JP4453711B2 - 薄膜部品及び製造方法 - Google Patents
薄膜部品及び製造方法 Download PDFInfo
- Publication number
- JP4453711B2 JP4453711B2 JP2007093849A JP2007093849A JP4453711B2 JP 4453711 B2 JP4453711 B2 JP 4453711B2 JP 2007093849 A JP2007093849 A JP 2007093849A JP 2007093849 A JP2007093849 A JP 2007093849A JP 4453711 B2 JP4453711 B2 JP 4453711B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- terminal electrode
- electrode body
- resin layer
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010409 thin film Substances 0.000 title claims description 61
- 238000004519 manufacturing process Methods 0.000 title description 13
- 239000010410 layer Substances 0.000 claims description 214
- 229920005989 resin Polymers 0.000 claims description 122
- 239000011347 resin Substances 0.000 claims description 122
- 239000000758 substrate Substances 0.000 claims description 64
- 239000011247 coating layer Substances 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 238000005530 etching Methods 0.000 claims description 33
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 description 20
- 238000007747 plating Methods 0.000 description 15
- 239000003990 capacitor Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 12
- 238000009499 grossing Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- 230000002378 acidificating effect Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 229910000431 copper oxide Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 238000000992 sputter etching Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- -1 Si 3 N 4 Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000002156 adsorbate Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
- H01L27/016—Thin-film circuits
Description
また、前記樹脂層は、2層以上の樹脂層からなることしてもよい。
Claims (5)
- 基板上に電子素子が形成されてなる薄膜部品であって、
前記基板上に設けられ前記電子素子に電気的に接続された端子電極本体と、
前記電子素子を被覆し、前記端子電極本体の端部を露出するよう形成した樹脂層と、
前記樹脂層の側面及び前記端子電極本体の前記樹脂層に対する露出面に渡り、前記端子電極本体と前記樹脂層との境界の、前記端子電極本体が前記樹脂層に対して露出した側の端部を被覆し、一端が前記端子電極本体の前記露出面の途中に位置する被覆層と、
を備え、
前記被覆層は、前記端子電極本体の酸化物のエッチング液に対するエッチング速度よりも、エッチング速度の遅い材料からなり、
前記樹脂層は、
前記端子電極本体上に形成された第1樹脂層であって、前記被覆層の他端が、この第1樹脂層の側面の途中に位置するように設けられた第1樹脂層と、
前記第1樹脂層上に形成された第2樹脂層と、
を備え、
前記第2樹脂層における、前記端子電極本体の前記樹脂層に対する露出側の側面は、前記第1樹脂層における、前記端子電極本体の前記樹脂層に対する露出側の側面よりも、この薄膜部品の内側に位置しており、
前記端子電極本体を被覆する金属層は、前記端子電極本体の露出面に接触し、前記被覆層の前記一端及び前記他端を覆い、前記第1樹脂層の上部の表面にまで延びて形成されている、
ることを特徴とする薄膜部品。 - 前記端子電極本体の前記樹脂層による被覆領域と、前記樹脂層との間には、前記端子電極本体の酸化物が介在していることを特徴とする請求項1に記載の薄膜部品。
- 前記端子電極本体の前記基板から最も離れた露出面と、前記境界を含む前記樹脂層の側面との成す角度は鈍角であることを特徴とする請求項1又は2に記載の薄膜部品。
- 前記端子電極本体はCu又はAlを含む層からなり、
前記被覆層はCr又はTiを含む層からなる、
ことを特徴とする請求項1に記載の薄膜部品。 - 前記樹脂層の輪郭は、前記基板に垂直な方向からみて、角部が曲線で構成されていることを特徴とする請求項1乃至4のいずれか1項に記載の薄膜部品。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007093849A JP4453711B2 (ja) | 2007-03-30 | 2007-03-30 | 薄膜部品及び製造方法 |
US12/053,317 US7683269B2 (en) | 2007-03-30 | 2008-03-21 | Thin film device and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007093849A JP4453711B2 (ja) | 2007-03-30 | 2007-03-30 | 薄膜部品及び製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008251974A JP2008251974A (ja) | 2008-10-16 |
JP4453711B2 true JP4453711B2 (ja) | 2010-04-21 |
Family
ID=39792310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007093849A Expired - Fee Related JP4453711B2 (ja) | 2007-03-30 | 2007-03-30 | 薄膜部品及び製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7683269B2 (ja) |
JP (1) | JP4453711B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5234521B2 (ja) * | 2009-08-21 | 2013-07-10 | Tdk株式会社 | 電子部品及びその製造方法 |
JP5921142B2 (ja) * | 2011-10-26 | 2016-05-24 | キヤノン株式会社 | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 |
WO2018123969A1 (ja) * | 2016-12-27 | 2018-07-05 | 株式会社村田製作所 | 電子部品装置、高周波フロントエンド回路、及び通信装置 |
JP2020202220A (ja) * | 2019-06-07 | 2020-12-17 | 株式会社村田製作所 | 積層セラミック電子部品 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5084866A (ja) * | 1973-12-01 | 1975-07-09 | ||
JPH04120713A (ja) * | 1990-09-11 | 1992-04-21 | Matsushita Electric Ind Co Ltd | 多層薄膜コンデンサ |
JPH04123413A (ja) * | 1990-09-14 | 1992-04-23 | Matsushita Electric Ind Co Ltd | 積層薄膜コンデンサ |
JP3042090B2 (ja) * | 1991-10-31 | 2000-05-15 | 松下電器産業株式会社 | 薄膜コンデンサ |
JPH11135360A (ja) * | 1997-10-29 | 1999-05-21 | Sony Corp | コンデンサ及びその製造方法 |
US6313402B1 (en) * | 1997-10-29 | 2001-11-06 | Packard Hughes Interconnect Company | Stress relief bend useful in an integrated circuit redistribution patch |
DE19929754C2 (de) * | 1999-06-29 | 2001-08-16 | Siemens Ag | Verguß einer bestückten Baugruppe mit vibrationsdämpfender Gießmasse |
JP3759381B2 (ja) | 2000-07-17 | 2006-03-22 | アルプス電気株式会社 | 電子回路基板 |
JP2002344280A (ja) * | 2001-05-18 | 2002-11-29 | Mitsubishi Electric Corp | 圧電薄膜素子とその製造方法 |
JP2004172348A (ja) | 2002-11-20 | 2004-06-17 | Alps Electric Co Ltd | 薄膜コンデンサの形成方法 |
JP2005109410A (ja) * | 2003-10-02 | 2005-04-21 | Alps Electric Co Ltd | 薄膜コンデンサ |
JP4303563B2 (ja) * | 2003-11-12 | 2009-07-29 | 大日本印刷株式会社 | 電子装置および電子装置の製造方法 |
US20050218491A1 (en) * | 2004-03-31 | 2005-10-06 | Alps Electric Co., Ltd. | Circuit component module and method of manufacturing the same |
JP3915992B2 (ja) * | 2004-06-08 | 2007-05-16 | ローム株式会社 | 面実装型電子部品の製造方法 |
JP4574383B2 (ja) * | 2005-02-16 | 2010-11-04 | 京セラ株式会社 | 薄膜コンデンサおよび配線基板 |
KR101060796B1 (ko) * | 2006-06-28 | 2011-08-30 | 가부시키가이샤 무라타 세이사쿠쇼 | 세라믹 전자부품 및 그 제조방법 |
-
2007
- 2007-03-30 JP JP2007093849A patent/JP4453711B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-21 US US12/053,317 patent/US7683269B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7683269B2 (en) | 2010-03-23 |
US20080236885A1 (en) | 2008-10-02 |
JP2008251974A (ja) | 2008-10-16 |
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