の延出方向での基部側に形成されていることとする請求項1に記載の回路基板用雄電気コネクタ。
- 二枚の回路基板のそれぞれに取り付けられ該回路基板の面に対して直角な嵌合方向で嵌合接続される雄コネクタと雌コネクタから成るコネクタ組立体であって、少なくとも雄コネクタの端子が回路基板の面に平行にハウジング外へ延出していて回路基板の回路部と半田接続される接続部を有し、両コネクタの嵌合時に、該雄コネクタの端子の接続部が雌コネクタのハウジングの周壁上面と嵌合方向で対面する対面域を有する回路基板用電気コネクタ組立体において、上記雄コネクタの端子の接続部は対面域のうち、少なくとも、上記嵌合方向で上記周壁上面に最も近くで位置する最近接対面域に半田バリア層が形成されており、該半田バリア層は、接続部の延出方向での基部側の位置にて端子の面を周方向に帯状をなして延びていることを特徴とする回路基板用電気コネクタ組立体。
- 雌コネクタのハウジングの周壁上面は、雄コネクタの端子の接続部の対面域に対応する部分が、最近接対面域に対応する近接部分と残余部分とから成り、嵌合方向にて残余部分は近接部分に対して没して形成されていることとする請求項3に記載の回路基板用電気コネクタ組立体。
- 雄コネクタの端子は金属帯体をその板厚方向に屈曲して作られており、雌コネクタの端子は金属板をその平坦な板面を維持したまま作られていることとする請求項3又は請求項4に記載の回路基板用電気コネクタ組立体。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150054A JP4454036B2 (ja) | 2007-06-06 | 2007-06-06 | 回路基板用雄電気コネクタ及び電気コネクタ組立体 |
TW097117408A TW200849741A (en) | 2007-06-06 | 2008-05-12 | Male connector and connector assembly |
KR1020080048517A KR101032584B1 (ko) | 2007-06-06 | 2008-05-26 | 회로 기판용 수 전기 커넥터 및 전기 커넥터 조립체 |
EP08104238.4A EP2001084B1 (en) | 2007-06-06 | 2008-06-03 | Male connector and connector assembly |
CN2008101259056A CN101320859B (zh) | 2007-06-06 | 2008-06-04 | 电路基板用公电连接器及电连接器组装体 |
US12/155,520 US7625244B2 (en) | 2007-06-06 | 2008-06-05 | Male connector having solder barrier layer and connector assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150054A JP4454036B2 (ja) | 2007-06-06 | 2007-06-06 | 回路基板用雄電気コネクタ及び電気コネクタ組立体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008305603A JP2008305603A (ja) | 2008-12-18 |
JP4454036B2 true JP4454036B2 (ja) | 2010-04-21 |
Family
ID=39651054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007150054A Active JP4454036B2 (ja) | 2007-06-06 | 2007-06-06 | 回路基板用雄電気コネクタ及び電気コネクタ組立体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7625244B2 (ja) |
EP (1) | EP2001084B1 (ja) |
JP (1) | JP4454036B2 (ja) |
KR (1) | KR101032584B1 (ja) |
CN (1) | CN101320859B (ja) |
TW (1) | TW200849741A (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4954050B2 (ja) * | 2007-12-20 | 2012-06-13 | モレックス インコーポレイテド | 端子及びコネクタ |
US20100130068A1 (en) * | 2008-11-25 | 2010-05-27 | Yung-Chi Peng | Board-to-board connector assembly |
JP2011029111A (ja) * | 2009-07-29 | 2011-02-10 | Molex Inc | コネクタ |
JP4887412B2 (ja) * | 2009-09-18 | 2012-02-29 | ヒロセ電機株式会社 | 回路基板用電気コネクタ |
JP4901944B2 (ja) * | 2009-12-03 | 2012-03-21 | ヒロセ電機株式会社 | 電気コネクタ |
JP5479406B2 (ja) * | 2011-06-30 | 2014-04-23 | 日本航空電子工業株式会社 | コネクタ |
US8888506B2 (en) * | 2013-01-29 | 2014-11-18 | Japan Aviation Electronics Industry, Limited | Connector |
CN203180152U (zh) * | 2013-02-07 | 2013-09-04 | 番禺得意精密电子工业有限公司 | 电连接器 |
KR101489117B1 (ko) * | 2013-02-27 | 2015-02-02 | 파나소닉 주식회사 | 커넥터 및 상기 커넥터에 이용되는 헤더 및 소켓 |
JP6537890B2 (ja) * | 2014-09-26 | 2019-07-03 | 日本航空電子工業株式会社 | コネクタ |
TWM520732U (zh) * | 2015-09-25 | 2016-04-21 | Advanced Connectek Inc | 插頭電連接器與插座電連接器 |
JP6807218B2 (ja) | 2016-11-18 | 2021-01-06 | モレックス エルエルシー | コネクタ |
CN108232526B (zh) * | 2016-12-21 | 2020-04-24 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其组合 |
CN108258484B (zh) * | 2016-12-28 | 2020-02-21 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其组合 |
CN108933365B (zh) * | 2017-05-26 | 2021-06-18 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
JP6582083B2 (ja) * | 2018-03-09 | 2019-09-25 | 京セラ株式会社 | コネクタ及び電子機器 |
CN112335137B (zh) * | 2018-06-22 | 2022-04-05 | 株式会社藤仓 | 电连接器 |
US10847936B2 (en) * | 2018-08-28 | 2020-11-24 | Foxconn (Kunshan) Computer Connector Co., Ltd. | Card edge connector with improved grounding member |
JP2020077490A (ja) * | 2018-11-06 | 2020-05-21 | Smk株式会社 | 電気コネクタ、および電気コネクタセット |
JP7202866B2 (ja) * | 2018-12-03 | 2023-01-12 | ヒロセ電機株式会社 | 基板接続コネクタ向けの端子、コネクタ及びコネクタ製造方法 |
JP6986039B2 (ja) * | 2019-03-15 | 2021-12-22 | ヒロセ電機株式会社 | 電気コネクタ及び電気コネクタ組立体 |
CN209571614U (zh) * | 2019-04-18 | 2019-11-01 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其对接连接器 |
US11095059B2 (en) * | 2019-04-25 | 2021-08-17 | Molex, Llc | Connector |
WO2021000152A1 (zh) * | 2019-06-30 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | 多极连接器 |
JP7196028B2 (ja) * | 2019-07-04 | 2022-12-26 | 日本航空電子工業株式会社 | コネクタ組立体 |
JP1663235S (ja) | 2020-02-13 | 2020-07-06 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0255703U (ja) | 1988-10-18 | 1990-04-23 | ||
JPH0355703A (ja) | 1989-07-25 | 1991-03-11 | Toshiba Lighting & Technol Corp | 蛍光ランプ装置 |
JP3617220B2 (ja) * | 1996-11-26 | 2005-02-02 | 松下電工株式会社 | コネクタ |
JP2002008753A (ja) * | 2000-06-16 | 2002-01-11 | Matsushita Electric Works Ltd | コネクタ |
JP2004185866A (ja) * | 2002-11-29 | 2004-07-02 | Toshiba Corp | コネクタ装置およびコネクタ用リード端子の製造方法 |
US6881075B2 (en) * | 2003-07-08 | 2005-04-19 | Cheng Uei Precision Industry Co., Ltd. | Board-to-board connector |
JP3860823B2 (ja) * | 2004-08-19 | 2006-12-20 | 京セラエルコ株式会社 | コネクタ及びこのコネクタを備えた携帯端末 |
JP4526428B2 (ja) * | 2005-04-18 | 2010-08-18 | モレックス インコーポレイテド | 基板対基板コネクタ |
JP4694275B2 (ja) * | 2005-06-13 | 2011-06-08 | モレックス インコーポレイテド | 基板対基板コネクタ |
JP4545062B2 (ja) * | 2005-08-03 | 2010-09-15 | モレックス インコーポレイテド | 基板対基板コネクタ |
WO2007061233A1 (en) * | 2005-11-24 | 2007-05-31 | Yoon-Sik Choi | Connector |
JP4817818B2 (ja) | 2005-11-29 | 2011-11-16 | Towa株式会社 | 樹脂封止装置及びチェイスユニットの取り出し方法 |
-
2007
- 2007-06-06 JP JP2007150054A patent/JP4454036B2/ja active Active
-
2008
- 2008-05-12 TW TW097117408A patent/TW200849741A/zh not_active IP Right Cessation
- 2008-05-26 KR KR1020080048517A patent/KR101032584B1/ko active IP Right Grant
- 2008-06-03 EP EP08104238.4A patent/EP2001084B1/en not_active Not-in-force
- 2008-06-04 CN CN2008101259056A patent/CN101320859B/zh active Active
- 2008-06-05 US US12/155,520 patent/US7625244B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101032584B1 (ko) | 2011-05-06 |
TW200849741A (en) | 2008-12-16 |
CN101320859A (zh) | 2008-12-10 |
EP2001084A1 (en) | 2008-12-10 |
JP2008305603A (ja) | 2008-12-18 |
KR20080107259A (ko) | 2008-12-10 |
TWI371893B (ja) | 2012-09-01 |
US7625244B2 (en) | 2009-12-01 |
EP2001084B1 (en) | 2013-08-14 |
CN101320859B (zh) | 2010-11-10 |
US20080305657A1 (en) | 2008-12-11 |
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