JP4439593B2 - フェルミしきい値型電界効果型トランジスタ及びその製造方法 - Google Patents
フェルミしきい値型電界効果型トランジスタ及びその製造方法 Download PDFInfo
- Publication number
- JP4439593B2 JP4439593B2 JP52873297A JP52873297A JP4439593B2 JP 4439593 B2 JP4439593 B2 JP 4439593B2 JP 52873297 A JP52873297 A JP 52873297A JP 52873297 A JP52873297 A JP 52873297A JP 4439593 B2 JP4439593 B2 JP 4439593B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- tab
- source
- drain
- fermi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005669 field effect Effects 0.000 title claims description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims description 215
- 239000004065 semiconductor Substances 0.000 claims description 51
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 10
- 150000002500 ions Chemical class 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 108091006146 Channels Proteins 0.000 description 131
- 239000010410 layer Substances 0.000 description 79
- 238000009792 diffusion process Methods 0.000 description 29
- 239000000969 carrier Substances 0.000 description 26
- 230000037230 mobility Effects 0.000 description 24
- 229920002554 vinyl polymer Polymers 0.000 description 18
- 230000005684 electric field Effects 0.000 description 15
- 229920005591 polysilicon Polymers 0.000 description 15
- 125000006850 spacer group Chemical group 0.000 description 14
- 239000002019 doping agent Substances 0.000 description 13
- 230000005686 electrostatic field Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 230000006870 function Effects 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/637—Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/027—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs
- H10D30/0278—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs forming single crystalline channels on wafers after forming insulating device isolations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/351—Substrate regions of field-effect devices
- H10D62/357—Substrate regions of field-effect devices of FETs
- H10D62/364—Substrate regions of field-effect devices of FETs of IGFETs
- H10D62/371—Inactive supplementary semiconductor regions, e.g. for preventing punch-through, improving capacity effect or leakage current
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/597,711 US5698884A (en) | 1996-02-07 | 1996-02-07 | Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same |
| US08/597,711 | 1996-02-07 | ||
| PCT/US1997/002108 WO1997029519A1 (en) | 1996-02-07 | 1997-02-04 | Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000504881A JP2000504881A (ja) | 2000-04-18 |
| JP2000504881A5 JP2000504881A5 (enExample) | 2004-11-11 |
| JP4439593B2 true JP4439593B2 (ja) | 2010-03-24 |
Family
ID=24392633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52873297A Expired - Fee Related JP4439593B2 (ja) | 1996-02-07 | 1997-02-04 | フェルミしきい値型電界効果型トランジスタ及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5698884A (enExample) |
| EP (1) | EP0879482B1 (enExample) |
| JP (1) | JP4439593B2 (enExample) |
| KR (1) | KR100499308B1 (enExample) |
| AU (1) | AU709509B2 (enExample) |
| DE (1) | DE69728858T2 (enExample) |
| WO (1) | WO1997029519A1 (enExample) |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5864163A (en) * | 1995-12-27 | 1999-01-26 | United Microelectrics Corp. | Fabrication of buried channel devices with shallow junction depth |
| JP4014676B2 (ja) | 1996-08-13 | 2007-11-28 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置およびその作製方法 |
| JP3634086B2 (ja) | 1996-08-13 | 2005-03-30 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置の作製方法 |
| JP4059939B2 (ja) * | 1996-08-23 | 2008-03-12 | 株式会社半導体エネルギー研究所 | パワーmosデバイス及びその作製方法 |
| US6703671B1 (en) * | 1996-08-23 | 2004-03-09 | Semiconductor Energy Laboratory Co., Ltd. | Insulated gate semiconductor device and method of manufacturing the same |
| JP4103968B2 (ja) | 1996-09-18 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置 |
| US6590230B1 (en) | 1996-10-15 | 2003-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP4104701B2 (ja) | 1997-06-26 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US6686623B2 (en) | 1997-11-18 | 2004-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile memory and electronic apparatus |
| US5972758A (en) * | 1997-12-04 | 1999-10-26 | Intel Corporation | Pedestal isolated junction structure and method of manufacture |
| KR100328455B1 (ko) * | 1997-12-30 | 2002-08-08 | 주식회사 하이닉스반도체 | 반도체소자의제조방법 |
| JP4236722B2 (ja) | 1998-02-05 | 2009-03-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6110803A (en) * | 1998-12-10 | 2000-08-29 | United Microelectronics Corp. | Method for fabricating a high-bias device |
| JP4551513B2 (ja) * | 1999-05-10 | 2010-09-29 | シチズンホールディングス株式会社 | 可変容量回路 |
| US6417548B1 (en) * | 1999-07-19 | 2002-07-09 | United Microelectronics Corp. | Variable work function transistor high density mask ROM |
| US6541829B2 (en) * | 1999-12-03 | 2003-04-01 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| US6274415B1 (en) * | 2000-01-21 | 2001-08-14 | Advanced Micro Devices, Inc. | Self-aligned Vt implant |
| US6303421B1 (en) * | 2000-07-17 | 2001-10-16 | United Microelectronics Corp. | Method of manufacturing CMOS sensor |
| US7163864B1 (en) * | 2000-10-18 | 2007-01-16 | International Business Machines Corporation | Method of fabricating semiconductor side wall fin |
| US6555872B1 (en) | 2000-11-22 | 2003-04-29 | Thunderbird Technologies, Inc. | Trench gate fermi-threshold field effect transistors |
| TWI288472B (en) * | 2001-01-18 | 2007-10-11 | Toshiba Corp | Semiconductor device and method of fabricating the same |
| KR20030002020A (ko) * | 2001-06-30 | 2003-01-08 | 주식회사 하이닉스반도체 | 모스펫 제조방법 |
| US6747332B2 (en) * | 2002-04-01 | 2004-06-08 | Motorola, Inc. | Semiconductor component having high voltage MOSFET and method of manufacture |
| US6882009B2 (en) * | 2002-08-29 | 2005-04-19 | Industrial Technology Research Institute | Electrostatic discharge protection device and method of manufacturing the same |
| US7092227B2 (en) * | 2002-08-29 | 2006-08-15 | Industrial Technology Research Institute | Electrostatic discharge protection circuit with active device |
| JP2005294549A (ja) * | 2004-03-31 | 2005-10-20 | Nec Electronics Corp | Mos型トランジスタ |
| DE102004037087A1 (de) * | 2004-07-30 | 2006-03-23 | Advanced Micro Devices, Inc., Sunnyvale | Selbstvorspannende Transistorstruktur und SRAM-Zellen mit weniger als sechs Transistoren |
| KR101258864B1 (ko) * | 2004-12-07 | 2013-04-29 | 썬더버드 테크놀로지스, 인코포레이티드 | 긴장된 실리콘, 게이트 엔지니어링된 페르미-fet |
| JP2006245415A (ja) * | 2005-03-04 | 2006-09-14 | Sharp Corp | 半導体記憶装置及びその製造方法、並びに携帯電子機器 |
| US8759937B2 (en) * | 2005-03-30 | 2014-06-24 | Synopsys, Inc. | Schottky junction diode devices in CMOS with multiple wells |
| US20070001199A1 (en) * | 2005-06-30 | 2007-01-04 | Thunderbird Technologies, Inc. | Circuits and Integrated Circuits Including Field Effect Transistors Having Differing Body Effects |
| US7397072B2 (en) * | 2005-12-01 | 2008-07-08 | Board Of Regents, The University Of Texas System | Structure for and method of using a four terminal hybrid silicon/organic field effect sensor device |
| US20070134853A1 (en) * | 2005-12-09 | 2007-06-14 | Lite-On Semiconductor Corp. | Power semiconductor device having reduced on-resistance and method of manufacturing the same |
| US7790527B2 (en) * | 2006-02-03 | 2010-09-07 | International Business Machines Corporation | High-voltage silicon-on-insulator transistors and methods of manufacturing the same |
| US20090134476A1 (en) * | 2007-11-13 | 2009-05-28 | Thunderbird Technologies, Inc. | Low temperature coefficient field effect transistors and design and fabrication methods |
| DE102008007029B4 (de) * | 2008-01-31 | 2014-07-03 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Betrieb einer elektronischen Schaltung mit körpergesteuertem Doppelkanaltransistor und SRAM-Zelle mit körpergesteuertem Doppelkanaltransistor |
| US8350327B2 (en) * | 2008-08-29 | 2013-01-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | High voltage device with reduced leakage |
| US20100123206A1 (en) * | 2008-11-18 | 2010-05-20 | Thunderbird Technologies, Inc. | Methods of fabricating field effect transistors including titanium nitride gates over partially nitrided oxide and devices so fabricated |
| US8273617B2 (en) | 2009-09-30 | 2012-09-25 | Suvolta, Inc. | Electronic devices and systems, and methods for making and using the same |
| US8421162B2 (en) | 2009-09-30 | 2013-04-16 | Suvolta, Inc. | Advanced transistors with punch through suppression |
| FR2958779B1 (fr) * | 2010-04-07 | 2015-07-17 | Centre Nat Rech Scient | Point memoire ram a un transistor |
| US8530286B2 (en) | 2010-04-12 | 2013-09-10 | Suvolta, Inc. | Low power semiconductor transistor structure and method of fabrication thereof |
| US8569128B2 (en) | 2010-06-21 | 2013-10-29 | Suvolta, Inc. | Semiconductor structure and method of fabrication thereof with mixed metal types |
| US8759872B2 (en) | 2010-06-22 | 2014-06-24 | Suvolta, Inc. | Transistor with threshold voltage set notch and method of fabrication thereof |
| US8404551B2 (en) | 2010-12-03 | 2013-03-26 | Suvolta, Inc. | Source/drain extension control for advanced transistors |
| US8461875B1 (en) | 2011-02-18 | 2013-06-11 | Suvolta, Inc. | Digital circuits having improved transistors, and methods therefor |
| US8525271B2 (en) | 2011-03-03 | 2013-09-03 | Suvolta, Inc. | Semiconductor structure with improved channel stack and method for fabrication thereof |
| US8748270B1 (en) | 2011-03-30 | 2014-06-10 | Suvolta, Inc. | Process for manufacturing an improved analog transistor |
| US8999861B1 (en) | 2011-05-11 | 2015-04-07 | Suvolta, Inc. | Semiconductor structure with substitutional boron and method for fabrication thereof |
| US8796048B1 (en) | 2011-05-11 | 2014-08-05 | Suvolta, Inc. | Monitoring and measurement of thin film layers |
| US8811068B1 (en) | 2011-05-13 | 2014-08-19 | Suvolta, Inc. | Integrated circuit devices and methods |
| US8569156B1 (en) | 2011-05-16 | 2013-10-29 | Suvolta, Inc. | Reducing or eliminating pre-amorphization in transistor manufacture |
| US8735987B1 (en) | 2011-06-06 | 2014-05-27 | Suvolta, Inc. | CMOS gate stack structures and processes |
| US8995204B2 (en) | 2011-06-23 | 2015-03-31 | Suvolta, Inc. | Circuit devices and methods having adjustable transistor body bias |
| US8629016B1 (en) | 2011-07-26 | 2014-01-14 | Suvolta, Inc. | Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer |
| US8748986B1 (en) | 2011-08-05 | 2014-06-10 | Suvolta, Inc. | Electronic device with controlled threshold voltage |
| WO2013022753A2 (en) | 2011-08-05 | 2013-02-14 | Suvolta, Inc. | Semiconductor devices having fin structures and fabrication methods thereof |
| US8614128B1 (en) | 2011-08-23 | 2013-12-24 | Suvolta, Inc. | CMOS structures and processes based on selective thinning |
| US8645878B1 (en) | 2011-08-23 | 2014-02-04 | Suvolta, Inc. | Porting a circuit design from a first semiconductor process to a second semiconductor process |
| US8713511B1 (en) | 2011-09-16 | 2014-04-29 | Suvolta, Inc. | Tools and methods for yield-aware semiconductor manufacturing process target generation |
| US9236466B1 (en) | 2011-10-07 | 2016-01-12 | Mie Fujitsu Semiconductor Limited | Analog circuits having improved insulated gate transistors, and methods therefor |
| US8895327B1 (en) | 2011-12-09 | 2014-11-25 | Suvolta, Inc. | Tipless transistors, short-tip transistors, and methods and circuits therefor |
| US8819603B1 (en) | 2011-12-15 | 2014-08-26 | Suvolta, Inc. | Memory circuits and methods of making and designing the same |
| US8883600B1 (en) | 2011-12-22 | 2014-11-11 | Suvolta, Inc. | Transistor having reduced junction leakage and methods of forming thereof |
| US8599623B1 (en) | 2011-12-23 | 2013-12-03 | Suvolta, Inc. | Circuits and methods for measuring circuit elements in an integrated circuit device |
| US8970289B1 (en) | 2012-01-23 | 2015-03-03 | Suvolta, Inc. | Circuits and devices for generating bi-directional body bias voltages, and methods therefor |
| US8877619B1 (en) | 2012-01-23 | 2014-11-04 | Suvolta, Inc. | Process for manufacture of integrated circuits with different channel doping transistor architectures and devices therefrom |
| US9093550B1 (en) | 2012-01-31 | 2015-07-28 | Mie Fujitsu Semiconductor Limited | Integrated circuits having a plurality of high-K metal gate FETs with various combinations of channel foundation structure and gate stack structure and methods of making same |
| US9406567B1 (en) | 2012-02-28 | 2016-08-02 | Mie Fujitsu Semiconductor Limited | Method for fabricating multiple transistor devices on a substrate with varying threshold voltages |
| US8863064B1 (en) | 2012-03-23 | 2014-10-14 | Suvolta, Inc. | SRAM cell layout structure and devices therefrom |
| US9299698B2 (en) | 2012-06-27 | 2016-03-29 | Mie Fujitsu Semiconductor Limited | Semiconductor structure with multiple transistors having various threshold voltages |
| US8637955B1 (en) | 2012-08-31 | 2014-01-28 | Suvolta, Inc. | Semiconductor structure with reduced junction leakage and method of fabrication thereof |
| US9112057B1 (en) | 2012-09-18 | 2015-08-18 | Mie Fujitsu Semiconductor Limited | Semiconductor devices with dopant migration suppression and method of fabrication thereof |
| US9041126B2 (en) | 2012-09-21 | 2015-05-26 | Mie Fujitsu Semiconductor Limited | Deeply depleted MOS transistors having a screening layer and methods thereof |
| JP2016500927A (ja) | 2012-10-31 | 2016-01-14 | 三重富士通セミコンダクター株式会社 | 低変動トランジスタ・ペリフェラル回路を備えるdram型デバイス、及び関連する方法 |
| US8816754B1 (en) | 2012-11-02 | 2014-08-26 | Suvolta, Inc. | Body bias circuits and methods |
| US9093997B1 (en) | 2012-11-15 | 2015-07-28 | Mie Fujitsu Semiconductor Limited | Slew based process and bias monitors and related methods |
| US9070477B1 (en) | 2012-12-12 | 2015-06-30 | Mie Fujitsu Semiconductor Limited | Bit interleaved low voltage static random access memory (SRAM) and related methods |
| US9112484B1 (en) | 2012-12-20 | 2015-08-18 | Mie Fujitsu Semiconductor Limited | Integrated circuit process and bias monitors and related methods |
| US9268885B1 (en) | 2013-02-28 | 2016-02-23 | Mie Fujitsu Semiconductor Limited | Integrated circuit device methods and models with predicted device metric variations |
| US9299801B1 (en) | 2013-03-14 | 2016-03-29 | Mie Fujitsu Semiconductor Limited | Method for fabricating a transistor device with a tuned dopant profile |
| US9478571B1 (en) | 2013-05-24 | 2016-10-25 | Mie Fujitsu Semiconductor Limited | Buried channel deeply depleted channel transistor |
| US20150200270A1 (en) * | 2014-01-16 | 2015-07-16 | Globalfoundries Inc. | Field effect transistors for high-performance and low-power applications |
| US9710006B2 (en) | 2014-07-25 | 2017-07-18 | Mie Fujitsu Semiconductor Limited | Power up body bias circuits and methods |
| US9319013B2 (en) | 2014-08-19 | 2016-04-19 | Mie Fujitsu Semiconductor Limited | Operational amplifier input offset correction with transistor threshold voltage adjustment |
| DE102015110484B4 (de) * | 2015-06-30 | 2023-09-28 | Infineon Technologies Austria Ag | Halbleiterbauelemente und Verfahren zum Bilden eines Halbleiterbauelements |
| US12439663B2 (en) * | 2021-07-09 | 2025-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integration of low and high voltage devices on substrate |
| CN116632062A (zh) * | 2022-02-14 | 2023-08-22 | 联华电子股份有限公司 | 中压晶体管及其制作方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0024905B1 (en) * | 1979-08-25 | 1985-01-16 | Zaidan Hojin Handotai Kenkyu Shinkokai | Insulated-gate field-effect transistor |
| JPS5833870A (ja) * | 1981-08-24 | 1983-02-28 | Hitachi Ltd | 半導体装置 |
| JPS5955052A (ja) * | 1982-09-24 | 1984-03-29 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| NL8303441A (nl) * | 1983-10-07 | 1985-05-01 | Philips Nv | Geintegreerde schakeling met komplementaire veldeffekttransistors. |
| US4701775A (en) * | 1985-10-21 | 1987-10-20 | Motorola, Inc. | Buried n- channel implant for NMOS transistors |
| JPS62112376A (ja) * | 1985-11-12 | 1987-05-23 | Toshiba Corp | 半導体装置 |
| JPS62128175A (ja) * | 1985-11-29 | 1987-06-10 | Hitachi Ltd | 半導体装置 |
| DE3737144A1 (de) * | 1986-11-10 | 1988-05-11 | Hewlett Packard Co | Metalloxid-halbleiter-feldeffekttransistor (mosfet) und verfahren zu seiner herstellung |
| US4990974A (en) * | 1989-03-02 | 1991-02-05 | Thunderbird Technologies, Inc. | Fermi threshold field effect transistor |
| US5102811A (en) * | 1990-03-20 | 1992-04-07 | Texas Instruments Incorporated | High voltage bipolar transistor in BiCMOS |
| US5369295A (en) * | 1992-01-28 | 1994-11-29 | Thunderbird Technologies, Inc. | Fermi threshold field effect transistor with reduced gate and diffusion capacitance |
| JP2899122B2 (ja) * | 1991-03-18 | 1999-06-02 | キヤノン株式会社 | 絶縁ゲートトランジスタ及び半導体集積回路 |
| JPH05343666A (ja) * | 1991-08-30 | 1993-12-24 | Sgs Thomson Microelectron Inc | 集積回路トランジスタ |
| US5194923A (en) * | 1992-01-28 | 1993-03-16 | Thunderbird Technologies, Inc. | Fermi threshold field effect transistor with reduced gate and diffusion capacitance |
| JPH06196642A (ja) * | 1992-12-24 | 1994-07-15 | Kawasaki Steel Corp | 半導体装置及びその製造方法 |
| JPH0761072B2 (ja) * | 1993-02-26 | 1995-06-28 | 日本電気株式会社 | 衛星通信システム |
| US5463237A (en) * | 1993-11-04 | 1995-10-31 | Victor Company Of Japan, Ltd. | MOSFET device having depletion layer |
| JP2858622B2 (ja) * | 1993-11-24 | 1999-02-17 | 日本ビクター株式会社 | 半導体装置 |
-
1996
- 1996-02-07 US US08/597,711 patent/US5698884A/en not_active Expired - Lifetime
-
1997
- 1997-02-04 JP JP52873297A patent/JP4439593B2/ja not_active Expired - Fee Related
- 1997-02-04 WO PCT/US1997/002108 patent/WO1997029519A1/en not_active Ceased
- 1997-02-04 EP EP97907591A patent/EP0879482B1/en not_active Expired - Lifetime
- 1997-02-04 AU AU19558/97A patent/AU709509B2/en not_active Ceased
- 1997-02-04 DE DE69728858T patent/DE69728858T2/de not_active Expired - Lifetime
- 1997-02-04 KR KR10-1998-0705810A patent/KR100499308B1/ko not_active Expired - Fee Related
- 1997-07-29 US US08/902,150 patent/US5885876A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5885876A (en) | 1999-03-23 |
| EP0879482A1 (en) | 1998-11-25 |
| DE69728858T2 (de) | 2005-04-21 |
| WO1997029519A1 (en) | 1997-08-14 |
| EP0879482B1 (en) | 2004-04-28 |
| KR100499308B1 (ko) | 2005-11-09 |
| AU709509B2 (en) | 1999-09-02 |
| JP2000504881A (ja) | 2000-04-18 |
| AU1955897A (en) | 1997-08-28 |
| KR19990082088A (ko) | 1999-11-15 |
| US5698884A (en) | 1997-12-16 |
| DE69728858D1 (de) | 2004-06-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4439593B2 (ja) | フェルミしきい値型電界効果型トランジスタ及びその製造方法 | |
| KR100840630B1 (ko) | 트렌치 게이트 페르미-임계 전계 효과 트랜지스터 및 그제조 방법 | |
| US6017798A (en) | FET with stable threshold voltage and method of manufacturing the same | |
| JP5547361B2 (ja) | 埋込み軽ドープ・ドレイン領域を含む金属酸化膜半導体デバイス | |
| RU2245589C2 (ru) | Устройство полевого моп-транзистора и способ его изготовления | |
| US8865549B2 (en) | Recessed channel insulated-gate field effect transistor with self-aligned gate and increased channel length | |
| JP4338784B2 (ja) | 短チャネル・フェルミしきい値電界効果型トランジスタ | |
| JP5334351B2 (ja) | 改善された性能および信頼性を有する金属酸化物半導体デバイス | |
| US6313487B1 (en) | Vertical channel floating gate transistor having silicon germanium channel layer | |
| US8815690B2 (en) | Tunneling device and method for forming the same | |
| WO2012116529A1 (en) | Tunneling device and method for forming the same | |
| US6437406B1 (en) | Super-halo formation in FETs | |
| US7525138B2 (en) | JFET device with improved off-state leakage current and method of fabrication | |
| JP2002530873A (ja) | オフセット・ドレイン型フェルミ閾値電界効果トランジスタ | |
| US5432366A (en) | P-I-N MOSFET for ULSI applications | |
| US5899721A (en) | Method of based spacer formation for ultra-small sapcer geometries | |
| US6046471A (en) | Ultra shallow junction depth transistors | |
| CA2241684C (en) | Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same | |
| US6458664B2 (en) | Method for fabricating a field-effect transistor having an anti-punch-through implantation region | |
| JPS61259574A (ja) | ホツト電子の効果を低減する延長ドレイン構造 | |
| Lin et al. | A high-performance polysilicon thin-film transistor built on a trenched body | |
| JP2001057424A (ja) | 半導体集積回路装置およびその製造方法 | |
| JPWO2001082379A1 (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040123 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040123 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071211 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20080311 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20080428 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080530 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081021 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090116 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090707 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090713 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091208 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100106 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130115 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |